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HDI PCBs Using Stacked Via Structures

机译：使用堆叠通孔结构的HDI PCB

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摘要

Conventional HDI PCBs have been widely used in such consumer products as cellular phones and video cameras. Now, as the trend in components is toward continual miniaturization and increased wiring density, HDI usage has expanded to infrastructure-type products such as base stations for cellular phones and also to fields that require high reliability. Thus, the demand for reliable and larger boards with HDI design is increasing. In the near future, HDI boards will be differentiated according to required quality and specifications for each application. To meet the market demand, a novel prepreg plating process has been developed. Conventional HDI boards experience several problems. First, when the HDI insulation layer contains only resins, the thermal expansion coefficient will be greater than that of a glass cloth insulation layer. Thus, problems in through-holes and microvias due to the thermal stress are more likely to occur.
机译：常规的HDI PCB已广泛用于蜂窝电话和摄像机等消费产品。现在，由于组件的趋势是朝着不断的小型化和增加的布线密度发展，HDI的使用已扩展到基础设施类型的产品，例如蜂窝电话的基站以及要求高可靠性的领域。因此，对于具有HDI设计的可靠且更大的板的需求正在增加。在不久的将来，HDI板将根据每种应用所需的质量和规格进行区分。为了满足市场需求，已经开发了新颖的预浸料镀覆工艺。常规的HDI板遇到几个问题。首先，当HDI绝缘层仅包含树脂时，热膨胀系数将大于玻璃布绝缘层的热膨胀系数。因此，由于热应力而导致的通孔和微孔中的问题更容易发生。

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