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首页> 外文期刊>Thin Solid Films >Effects of deposition conditions of the Al film in Al/glass specimens and annealing conditions on internal stresses and hillock formations
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Effects of deposition conditions of the Al film in Al/glass specimens and annealing conditions on internal stresses and hillock formations

机译：铝/玻璃样品中铝膜的沉积条件和退火条件对内应力和小丘形成的影响

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摘要

In the present study, 25 kinds of specimen with five Al-film thicknesses were prepared to investigate the relation between the internal stress formed during the annealing process and the hillocks. In the preparation of specimens, the governing factors including deposition conditions, annealing temperature, and annealing time, were arranged following the orthogonal table of five-level and six-factorial (L_(25)(5~6)) design. Stoney's formula is applied to describe the internal stresses before and after annealing (σ_0 and σ_f), respectively. The internal stress arising during the annealing process (σ_(an)) is evaluated using the model developed by Flinn et al. [1]. Then, the response surface methodology (RSM) is used to express the three stress parameters in terms of influential factors. The incipient σ_(an) value for hillocks appearing in the specimens was found to be between - 28.7 Mpa and - 32 Mpa in a compressive form. The annealing temperature, time, and Al-film thickness are the three major factors, affecting internal stress σ_(an). An increase in the annealing time reduces the tensile stress or increases the compressive stress, or both. The tensile stress decreases and the compressive stress increases during the annealing process with increasing Al film thickness and annealing temperature. The number of hillocks formed in a unit of area is linearly proportional to both σ_(an) and (σ_f- σ_(an)).
机译：在本研究中，准备了25种具有5个铝膜厚度的试样，以研究退火过程中形成的内应力与小丘之间的关系。在制备样品时，遵循五级六因子设计（L_（25）（5〜6））的正交表，安排了沉积条件，退火温度和退火时间等控制因素。应用Stoney公式描述退火前后的内部应力（σ_0和σ_f）。使用Flinn等人开发的模型评估退火过程中产生的内部应力（σ_（an））。 [1]。然后，使用响应面方法（RSM）根据影响因素来表达三个应力参数。发现样品中出现的小丘的初始σ_（an）值处于压缩形式-28.7 Mpa和-32 Mpa之间。退火温度，时间和铝膜厚度是影响内部应力σ_（an）的三个主要因素。退火时间的增加减小了拉应力或增大了压应力，或两者兼而有之。随着Al膜厚度和退火温度的增加，在退火过程中拉伸应力减小而压缩应力增大。以面积为单位形成的小丘的数量与σ_（an）和（σ_f-σ_（an））都成线性比例。

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  • 来源
    《Thin Solid Films》 |2012年第16期|p.5353-5360|共8页
  • 作者

    Ming Tsung Kao; Jen Fin Lin;

  • 作者单位

    Department of Mechanical Engineering, National Cheng Kung University, Tainan City, 701, Taiwan;

    Department of Mechanical Engineering, National Cheng Kung University, Tainan City, 701, Taiwan Center for Micro/Nano Science and Technology National Cheng Kung University, Tainan City, 701, Taiwan;

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  • 原文格式 PDF
  • 正文语种 eng
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  • 关键词

    hillock; stress; microstructure; aluminum film;

    机译：岗;强调;微观结构铝膜;

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