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Electronic properties of low temperature epitaxial silicon thin film photovoltaic devices grown by HWCVD

机译:HWCVD生长的低温外延硅薄膜光伏器件的电子性能

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This study addresses the correlation of the electrical, surface, and structural evolution of HWCVD crystalline Si thin films with temperature, thickness, and hydrogen dilution. Scanning electron microscopy and atomic force microscopy reveal an increase with surface roughness with hydrogen dilution, as expected, while showing increasing surface roughness with substrate temperature, in contrast to previous studies of crystalline Si growth. This suggests that H desorption enables more contaminant absorption of the growing surface with increasing temperature, in turn increasing roughness. The open-circuit voltage of these films is shown to increase significantly over time, ~ 50 mV over one week, due to the decrease in surface recombination velocity associated with the growth of a native oxide layer. This indicates the importance of post-deposition treatments for surface passivation.
机译:这项研究解决了HWCVD晶体Si薄膜的电学,表面和结构演变与温度,厚度和氢稀释之间的关系。与以前的晶体硅生长研究相反,扫描电子显微镜和原子力显微镜显示出随着氢稀释表面粗糙度的增加,正如预期的那样,而表面粗糙度随衬底温度的增加而增加。这表明,随着温度的升高,H解吸能够使生长表面更多地吸收污染物,从而增加粗糙度。这些薄膜的开路电压显示随着时间的推移显着增加,在一周内达到〜50 mV,这是由于与天然氧化物层的生长相关的表面复合速度的降低。这表明沉积后处理对于表面钝化的重要性。

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