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Sensitivity Improvement of a 2D MEMS Thermal Wind Sensor for Low-Power Applications

机译:低功耗应用中2D MEMS热风传感器的灵敏度提高

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摘要

In this paper, we report a novel and low-cost method to improve the sensitivity of a low-power 2D microelectromechanical systems thermal wind sensor by using HF wet etching. After wet etching, the thickness of the glass substrate decreases, so that the sensor’s thermal vias become more exposed to the wind. As a result, the conductive heat transfer is weakened and the convective heat transfer is enhanced in sensor operation. Finite-element method simulations verify this analysis. Moreover, the sensor chips with different lengths of silicon vias above the substrate are successfully fabricated and tested. Measurement results show that the wet etching has no influence on the metal film sensing and heating elements of the sensor. Besides, before and after wet etching for 7 and 14 min, at the wind speed of 5 m/s, the measured sensitivities of the sensor with a total power consumption of 24.5 mW are 77.2, 98.6, and 164.1 mK/(m/s). Measurement results also show that the improved sensitivity of the sensor chip can provide a more accurate measurement in wind speed but has little effect on the wind direction measurement. Instead, the accuracy of wind direction measurement is mainly related to the structural and thermal symmetries of the wind sensor. After compensation, the proposed thermal wind sensor can detect the wind direction in a full range of 360° with an mean error of 2.3° and a maximum error of 6°.
机译:在本文中,我们报告了一种新颖且低成本的方法,该方法通过使用HF湿法蚀刻来提高低功耗2D微机电系统热风传感器的灵敏度。湿蚀刻后,玻璃基板的厚度减小,因此传感器的热过孔更加暴露在风中。结果,在传感器操作中传导热传递被削弱并且对流热传递被增强。有限元方法仿真验证了这一分析。而且,成功制造并测试了在衬底上方具有不同硅通孔长度的传感器芯片。测量结果表明,湿法刻蚀对传感器的金属膜感应和加热元件没有影响。此外,在湿蚀刻7分钟和14分钟之前和之后,在5 m / s的风速下,总功耗为24.5 mW的传感器测得的灵敏度为77.2、98.6和164.1 mK /(m / s )。测量结果还表明,传感器芯片灵敏度的提高可以提供更精确的风速测量,但对风向测量的影响很小。相反,风向测量的准确性主要与风传感器的结构和热对称性有关。经过补偿后,建议的热风传感器可以在360°的整个范围内检测风向,平均误差为2.3°,最大误差为6°。

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