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IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
召开年:
2019
召开地:
Las Vegas(US)
出版时间:
-
会议文集:
-
会议论文
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1.
Mechanical Behavior Evolution of SAC305 Lead Free Solder Joints under Thermal Cycling
机译:
SAC305无铅焊点在热循环下的力学行为演变
作者:
Abdullah Fahim
;
Kamrul Hasan
;
Sudan Ahmed
;
Jeffrey C. Suhling
;
Pradeep Lall
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cracks;
creep;
electronics packaging;
fatigue;
hardness;
nanoindentation;
optical microscopy;
scanning electron microscopy;
soldering;
solders;
thermal expansion;
2.
Practical Thermal Modeling of Planar Magnetic Component devices
机译:
平面磁性组件设备的实用热建模
作者:
Valentin Bissuel
;
Eric Monier-Vinard
;
Lorenzo Codecasa
;
Nhat-Minh Nguyen
;
Arnaud Mahé
;
Olivier Daniel
;
Najib Laraqi
;
Vincenzo DAlessandro
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
magnetic cores;
printed circuits;
thermal management (packaging);
thermal stresses;
3.
Thermal Characterization of Field Plated AlGaN/GaN HEMTs
机译:
场镀AlGaN / GaN HEMT的热表征
作者:
Canberk Dundar
;
Nazli Donmezer
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
aluminium compounds;
gallium compounds;
high electron mobility transistors;
III-V semiconductors;
infrared imaging;
numerical analysis;
semiconductor device reliability;
temperature measurement;
wide band gap semiconductors;
4.
Thermal-Electric Transient analysis for Metal Line under High Frequency Pulse Direct Current
机译:
高频脉冲直流电对金属线的热电瞬态分析
作者:
Haojun Zhang
;
Tian Shen
;
Sing Hui Yap
;
Kristina Young-Fisher
;
Patrick Justison
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
electromigration;
finite element analysis;
integrated circuit reliability;
transient analysis;
waveform generators;
5.
Kapitza Resistance at the Two-Dimensional Electron Gas Interface
机译:
二维电子气界面的Kapitza电阻
作者:
Adam A. Wilson
;
Nicholas R. Jankowski
;
Franklin Nouketcha
;
Randy Tompkins
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
aluminium compounds;
gallium compounds;
high electron mobility transistors;
III-V semiconductors;
Kapitza resistance;
thermal resistance;
two-dimensional electron gas;
wide band gap semiconductors;
6.
Thermal Management of Outdoor Digital Displays - A Review
机译:
户外数字显示器的热管理-综述
作者:
Yogendra Joshi
;
J. Michael Brown
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
light emitting diodes;
liquid crystal displays;
reviews;
thermal management (packaging);
7.
Effect of Design Variables and System-Level Constraints on Heat Pipes Heatsink Performance: Part I - Component Materials and Heat Pipe Design Features
机译:
设计变量和系统级约束对热管散热器性能的影响:第一部分-组件材料和热管设计特征
作者:
Valenzuela G. Felipe
;
Milnes P. David
;
Michael J. Ellsworth
;
Brian Werneke
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
design engineering;
heat pipes;
heat sinks;
numerical analysis;
thermal conductivity;
thermal resistance;
8.
Effect of Design Variables and System-Level Constraints on Heat Pipes Heatsink Performance: Part II - Heat Pipes Staggering and Non-Uniform In-Server Conditions
机译:
设计变量和系统级约束对热管散热器性能的影响:第二部分-热管错开和服务器内非均匀条件
作者:
Valenzuela G. Felipe
;
Milnes P. David
;
Michael J. Ellsworth
;
Brian Werneke
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
confined flow;
cooling;
flow simulation;
heat pipes;
heat sinks;
numerical analysis;
optimisation;
pipe flow;
thermal management (packaging);
9.
A Novel Biomimetic Flapping Fan for Electronics Cooling
机译:
用于电子冷却的新型仿生拍动风扇
作者:
Jingru Benner
;
Mehdi Mortazavi
;
Anthony D. Santamaria
;
Shun Su
;
Tony Nguyen
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
aerospace components;
bending;
biomimetics;
cameras;
cooling;
fans;
flow measurement;
heat sinks;
piezoelectric actuators;
10.
