• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Thin Solid Films >Residual stress and thermal stress observation in thin copper films
【24h】

Residual stress and thermal stress observation in thin copper films

机译：铜薄膜中残余应力和热应力的观察

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Internal stresses in thin copper films with or without passivation were investigated by the diffraction method using an in-lab X-ray apparatus and a synchrotron radiation system. The in-lab X-ray stress equipment primarily measures the stresses in films thicker than 100 nm, whereas the synchrotron radiation system can measure stresses in films as thin as 8 nm. The residual stresses in the copper films were tensile in all cases. Thermal stress development was investigated in the heating and cooling processes. In the case of thick films, the internal stress decreased to the compressive side in an early stage of the heating process followed by non-linear behavior. In the cooling stage, the stresses in the film changed to tensile and increased to the final state at room temperature. The stress difference between the heating and cooling cycle was shown as a hysteresis loop in thick films. A thin film exhibits neither hysteresis loop nor a non-linear relation in a thermal stress change during a thermal cycle.
机译：使用实验室内X射线仪和同步辐射系统，通过衍射法研究了钝化或不钝化铜薄膜中的内应力。实验室内的X射线应力设备主要测量厚于100 nm的薄膜中的应力，而同步辐射系统可以测量薄至8 nm的薄膜中的应力。在所有情况下，铜膜中的残余应力均为拉伸应力。在加热和冷却过程中研究了热应力的发展。在厚膜的情况下，内部应力在加热过程的早期减小到压缩侧，随后出现非线性行为。在冷却阶段，薄膜中的应力变为拉伸应力，并在室温下增加到最终状态。加热和冷却循环之间的应力差显示为厚膜中的磁滞回线。薄膜在热循环期间的热应力变化中既不表现出磁滞回线，也不表现出非线性关系。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号