Automation for 300mm fabs absolutely requires comprehensive attention to the interrelationships between the four levels of automation: FOUPs and wafer-handling automation, tool frontend automation, intrabay automation, and interbay automation. The complexity of the manufacturing sequence continues to grow at a rapid pace, meaning more layers, more vertical circuit integration, and the need for faster feedback from metrology measurement to provide real-time process feed-forward and feed-backward process control.
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