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Cure behavior of epoxy resin/CdS/2,4-EMI nanocomposites investigated by dynamic torsional vibration method (DTVM)

机译:动态扭转振动法(DTVM)研究环氧树脂/ CdS / 2,4-EMI纳米复合材料的固化行为

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摘要

Epoxy resin/CdS nanocomposite was prepared by a novel method and its cure behavior was investigated by the HLX-II Resin Curemeter based on the dynamic torsional vibration method (DTVM). The non-equilibrium thermodynamic fluctuation theory, the Avrami equation and the Flory’s gelation theory have been used to analysis the cure behavior of the composite systems with different CdS and cure agent loadings at various temperatures. The results show that the addition of CdS nanoparticles reduces the gel time t g , but has little effect on the mechanism of the cure reaction. The theoretical prediction is in good agreement with the experimental results. The Avrami exponent of n decreases a little when the temperature increases.
机译:采用新颖的方法制备了环氧树脂/ CdS纳米复合材料,并基于动态扭转振动法(DTVM),通过HLX-II树脂固化仪研究了其固化性能。非平衡热力学涨落理论,Avrami方程和Flory凝胶化理论已用于分析具有不同CdS和不同固化剂量的复合体系的固化行为。结果表明,添加CdS纳米粒子可缩短凝胶时间t g ,但对固化反应机理的影响很小。理论预测与实验结果吻合良好。当温度升高时,n的Avrami指数会降低一点。

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  • 来源
    《Polymer Bulletin》 |2006年第2期|219-230|共12页
  • 作者单位

    Department of Polymer Science and Engineering University of Science and Technology of China;

    Department of Polymer Science and Engineering University of Science and Technology of China;

    Department of Polymer Science and Engineering University of Science and Technology of China;

    Department of Polymer Science and Engineering University of Science and Technology of China;

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