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Assessing the Reliability of PLATED VIAS

机译：评估PLATINA VIAS的可靠性

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摘要

Plated through-holes are key interconnects in multilayer PCBs. Arguably, PTHs are also the weakest link in an unassembled PCB. Their reduced reliability is caused by the high coefficient of thermal expansion of the laminate material in the thickness (y) direction. PTH failure due to thermo-mechanical stresses has been previously studied, with major emphasis focused on barrel cracking. What is the weakest link in a fully assembled electronics product? Traditionally, the second-level interconnects have been named; the solder joints between the PCB and the packaged components, especially area arrays such as BGAs. The effect of board thickness on the reliability of the PTH and the solder joints of a specific package has been documented (Figure 1). Specifically, the influence of board thickness on solder joint reliability tapers as the board reaches a certain stiffness level.
机译：镀通孔是多层PCB中的关键互连。可以说，PTH也是未组装PCB中最薄弱的环节。它们的降低的可靠性是由于层压材料在厚度（y）方向上的高热膨胀系数引起的。先前已经研究了由于热机械应力导致的PTH失效，其主要重点是桶破裂。完全组装的电子产品中最薄弱的环节是什么？传统上，第二层互连已被命名。 PCB和封装组件之间的焊点，尤其是BGA等面积阵列。电路板厚度对PTH可靠性和特定封装焊点的影响已被记录（图1）。具体而言，随着板达到一定的刚度水平，板厚度对焊点可靠性的影响逐渐减小。

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