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Setup, Procedures, and Patterns for CAF and ECM testing

机译：CAF和ECM测试的设置，过程和模式

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摘要

Dendrites, filaments, and migration: They sound like evil characters from the Lord of the Rings. Unfortunately, they do exist - in and on electronics products. And, as in the movie, as their presence grows, good parts fail. Engineers who hunt for these problems are often called wizards -among other things - and they gather in groups - IPC committee meetings - to decide the best course of action for rooting out these evils. Kidding aside, long-term reliability of electronics can be severely affected by these evils and the testing for their potential to exist is becoming widespread. As spacing and part sizes on PCBs decrease, requirements for conductive anodic filament (CAF) and electrochemical migration resistance (ECM) testing are becoming important. Unfortunately, procedures can be more magic than science: Current test methods do not fully describe the care necessary - and associated pitfalls - for testing for the presence of these evildoers. The methodology for these forms of electrochemical migration differ in both the test samples used for, and environmental conditions associated with, the testing: CAF test samples are geared to specifically look for failures that occur within the material, while dendrite detecting test samples identify failures that occur on the surface of the material.
机译：树突，细丝和迁移：它们听起来像是指环王中的邪恶人物。不幸的是，它们确实存在-电子产品中和电子产品上。而且，就像在电影中一样，随着它们的出现，良好的零件也会失效。寻找这些问题的工程师通常被称为向导-除其他外-他们聚集在一起-IPC委员会会议-决定消除这些弊端的最佳行动方案。顺便说一句，这些弊端会严重影响电子产品的长期可靠性，因此对它们存在的可能性的测试正在广泛进行。随着PCB上的间距和零件尺寸的减小，对导电阳极丝（CAF）和电化学迁移电阻（ECM）测试的要求变得越来越重要。不幸的是，程序比科学更具魔力：当前的测试方法不能完全描述测试这些邪恶分子的存在所必需的谨慎-以及相关的陷阱。这些形式的电化学迁移的方法在测试所用的测试样品以及与测试相关的环境条件上都不同：CAF测试样品专门用于查找材料内部发生的故障，而枝晶检测测试样品则可以识别出那些发生在材料表面。

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