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"The Effects of Water Soluble Paste Formulation on the Ball Attach and Ball Shear Failure" Authors: Li Tianpeng, Jorcelyn Tan Ying Ru, C. D. Breach and A. Hawkins; Abstract: Solder ball attach of two water-soluble solder pastes, a novel zero halogen material and a halogenated material, was compared in nitrogen and air atmospheres after reflow in a Malcom reflow simulator. Videos of the reflow process showed that both pastes reflowed well in nitrogen. After air reflow, the zero halogen paste exhibited good ball attach capability without defects and minimal degradation, while the halogenated paste showed head-in-pillow defects.
机译:“水溶性糊剂配方对球附着和球剪切破坏的影响”作者:李天鹏,乔瑟琳·谭英如,C.D。Breach和A.Hawkins;摘要:在Malcom回流模拟器中,在氮气和空气气氛中比较了两种水溶性焊膏(一种新型的零卤素材料和一种卤化材料)的焊球附着情况。回流过程的视频显示,两种焊膏在氮气中回流良好。空气回流后,零卤素糊剂表现出良好的球形附着能力,而没有缺陷且降解最小,而卤化糊剂表现出枕头缺陷。

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