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首页> 外文期刊>Polymer bulletin >Cure behavior of epoxy resin/CdS/2,4-EMI nanocomposites investigated by dynamic torsional vibration method(DTVM)
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Cure behavior of epoxy resin/CdS/2,4-EMI nanocomposites investigated by dynamic torsional vibration method(DTVM)

机译：动态扭转振动法研究环氧树脂/ CdS / 2,4-EMI纳米复合材料的固化行为

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摘要

Epoxy resin/CdS nanocomposite was prepared by a novel method and its cure behavior was investigated by the HLX-II Resin Curemeter based on the dynamic torsional vibration method (DTVM).The non-equilibrium thermodynamic fluctuation theory,the Avrami equation and the Flory's gelation theory have been used to analysis the cure behavior of the composite systems with different CdS and cure agent loadings at various temperatures.The results show that the addition of CdS nanoparticles reduces the gel time t_g,but has little effect on the mechanism of the cure reaction.The theoretical prediction is in good agreement with the experimental results.The Avrami exponent of n decreases a little when the temperature increases.
机译：以动态扭振法（DTVM）为基础，通过新型方法制备了环氧树脂/ CdS纳米复合材料，并通过HLX-II树脂固化仪研究了其固化行为。非平衡热力学涨落理论，Avrami方程和弗洛里凝胶化理论已被用于分析不同温度下不同CdS和固化剂量的复合体系的固化行为。结果表明，添加CdS纳米颗粒可缩短凝胶时间t_g，但对固化反应机理的影响很小。理论预测与实验结果吻合良好。随着温度的升高，n的Avrami指数略有下降。

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