Dynamic Radiative Thermal Management by Crumpled Graphene
机译:
皱纹石墨烯的动态辐射热管理
作者:
Anirudh Krishna
;
Jin Myung Kim
;
Juyoung Leem
;
Michael Cai Wang
;
SungWoo Nam
;
Jaeho Lee
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
emissivity;
finite difference time-domain analysis;
graphene;
heat radiation;
heat transfer;
infrared spectra;
light propagation;
reflectivity;
surface morphology;
temperature control;
thermal analysis;
thermal conductivity;
thermal insulating materials;
therm;
11.
A Novel Fanless Energy Efficient Edge Computing System Architecture and Engineering Practice for Baidu PCDN Application
机译:
百度PCDN应用的新型无风扇节能边缘计算系统架构与工程实践
作者:
Dechao Kong
;
Zhenghui Wu
;
Qikang Fu
;
Huajian Zhang
;
Ning Liu
;
Jun Zhang
;
Yuyang Xia
;
Jing Liu
;
Nishi Ahuja
;
Carrie Chen
;
Ken Zhang
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cloud computing;
computer centres;
energy conservation;
Internet of Things;
mobile computing;
power aware computing;
software architecture;
12.
Experimental Investigation of Ionic Wind Cooling In Plate Fin Heatsinks and Needle Electrode Arrangements
机译:
板翅式散热器和针电极装置中离子风冷的实验研究
作者:
N. Baudin
;
J. McEvoy
;
M. Rouzes
;
T. Persoons
;
A.J. Robinson
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
buoyancy;
convection;
cooling;
electric fields;
electrodes;
heat sinks;
heat transfer;
jets;
needles;
plates (structures);
wind;
13.
A Multiphysics Simulation of the Thermal Runaway in Large-Format Lithium-ion Batteries
机译:
大型锂离子电池热失控的多物理场模拟
作者:
Jiajun Xu
;
Christopher Hendricks
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
electrochemical electrodes;
lithium compounds;
secondary cells;
thermal stability;
14.
Evaluation of the Impact of Four-Degree Off-Axis Wafers on Silicon Stress Sensors
机译:
评估四度偏心晶片对硅应力传感器的影响
作者:
Jun Chen
;
Richard C. Jaeger
;
Jeffrey C. Suhling
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
calibration;
elemental semiconductors;
piezoresistive devices;
sensors;
silicon;
stress measurement;
15.
Fiber Optic Conjugate-Stress Sensor for Local Stiffness Changes under Quasistatic Loads
机译:
用于准静态载荷下局部刚度变化的光纤共轭-应力传感器
作者:
Jonathan Kordell
;
Abhijit Dasgupta
;
Miao Yu
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
Bragg gratings;
condition monitoring;
elasticity;
Fabry-Perot interferometers;
fatigue;
fibre optic sensors;
finite element analysis;
intelligent materials;
strain sensors;
stress-strain relations;
structural engineering;
tensile testing;
16.
A Study of the Elastic Constants of 4H Silicon Carbide (4H-SiC)
机译:
4H碳化硅(4H-SiC)的弹性常数的研究
作者:
Jun Chen
;
Abdullah Fahim
;
Jeffrey C. Suhling
;
Richard C. Jaeger
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
bending;
elastic constants;
elasticity;
nanoindentation;
Poisson ratio;
silicon compounds;
strain gauges;
wide band gap semiconductors;
17.
Stress Strain Analysis on Stitch Bond of Cu-Al Wirebonds Using X-ray Micro-CT Technique
机译:
X射线微CT技术分析铜铝丝键合处的应力应变
作者:
Pradeep Lall
;
Madhu Kasturi
;
Jeff Suhling
;
David Lockers
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
adhesion;
aluminium;
bonding processes;
computerised tomography;
copper;
electronics industry;
electronics packaging;
failure analysis;
gold;
mesh generation;
moulding;
stress-strain relations;
thermal conductivity;
18.
