Residual Stress and In-situ Thermal Stress Measurements of Copper Films on Glass Substrate

Takao HANABUSA; Masayuki NISHIDA

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Residual Stress and In-situ Thermal Stress Measurements of Copper Films on Glass Substrate

机译：玻璃基板上铜膜的残余应力和原位热应力测量

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The present study investigates the behavior of residual stress and thermal stress in thin copper films with X-rays. The copper films were deposited on a glass substrate by radio frequency (RF) sputtering. In-situ thermal stress measurement was also made on copper films during heat cycles. The residual stress of as-deposited state was tensile regardless of the conditions of film preparation. Early in the cooling stage, thermal stress behaves in an elastic manner so as to reduce the tensile stress until it stabilizes close to zero. In the cooling stage, little increase in the thermal stress was observed above 100 deg C and the hysteresis of thermal cycle was very small.

机译：本研究利用X射线研究铜薄膜中的残余应力和热应力行为。通过射频（RF）溅射将铜膜沉积在玻璃基板上。在热循环过程中，还对铜膜进行了原位热应力测量。不论成膜条件如何，沉积状态的残余应力均为拉伸应力。在冷却阶段的早期，热应力以弹性方式起作用，以减小拉应力，直到其稳定到接近零为止。在冷却阶段，在100℃以上观察到热应力几乎没有增加，并且热循环的磁滞很小。

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《Materials Science Research International》 |2001年第1期|共7页
作者
Takao HANABUSA; Masayuki NISHIDA;
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正文语种 eng
中图分类工程材料一般性问题;
关键词
Cu film; residual stress; in-situ thermal stress; X-ray stress measurement;

机译：铜膜;残余应力;原位热应力;X射线应力测量;

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1. Residual Stress and In-situ Thermal Stress Measurements of Copper Films on Glass Substrate [J] . Takao HANABUSA, Masayuki NISHIDA Materials Science Research International . 2001,第1期

机译：玻璃基板上铜膜的残余应力和原位热应力测量
2. Residual stress and structural characteristics in Ti and Cu sputtered films on glass substrates at different substrate temperatures and film thickness [J] . Savaloni H, Taherizadeh A, Zendehnam A Physica, B. Condensed Matter . 2004,第1a4期

机译：不同基板温度和膜厚下玻璃基板上Ti和Cu溅射膜的残余应力和结构特征
3. Residual stress and thermal stress observation in thin copper films [J] . Takao Hanabusa, Kazuya Kusaka, Osami Sakata Thin Solid Films . 2004,第1a2期

机译：铜薄膜中残余应力和热应力的观察
4. In-situ measurements of internal stresses in copper thin films during thermal cycling using synchrotron X-rays [C] . Tanaka K., Akiniwa Y. Micro-Nanomechatronics and Human Science, 2004 and The Fourth Symposium Micro-Nanomechatronics for Information-Based Society, 2004 . 2004

机译：使用同步加速器X射线在热循环过程中原位测量铜薄膜中的内部应力
5. Optical interferometric measurement of in-plane residual stresses in silicon dioxide films on silicon substrates. [D] . Ghaffari, Kasra. 1995

机译：光学干涉测量法在硅基板上的二氧化硅膜中的平面内残余应力。
6. Using Digital Image Correlation on SEM Images of Strain Field after Ion Beam Milling for the Residual Stress Measurement of Thin Films [O] . Terry Yuan-Fang Chen, Yun-Chia Chou, Zhao-Ying Wang, 2020

机译：利用离子束铣削后的应变场SEM图像上的数字图像相关性测量薄膜的残余应力
7. Comparison of the residual stress in TiNx films as determined by substrate deflection and X-ray stress measurement. [O] . Norihide NISHIDA, Mitsumasa OKADA, Kazuo HONDA, 1989

机译：基材偏转和X射线应力测量确定的锡膜残余应力的比较。
8. Effect of Residual Stress and Adhesion on the Hardness of Copper Films Depositedon Silicon [R] . LaFontaine, W. R., Yost, B., Li, C. Y. 1990

机译：残余应力和粘附力对硅沉积铜薄膜硬度的影响

Residual Stress and In-situ Thermal Stress Measurements of Copper Films on Glass Substrate

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