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首页> 外文期刊>Solid-State Circuits, IEEE Journal of >A 61-GHz SiGe Transceiver Frontend for Energy and Data Transmission of Passive RFID Single-Chip Tags With Integrated Antennas
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A 61-GHz SiGe Transceiver Frontend for Energy and Data Transmission of Passive RFID Single-Chip Tags With Integrated Antennas

机译:用于集成天线的无源RFID单芯片标签的能量和数据传输的61 GHz SiGe收发器前端

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摘要

This paper presents SiGe-based transmitter and receiver chips for a radio frequency identification (RFID) frontend in the 61-GHz industrial, scientific, and medical (ISM) frequency band. The chips are fabricated in a modern 130-nm SiGe BiCMOS technology with HBTs offering ann$f_{T}$nof 250 GHz andn$f_{mathrm{max}}$nof 370 GHz. The presented transmitter consists of a fundamental voltage-controlled oscillator (VCO), a power amplifier (PA), lumped element Wilkinson power dividers, and a static divide-by-16 chain for stabilization within a phase-locked loop (PLL). Two variants of the transmitter are fabricated with supply voltages of 3.3 and 5 V, respectively. The transmitters are designed to provide an efficient signal source to supply a passive RFID tag with the maximum allowed 20-dBm effective isotropic radiated power (EIRP) for short-range devices. The 3.3-V transmitter chip achieves a peak output power of 17 dBm, PAEnPAnof 18.6% and dc-to-RF efficiency of 12.9% (excluding the divider). At 61 GHz, a phase noise of −102 dBc/Hz at 1 MHz offset is achieved. The power consumption for the 5- and 3.3-V transmitter chips is 710 and 482 mW, respectively. The receiver chip is implemented as two Gilbert cell mixers in-phase quadrature configuration to compensate for destructive interference that may be caused by varying distance between reader and tag.
机译:本文介绍了基于SiGe的发送器和接收器芯片,用于61 GHz工业,科学和医学(ISM)频段的射频识别(RFID)前端。该芯片采用具有HBT的现代130纳米SiGe BiCMOS技术制造,可提供ann $ f_ {T} $ nof 250 GHz andn $ f_ {mathrm {max}} $ n 370 GHz。提出的变送器包括一个基本压控振荡器(VCO),一个功率放大器(PA),集总元件Wilkinson功率分配器和一个静态16分频链,用于在锁相环(PLL)内实现稳定。变送器的两个变体分别采用3.3 V和5 V的供电电压制造。发射器旨在提供有效的信号源,为无源RFID标签提供短距离设备允许的最大20dBm有效各向同性辐射功率(EIRP)。 3.3 V发射器芯片可实现17 dBm的峰值输出功率,PAEn PAn为18.6%,DC-RF效率为12.9%(不包括分压器)。在61 GHz处,在1 MHz偏移处实现了-102 dBc / Hz的相位噪声。 5 V和3.3 V发送器芯片的功耗分别为710 mW和482 mW。接收器芯片被实现为两个吉尔伯特单元混频器同相正交配置,以补偿由读取器和标签之间的距离变化引起的破坏性干扰。

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