Delamination and Cracking Effects in Quad Flat Package
机译:
四方扁平封装的分层和龟裂效果
作者:
Jia-Shen Lan
;
Mei-Ling Wu
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
copper;
cracks;
curing;
delamination;
design engineering;
failure analysis;
integrated circuit packaging;
integrated circuit reliability;
moulding;
shear strength;
stress analysis;
19.
Effect of Grain Size on the Thermal Properties of Nickel-Titanium Shape Memory Alloys Across the Martensite-Austenite Phase Transition
机译:
粒度对马氏体-奥氏体相变过程中镍钛形状记忆合金热性能的影响
作者:
Nicholas T. Vu
;
Ronald J. Warzoha
;
Brian F. Donovan
;
Darin J. Sharar
;
Asher C. Leff
;
Adam A. Wilson
;
Andrew N. Smith
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
differential scanning calorimetry;
grain size;
martensitic transformations;
nickel alloys;
shape memory effects;
specific heat;
thermal conductivity;
thermoreflectance;
titanium alloys;
transmission electron microscopy;
20.
Wafer-Scale Hierarchically Textured Silicon for Surface Cooling
机译:
晶圆级分层纹理硅,用于表面冷却
作者:
Jonathan Sullivan
;
Laia Ferrer-Argemi
;
Ziqi Yu
;
Jaeho Lee
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
antireflection coatings;
cooling;
elemental semiconductors;
hydrophilicity;
hydrophobicity;
infrared spectra;
silicon;
sodium compounds;
sputter etching;
surface roughness;
surface texture;
thermal conductivity;
visible spectra;
21.
Factors Influencing the Line Consistency of Commonly Used Geometries for Additively Printed Electronics
机译:
影响增材印刷电子常用几何形状线一致性的因素
作者:
Pradeep Lall
;
Kartik Goyal
;
Ben Leever
;
Scott Miller
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
aerosols;
electronics industry;
ink;
ink jet printing;
jets;
nanoparticles;
printing;
scanning electron microscopy;
silver;
substrates;
three-dimensional printing;
viscosity;
22.
Understanding Trade-Offs of Phase Change Materials for Transient Thermal Mitigation
机译:
了解用于瞬态热缓解的相变材料的权衡
作者:
Lauren Boteler
;
Michael Fish
;
Morris Berman
;
Justin Wang
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
copper;
heat sinks;
latent heat;
Monte Carlo methods;
phase change materials;
thermal conductivity;
23.
Convergence and Validation in ParaPower: A Design Tool for Phase Change Materials in Electronics Packaging
机译:
ParaPower中的收敛和验证:电子封装中相变材料的设计工具
作者:
Michael Deckard
;
Patrick Shamberger
;
Michael Fish
;
Morris Berman
;
Justin Wang
;
Lauren Boteler
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
convergence;
electronics packaging;
finite element analysis;
phase change materials;
temperature distribution;
thermal energy storage;
24.
Numerical Investigation of Novel Underfloor Air-Directors Effect on Data Center Performance
机译:
新型地板空气导向器对数据中心性能影响的数值研究
作者:
Mohammad. I. Tradat
;
Sadegh Khalili
;
Malek Khatabi
;
Bahgat G. Sammakia
;
Mark Seymour
;
Russel Tipton
;
Husam A. Alissa
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
computer centres;
cooling;
floors;
intake systems (machines);
25.
Data Center Temperature Control using PI System and MATLAB
机译:
使用PI System和MATLAB的数据中心温度控制
作者:
Mitchell Baxendale
;
Jayati Athavale
;
Scott Robertson
;
Yogendra Joshi
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
air conditioning;
building management systems;
computer centres;
Matlab;
power engineering computing;
temperature control;
26.
A Design Methodology for Controlling Local Airflow Delivery in Data Centers Using Air Dampers
机译:
使用空气阻尼器控制数据中心本地气流传输的设计方法
作者:
Ghazal Mohsenian
;
Sadegh Khalili
;
Bahgat Sammakia
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computer centres;
energy conservation;
flow control;
fuzzy control;
space cooling;
telecontrol;
27.
