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首页> 外文期刊>Journal of Applied Polymer Science >High Thermal Conductive Epoxy Molding Compoundwith Thermal Conductive Pathway
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High Thermal Conductive Epoxy Molding Compoundwith Thermal Conductive Pathway

机译：具有导热途径的高导热环氧树脂成型料

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The epoxy molding compound (EMC) withthermal conductive pathways was developed by structuredesigning. Three kinds of EMCs with different thermal con-ductivities were used in this investigation, specifically ep-oxy filled with Si_3N_4, filled with hybrid Si_3N_4/Si0_2, andfilled with Si0_2.Improved thermal conductivity wasachieved by constructing thermal conductive pathwaysusing high thermal conductivity EMC (Si_3N_4) in low ther-mal conductivity EMC (Si0_2). The morphology and micro-structure of the top of EMC indicate that continuousnetwork is formed by the filler which anticipates heat con-ductivity. The highest thermal conductivity of the EMC was2.5 W/m K, reached when the volume fraction of EMC(Si_3N_4) is 80% (to compare with hybrid Si_3N_4/Si0_2filled-EMC, the content of total fillers in the EMC was kept at 60vol %). For a given volume fraction of EMC (Si_3
机译：通过结构设计开发了具有导热路径的环氧模塑化合物（EMC）。本研究使用三种不同热导率的EMC，特别是环氧填充Si_3N_4，混合Si_3N_4 / Si0_2并填充Si0_2。通过使用高导热率EMC（Si_3N_4 ）处于低热导率EMC（Si0_2）中。 EMC顶部的形貌和微观结构表明，连续网络由预期导热性的填料形成。 EMC的最高导热率为2.5 W / m K，EMC（Si_3N_4）的体积分数为80％时达到（与杂化Si_3N_4 / SiO_2填充的EMCC相比，EMC中总填料的含量保持在60vol％）。对于EMC的给定体积分数（Si_3

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