A Novel and Simple Creep Testing Method and Its Use in Measuring the Creep of Solder

Sha Wei

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A Novel and Simple Creep Testing Method and Its Use in Measuring the Creep of Solder

机译：一种新颖而简单的蠕变测试方法及其在焊料蠕变测试中的应用

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摘要

A simple creep testing method is presented which involves using coiled specimens. With this method, a single experiment can give all the data required for a plot of strain rate versus stress. The value of the stress-exponent of room temperature steady-state creep a Pb-61.5wt%Sn solder was measured in this way to be 1.06, as expected from a diffusion creep mechanism.

机译：提出了一种简单的蠕变测试方法，其中涉及使用盘绕试样。使用这种方法，一个实验就可以提供应变率与应力关系图所需的所有数据。如从扩散蠕变机理所预期的那样，以此方式测得的室温稳态蠕变Pb-61.5wt％Sn焊料的应力指数值为1.06。

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来源
《RARE METALS》 |1996年第2期|p.106-109|共4页
作者
Sha Wei;
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作者单位

Department of Civil Engineering, The Queen's University of Belfast, U. K.;

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原文格式 PDF
正文语种 eng
中图分类金属材料;有色金属及其合金;
关键词
characterization methods; mechanical properties; metals and alloys;

机译：表征方法;力学性能;金属和合金;

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专利

1. A Novel and Simple Creep Testing Method and Its Use in Measuring the Creep of Solder [J] . Sha Wei RARE METALS . 1996,第2期

机译：一种新颖而简单的蠕变测试方法及其在焊料蠕变测试中的应用
2. Evaluation of creep properties for aged Pb-free solder joints/(Ni-P/Au) UBM with small addition Cu using shear punch creep testing method [J] . Engineering failure analysis . 2020,第期

机译：使用剪切冲击蠕变试验方法评估老年Pb的无铅焊点/（Ni-P / Au）UBM的蠕变性能
3. Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part II. Creep Behavior of Bulk Solder and Solder/Copper Joints [J] . R.S. Sidhu, X. Deng, N. Chawla Metallurgical and Materials Transactions A . 2008,第2期

机译：无铅富锡锡合金的微观结构表征和蠕变行为：第二部分。大块焊锡和焊锡/铜接头的蠕变行为
4. Characterization of the creep constitutive behavior of SnAgCu solder in flip chip joints from the indentation creep testing [C] . Niu Xiaoyan, Shu Xuefeng 2010 11th International Conference on Electronic Packaging Technology High Density Packaging . 2010

机译：通过压痕蠕变测试表征SnAgCu焊料在倒装芯片接头中的蠕变本构行为
5. Development of a Spherical Micro-Indentation Test Methodology for Creep Analysis and On-set of Tertiary Creep for Solder Alloys [D] . Otunyo, Dumbi Azubuike. 2017

机译：球形微压痕测试方法的发展，用于蠕变分析和锡合金的第三蠕变开始
6. Limit case analysis of the stable indenter velocity method for obtaining creep stress exponents from constant load indentation creep tests [O] . J. Campbell, J. Dean, T. W. Clyne -1

机译：从恒定载荷压痕蠕变测试获得蠕变应力指数的稳定压头速度方法的极限情况分析
7. Development of a Spherical Micro-Indentation Test Methodology for Creep Analysis and On-set of Tertiary Creep for Solder Alloys [O] . Dumbi Azubuike Otunyo -1

机译：用于蠕变分析和焊料合金三级蠕变的球面微压痕试验方法的发展
8. Creep Tests on some Cast Magnesium Alloys PART I Creep Tests of Ⅰ50 hours Duration at ⅠOO deg., Ⅰ50 deg, and 200 deg. C. on some Cast Magnesium Alloys PART II Comparison of the Creep Properties of Three Cast Magnesium AlloysnBased on Tests of Ⅰ,ooo hours Duration PART III Effect of Various Heat Treatments on the Short-time Creep Behaviour at 3 ton/sq. in., 150 deg. C, of Four Cast Magnesium Alloys [R] . A. E. JOHNSON, H.J. TAPSELL, H. D. CONWAY 1951

机译：一些铸造镁合金的蠕变试验第一部分Ⅰ00度，Ⅰ50度和200度的Ⅰ50小时的蠕变试验。 C.对某些铸造镁合金的研究第二部分三种铸造镁合金的蠕变性能的比较基于Ⅰ，0小时的试验持续时间第三部分各种热处理对3吨/平方米短时蠕变行为的影响。在。，150度。 C，四铸镁合金

A Novel and Simple Creep Testing Method and Its Use in Measuring the Creep of Solder

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