In Situ Resistance Monitoring and Fatigue Life Prediction for Flip-Chip Solder Interconnects Using RAPID Mechanical Cycling Method
机译:
使用RAPID机械循环方法进行倒装芯片焊点互连的原位电阻监测和疲劳寿命预测
作者:
Cody Marbut
;
Mahsa Montazeri
;
David Huitink
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ball grid arrays;
failure (mechanical);
fatigue cracks;
finite element analysis;
flip-chip devices;
integrated circuit interconnections;
integrated circuit reliability;
life testing;
soldering;
solders;
28.
Concept of the 3
rd
Generation of Reliability for Electronic Smart Systems
机译:
电子智能系统可靠性的第三
rd sup>世代的概念
作者:
Przemyslaw Gromala
;
Franz Dietz
;
Sven Rzepka
;
Bongtae Han
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
automotive electronics;
condition monitoring;
reliability;
safety;
sensors;
29.
Sensitivity of Sensor Location and Use Conditions on the Detectability of Accrued Damage for PHM under Combined Temperature Vibration
机译:
复合温度振动下传感器位置和使用条件对PHM应计损伤可检测性的敏感性
作者:
Pradeep Lall
;
Tony Thomas
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
condition monitoring;
failure (mechanical);
failure analysis;
printed circuit testing;
strain gauges;
vibrations;
30.
Performance Characterization of a Novel Cross-Media Composite Heat Exchanger for Air-to-Liquid Applications
机译:
新型液-气应用跨介质复合换热器的性能表征
作者:
Martinus Arie
;
David Hymas
;
Farah Singer
;
Amir Shooshtari
;
Michael Ohadi
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
filled polymers;
heat exchangers;
heat transfer;
materials testing;
plates (structures);
thermal conductivity;
three-dimensional printing;
wires;
31.
Additively Manufactured Impinging Air Jet Cooler for High-Power Electronic Devices
机译:
用于大功率电子设备的增材制造的冲击空气喷射冷却器
作者:
Beomjin Kwon
;
Thomas Foulkes
;
Tianyu Yang
;
Nenad Miljkovic
;
William P. King
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
gallium compounds;
heat sinks;
III-V semiconductors;
jets;
natural convection;
nozzles;
rapid prototyping (industrial);
resins;
thermal management (packaging);
three-dimensional printing;
transistors;
wide band gap semiconductors;
32.
Viscous Effects in Collision Outcomes of a Falling Drop Impinging on a Sessile Drop
机译:
跌落液滴撞击无水液滴碰撞结果的粘性效应
作者:
David C. Deisenroth
;
Jeffrey S. Allen
;
Seong Hyuk Lee
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
contact angle;
cooling;
drops;
impact (mechanical);
viscosity;
water;
wetting;
33.
Effect of Sintering Time and Sintering Temperature on the Mechanical and Electrical Properties of Aerosol-Jet Additively Printed Electronics
机译:
烧结时间和烧结温度对气溶胶喷射增印电子学机械性能的影响
作者:
Pradeep Lall
;
Nakul Kothari
;
Amrit Abrol
;
Sudan Ahmed
;
Jeft Suhling
;
Ben Leever
;
Scott Miller
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
aerosols;
electrical resistivity;
ink;
nanoparticles;
printing;
scanning electron microscopy;
shear strength;
silver;
sintering;
34.
Design and Testing of Liquid Cooled Thermal Solution for High Loading Processors
机译:
高负荷处理器的液冷散热解决方案的设计和测试
作者:
Veronica Torreblanca
;
Anali Soto
;
Devdatta Kulkarni
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
heat sinks;
integrated circuit design;
integrated circuit testing;
microprocessor chips;
thermal management (packaging);
35.
Development of Si-Based Micro-Fluidic Cooler for Thermal Management of Server Processor in Data Center
机译:
用于数据中心服务器处理器热管理的基于硅的微流体冷却器的开发
作者:
Yong Han
;
Boon Long Lau
;
Gongyue Tang
;
Sharon Seow Huang Lim
;
Haoran Chen
;
Xiaowu Zhang
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computer centres;
cooling;
jets;
microfluidics;
network servers;
silicon;
thermal management (packaging);
36.
