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Investigation into the effects of magnetic agitation and pulsed current on the development of Sn-Cu alloy electrodeposits

机译：磁搅拌和脉冲电流对Sn-Cu合金电沉积发展的影响研究

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Sn-Cu alloy electrodeposits have found a wide range of applications in the electronics, automotive and aerospace industries. In the current research, the electrodeposition of Sn-Cu alloy coatings produced from an electrolyte based on fluoroboric acids was thoroughly studied. The cathode current density was found to have a significant impact on the appearance and the surface morphology of Sn-Cu alloy electrodeposits. Our experimental results suggested that deposition current density, magnetic agitation and pulsed current parameters (pulse frequency and duty cycle) were all found to be crucial factors significantly affecting the chemical composition of the Sn-Cu alloy electrodeposits. In addition, the employment of pulsed current techniques significantly improved the edge effect and the surface roughness. Whisker growth on the Sn-Cu alloy electrodeposits was assessed. All the samples subjected to different electroplating condition were prone to develop Sn whiskers after a few weeks of storage at room temperature.
机译：Sn-Cu合金电沉积已在电子，汽车和航空航天工业中找到了广泛的应用。在当前的研究中，对由基于氟硼酸的电解质生产的Sn-Cu合金涂层的电沉积进行了深入研究。发现阴极电流密度对Sn-Cu合金电沉积的外观和表面形态具有显着影响。我们的实验结果表明，沉积电流密度，磁搅拌和脉冲电流参数（脉冲频率和占空比）都被认为是显着影响Sn-Cu合金电沉积化学成分的关键因素。另外，采用脉冲电流技术可显着改善边缘效应和表面粗糙度。评估了Sn-Cu合金电沉积层上的晶须生长。在室温下存放数周后，所有经受了不同电镀条件的样品都容易产生锡晶须。

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