Thermally Conductive Epoxy Used for Bonding, Potting and Molding

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Thermally Conductive Epoxy Used for Bonding, Potting and Molding

机译：用于粘合，灌封和模制的导热环氧树脂

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A two-component, aluminum-filled epoxy, Aremco-Bond 805 provides excellent adhesion to high-temperature plastics as well as glass, ceramic and high-expansion metals. Easily machined, drilled, tapped or polished, it is supplied in premeasured pint, quart, gallon and 5-gallon containers from stock.

机译：两组分铝填充环氧树脂Aremco-Bond 805对高温塑料以及玻璃，陶瓷和高膨胀金属具有出色的附着力。它易于机械加工，钻孔，攻丝或抛光，并以预先测量的品脱，夸脱，加仑和5加仑的容器提供现货。

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《Process Heating》 |2014年第1期|50-50|共1页
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1. High Thermal Conductive Epoxy Molding Compoundwith Thermal Conductive Pathway [J] . Jun Zeng, Renli Fu, Yuan Shen, Journal of Applied Polymer Science . 2009,第4期

机译：具有导热途径的高导热环氧树脂成型料
2. Thermally Conductive MgO-Filled Epoxy Molding Compounds [J] . Wereszczak A.A., Morrissey T.G., Volante C.N., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2013,第12期

机译：导热氧化镁填充环氧树脂模塑料
3. A Low-Viscousity,Highly Thermally Conductive Epoxy Molding Compound(EMC) [J] . Jong-Woo Bae, Wonho Kim, Seungchul Hwang, Macromolecular Research . 2004,第1期

机译：一种低粘度，高导热性的环氧模塑化合物（EMC）
4. Optimization of Epoxy Molding Compound to Enhance the Solder Joints Robustness during Thermal Cycling for A Clip Bond Power Package [C] . Zhiwen Li, Haibin Chen, Haibo Fan, International Conference on Electronic Packaging Technology . 2020

机译：环氧模塑料的优化，以提高夹式粘合功率封装热循环过程中焊点的坚固性
5. An experimental study of thermal effects on the vacuum assisted resin transfer molding process for manufacturing glass fiber/(epoxy-carbon nanofiber) composite. [D] . Clark, Robert L., III. 2010

机译：热效应对制备玻璃纤维/（环氧-碳纳米纤维）复合材料的真空辅助树脂传递模塑工艺影响的实验研究。
6. Thermal Conductive Composites Prepared by Addition of Several Ceramic Fillers to Thermally Cationic Curing Cycloaliphatic Epoxy Resins [O] . Isaac Isarn, Francesco Gamardella, Xavier Fernàndez-Francos, 2019

机译：通过在热阳离子固化环脂族环氧树脂中添加几种陶瓷填料制备的导热复合材料
7. Phase Structure and Thermal and Conductive Properties of Epoxy/Alumina Hybrids Filled with Conductive Filler [O] . Tomoyuki MATSUMURA, Ryuji TAKAHASHI, Kazuya NAGATA, 2001

机译：环氧/氧化铝杂种填充导电填料的相结构和导电性能
8. Thermally Conductive Potting Compounds for 3-D Welded Electronics [R] . Jansson, R. M. 1960

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Thermally Conductive Epoxy Used for Bonding, Potting and Molding

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