A Metamodeling Approach for Optimization of Manifold Microchannel Systems for High Heat Flux Cooling Applications
机译:
用于高热通量冷却应用的歧管微通道系统优化的元建模方法
作者:
Sevket U. Yuruker
;
Raphael K. Mandel
;
Amir Shooshtari
;
Michael M. Ohadi
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
cooling;
heat sinks;
Matlab;
microchannel flow;
optimisation;
Poiseuille flow;
thermal management (packaging);
37.
Cold Plate Pin-Fin Optimization for Multi-Die Systems Using Design of Experiment
机译:
基于实验设计的多芯片系统冷板针脚优化
作者:
Yuanchen Hu
;
Yogendra Joshi
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
cooling;
field programmable gate arrays;
heat transfer;
integrated circuit interconnections;
integrated circuit packaging;
microfluidics;
silicon;
silicon compounds;
thermal management (packaging);
three-dimensional integrated circuits;
38.
Coupled Thermal-Electrical Simulation and Validation Test for Novel High Power Delivery Design in CPU Socket Area
机译:
CPU插座区域新型高功率输出设计的热电耦合模拟和验证测试
作者:
Yuehong Fan
;
Hongfei Yan
;
Jack Zhong
;
Wei Shen
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
electric connectors;
integrated circuit interconnections;
integrated circuit modelling;
integrated circuit testing;
microprocessor chips;
thermal analysis;
thermal management (packaging);
39.
Topology Optimized Fins for a PCM-Based Thermal Management System
机译:
基于PCM的热管理系统的拓扑优化鳍
作者:
Ange-Christian Iradukunda
;
David Huitink
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
convection;
cooling;
electronics packaging;
heat sinks;
latent heat;
phase change materials;
thermal conductivity;
thermal energy storage;
thermal management (packaging);
40.
A Numerical Investigation of the Thermal and Hydrodynamic Behaviors of a Channel with Rectangular Pin Fins in Aligned and Staggered Configurations
机译:
排列和交错配置的带有矩形销鳍的通道的热力学和流体力学行为的数值研究
作者:
Johnny Issa
;
Amina El Cheikh
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
channel flow;
finite volume methods;
flow simulation;
heat exchangers;
heat transfer;
hydrodynamics;
laminar flow;
pipe flow;
temperature distribution;
41.
SSD Thermal Throttling Prediction using Improved Fast Prediction Model
机译:
使用改进的快速预测模型的SSD热节流预测
作者:
Hedan Zhang
;
Ernold Thompson
;
Ning Ye
;
Dror Nissim
;
Steve Chi
;
Hem Takiar
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
curve fitting;
thermal management (packaging);
42.
Impact Test Simulation and Validation for Fiber Reinforced Plastics in Automotive Electronic Control Units
机译:
汽车电子控制单元中纤维增强塑料的冲击试验模拟和验证
作者:
Tian Zhao
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
automotive electronics;
automotive engineering;
automotive materials;
cracks;
failure (mechanical);
failure analysis;
glass fibre reinforced plastics;
impact (mechanical);
impact testing;
viscoplasticity;
43.
Fatigue Life of Joint-Scale SAC305 Solder Specimens in Tensile and Shear Mode
机译:
拉伸和剪切模式下联合尺度SAC305焊料样品的疲劳寿命
作者:
Abhishek Deshpande
;
Qian Jiang
;
Abhijit Dasgupta
;
Ulrich Becker
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
adhesion;
copper alloys;
crystal microstructure;
durability;
failure analysis;
fatigue;
image processing;
life testing;
scanning electron microscopy;
shear strength;
silver alloys;
solders;
stress analysis;
tensile testing;
tin alloys;
44.
Cohesive Zone Modeling and Damage Prediction of Interfacial Delamination in Potted Electronics Subjected to High-G Mechanical Shock
机译:
受到高G机械冲击的盆栽电子中界面分层的粘结区建模和损伤预测
作者:
Pradeep Lall
;
Kalyan Dornala
;
Jeff Suhling
;
John Deep
;
Ryan Lowe
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
assembling;
ball grid arrays;
circuit reliability;
delamination;
elasticity;
electronics packaging;
encapsulation;
failure (mechanical);
failure analysis;
finite element analysis;
fracture;
integrated circuit reliability;
printed circuit manufacture;
reliability;
resin;
45.
