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首页> 外文期刊>Superlattices and microstructures >Analog and radio-frequency (RF) performance evaluation of fully-depleted (FD) recessed-source/drain (Re-S/D) SOI MOSFETs
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Analog and radio-frequency (RF) performance evaluation of fully-depleted (FD) recessed-source/drain (Re-S/D) SOI MOSFETs

机译:完全耗尽(FD)隐式源/漏(Re-S / D)SOI MOSFET的模拟和射频(RF)性能评估

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摘要

Ultrathin-body (UTB) SOI MOSFETs, which possess excellent short-channel effect immunity and high current on-off ratio, are expected to put back the conventional MOSFETs in high performance digital integrated circuits by the end of year 2014 to continue the current scaling trend. In this paper, targeting systems-on-a-chip (SOC) applications, a simulation based extensive study is carried out to evaluate the analog and RF performance of source/drain and gate engineered ultrathin body SOI MOSFETs, as both the digital and analog performance of the device must be excellent for SOC applications. The performance evaluation has been done in terms of device parameters like device capacitances (C_(gs) and C_(gd)), drain current (I_d), transconductance (g_m), transconductance generation efficiency (g_m/I_d), intrinsic gain (g_m/g_d), cut-off frequency (f_T) and the maximum frequency of oscillation (f_(max)). The RF figures-of-merit (FoM) i.e., f_T and f_(max) have been determined by using H and Y parameters obtained from high frequency simulation of the structure. The numerical simulation is performed using ATLAS™, a 2-D device simulator from SILVACO Inc.
机译:具有出色的短沟道效应抗扰性和高电流开/关比的超薄体(SOB)SOI MOSFET有望在2014年底之前退回高性能数字集成电路中的常规MOSFET,以继续保持电流规模趋势。本文针对片上系统(SOC)应用,进行了基于仿真的广泛研究,以评估源极/漏极和栅极工程超薄体SOI MOSFET的模拟和RF性能,包括数字和模拟该器件的性能对于SOC应用必须非常出色。已经根据器件参数进行了性能评估,例如器件电容(C_(gs)和C_(gd)),漏极电流(I_d),跨导(g_m),跨导生成效率(g_m / I_d),固有增益(g_m) / g_d),截止频率(f_T)和最大振荡频率(f_(max))。 RF品质因数(FoM),即f_T和f_(max)已通过使用从结构的高频模拟获得的H和Y参数确定。使用SILVACO Inc.的2-D设备模拟器ATLAS™进行数值模拟。

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