Curing: A Vital Step in IC Package Manufacturing

TY FEDAK; RONALD J. MOLNAR

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Curing: A Vital Step in IC Package Manufacturing

机译：固化：IC封装制造的重要一步

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摘要

Drying or curing of organic substrates, adhesives, encap-sulants, underfills, inks or coatings is one of the most critical processes in the manufacturing or assembly of advanced, as well as mature, semiconductor packages.

机译：有机基材，粘合剂，密封剂，底部填充剂，油墨或涂料的干燥或固化是先进或成熟的半导体封装制造或组装中最关键的过程之一。

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来源
《Process Heating》 |2005年第3期|p.37-41|共5页
作者
TY FEDAK; RONALD J. MOLNAR;
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作者单位

Thermal Product Solutions Inc.;

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原文格式 PDF
正文语种 eng
中图分类热力工程、热机;
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2. A clinical trial of Empress II porcelain inlays luted to vital teeth with a dual-curing adhesive system and a self-curing resin cement. [J] . Fabianelli A, Goracci C, Bertelli E, The journal of adhesive dentistry . 2006,第6期

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3. Factors contributing to the incompatibility between simplified-step adhesives and chemically-cured or dual-cured composites. Part I. Single-step self-etching adhesive. [J] . Tay FR, Pashley DH, Yiu CK, The journal of adhesive dentistry . 2003,第1期

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Curing: A Vital Step in IC Package Manufacturing

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