Effect of Dielectric Material on the Reliability of 3640 MLCC Capacitors under High-G Shock Loads
机译:
高G冲击载荷下介电材料对3640 MLCC电容器可靠性的影响
作者:
Pradeep Lall
;
Kalyan Dornala
;
Jeff Suhling
;
John Deep
;
Ryan Lowe
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ball grid arrays;
ceramic capacitors;
dielectric materials;
failure analysis;
finite element analysis;
integrated circuit packaging;
interconnections;
permittivity;
printed circuits;
reliability;
solders;
46.
Capacity Degradation of Flexible Li-Ion Power Sources Subjected to Shallow Discharging
机译:
浅放电条件下柔性锂离子源的容量下降
作者:
Pradeep Lall
;
Amrit Abrol
;
Ved Soni
;
Ben Leever
;
Scott Miller
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
battery management systems;
electric vehicles;
electrochemical electrodes;
energy harvesting;
flexible electronics;
Internet of Things;
secondary cells;
thermal stresses;
47.
Failure Modes of Flexible Electronics Under Mechanical Vibration
机译:
机械振动下柔性电子的失效模式
作者:
Pradeep Lall
;
Tony Thomas
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
electronics industry;
fixtures;
flexible electronics;
strain gauges;
strain measurement;
vibrations;
48.
PHM of Flexible Li-ion Batteries Subjected to Sustained Elevated-Temperature Storage and Thermal Cycling
机译:
承受持续高温存储和热循环的柔性锂离子电池的PHM
作者:
Pradeep Lall
;
Amrit Abrol
;
Ben Leever
;
Scott Miller
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ageing;
battery management systems;
condition monitoring;
crystal microstructure;
decomposition;
electrochemical electrodes;
electrolytes;
energy harvesting;
flexible electronics;
lithium compounds;
scanning electron microscopy;
secondary cells;
X-ray chemical analys;
49.
Effect of Use Parameters on Fatigue-Life of Flexible Substrates under Bending Loads
机译:
使用参数对弯曲载荷下柔性基板疲劳寿命的影响
作者:
Pradeep Lall
;
Jinesh Narangaparatnbil
;
Ben Leever
;
Scott Miller
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
bending;
biomedical materials;
copper;
failure (mechanical);
fatigue;
flexible electronics;
polymers;
printed circuits;
reliability;
50.
Micro-Scale Nozzled Jet Heat Transfer Distributions and Flow Field Entrainment Effects Directly on Die
机译:
微型喷嘴的射流传热分布及流场夹带效应对模具的直接影响
作者:
Prabhakar Subrahmanyam
;
Arun Krishnamoorthy
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
confined flow;
cooling;
flow simulation;
flow visualisation;
heat transfer;
jets;
microchannel flow;
nozzles;
numerical analysis;
orifices (mechanical);
stratified flow;
thermal management (packaging);
turbulence;
51.
Flow Boiling Stability Improvement with Periodic Stepped Fin Microchannel Heat Sink
机译:
周期性阶梯翅片微通道散热器提高流沸腾稳定性
作者:
John Mathew
;
Poh Seng Lee
;
Tianqing Wu
;
Christopher Yap
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
boiling;
bubbles;
confined flow;
coolants;
copper;
flow measurement;
heat sinks;
heat transfer;
microchannel flow;
multiphase flow;
nucleation;
temperature measurement;
two-phase flow;
water;
52.
Pool Boiling Heat Transfer Enhancement with Porous Fin Arrays Manufactured by Selective Laser Melting
机译:
通过选择性激光熔化制造的多孔翅片阵列增强池沸腾的传热
作者:
Tianqing Wu
;
Poh Seng Lee
;
John Mathew
;
Chen-Nan Sun
;
Beng Loon Aw
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
aluminium alloys;
boiling;
cooling;
copper;
heat sinks;
melting;
nucleation;
rapid prototyping (industrial);
silicon alloys;
thermal conductivity;
thermal management (packaging);
thermal resistance;
three-dimensional printing;
two-phase flow;
53.
