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Predictive modeling of electromechanical impedance spectroscopy for composite materials

机译：复合材料机电阻抗谱的预测建模

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摘要

The advancement of composite materials in aircraft structures has led to an increased need for effective structural health monitoring technologies that are able to detect and assess damage present in composite structures. The study presented in this article is interested in understanding self-sensing piezoelectric wafer sensors to conduct electromechanical impedance spectroscopy in glass fiber reinforced polymer composite to perform structural health monitoring. For this objective, multi-physics-based finite element method is used to model the electromechanical behavior of a free piezoelectric wafer active sensor and its interaction with the host structure on which it is bonded. The multi-physics-based modeling permits the input and output variables to be expressed directly in electric terms, while the two-way electromechanical conversion is done internally in the multi-physics-based finite element method formulation. The impedance responses are also studied in conditions when the sensor bonding layer is subject to degradation and when the sensor itself is subjected to breakage, respectively. To reach the goal of using the electromechanical impedance spectroscopy approach to detect damage, several damage models are generated on simplified orthotropic structure and laminated glass fiber reinforced polymer structures. The effects of the modeling are carefully studied through experimental validation. A good match has been observed for low and high frequencies.
机译：飞机结构中复合材料的进步导致对能够检测和评估复合结构中存在的损坏的有效结构健康监测技术的需求日益增长。本文提出的研究有兴趣了解自感应压电晶片传感器，以在玻璃纤维增​​强的聚合物复合材料中进行机电阻抗谱，以进行结构健康监测。为此，使用基于多物理场的有限元方法来模拟自由压电晶片有源传感器的机电行为及其与键合主体结构的相互作用。基于多物理场的建模允许直接用电学术语表示输入和输出变量，而双向机电转换是在基于多物理场的有限元方法公式化内部完成的。还分别在传感器结合层退化和传感器本身受到破坏的条件下研究阻抗响应。为了达到使用机电阻抗谱法检测损坏的目的，在简化的正交各向异性结构和层压玻璃纤维增​​强的聚合物结构上生成了几种损坏模型。通过实验验证仔细研究了建模的效果。已经观察到低频和高频的良好匹配。

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