Numerical Investigation of Spray Cooling-Based Thermal Management of Extreme Power Densities using Anisotropic Composite Heat Spreaders
机译:
各向异性复合材料散热器基于喷雾冷却的极限功率密度热管理数值研究
作者:
Huseyin Bostanci
;
Sai Sujith Obuladinne
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
composite materials;
cooling;
design engineering;
heat transfer;
numerical analysis;
organic compounds;
power electronics;
sprays;
thermal conductivity;
thermal management (packaging);
54.
Impact of Board Placement on Thermal Performance of Handheld Devices (tablets)
机译:
电路板放置对手持设备(平板电脑)热性能的影响
作者:
Sankarananda Basak
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
notebook computers;
printed circuit layout;
thermal management (packaging);
55.
Cell Tab Cooling System for Battery Life Extension
机译:
Cell Tab散热系统可延长电池寿命
作者:
Heiner Heimes
;
Achim Kampker
;
Ahmad Mohsseni
;
Francesco Maltoni
;
Jan Biederbeck
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
secondary cells;
temperature distribution;
thermal conductivity;
thermal resistance;
56.
Cooling for Electric Aircraft Motors
机译:
飞机电动机的冷却
作者:
F. Patrick McCluskey
;
Yonatan Saadon
;
Zhaoxi Yao
;
Alexander Camacho
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
aerospace propulsion;
aircraft;
cooling;
electric motors;
electric propulsion;
forced convection;
hybrid electric vehicles;
power electronics;
reliability;
rotors;
thermal management (packaging);
thermal resistance;
57.
Effects of Solder Mask Application Method on The Reliability of An Automotive Flip Chip PBGA Microcontroller
机译:
阻焊剂涂覆方法对汽车倒装芯片PBGA单片机可靠性的影响
作者:
A R Nazmus Sakib
;
Richard S Lai
;
Sandeep Shantaram
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
automotive electronics;
ball grid arrays;
copper;
cracks;
curing;
failure analysis;
finite element analysis;
flip-chip devices;
integrated circuit interconnections;
integrated circuit packaging;
integrated circuit reliability;
masks;
plastic packaging;
solders;
58.
Effect of Aging on the Fatigue Life and Shear Strength of SAC305 Solder Joints in Actual Setting Conditions
机译:
老化对实际设置条件下SAC305焊点疲劳寿命和抗剪强度的影响
作者:
Raed Al Athamneh
;
Mohammed Abueed
;
Dania Bani Hani
;
Sinan Su
;
Sad Hamasha
;
Jeffery Suhling
;
Pradeep Lall
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ageing;
fatigue;
fatigue testing;
life testing;
plastic deformation;
reliability;
shear strength;
solders;
surface mount technology;
Weibull distribution;
59.
Effect of Surface Finish on the Fatigue Behavior of Bi-based Solder Joints
机译:
表面光洁度对双基焊点疲劳行为的影响
作者:
Sinan Su
;
Minghong Jian
;
Xin Wei
;
Francy John Akkara
;
Sad Hamasha
;
Jeff Suhling
;
Pradeep Lall
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
bismuth alloys;
copper alloys;
crystal microstructure;
fatigue;
fatigue testing;
fracture;
integrated circuit packaging;
interconnections;
nickel alloys;
printed circuit manufacture;
reliability;
silver alloys;
solders;
surface finishing;
thermal stress cracking;
tin al;
60.
Study of the Effect of Solder-Joint Voiding using X-ray MicroCT Data-based FE Models with Experimental Validation
机译:
基于X射线MicroCT数据的有限元模型对焊点空化效果的实验验证
作者:
Pradeep Lall
;
Nakul Kothari
;
Shantanu Deshpande
;
Luu Nguyen
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computerised tomography;
fatigue;
finite element analysis;
reliability;
solders;
voids (solid);
61.
Heat Transfer and Two-Phase Flow Regimes in Manifolded Microgaps - R245fa Empirical Results
机译:
流形微间隙中的热传递和两相流状态-R245fa经验结果
作者:
David C. Deisenroth
;
Avram Bar-Cohen
;
Michael Ohadi
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
infrared imaging;
microchannel flow;
refrigerants;
refrigeration;
thermal management (packaging);
thermodynamics;
two-phase flow;
62.
Experimental Performance of Completely Passive Single and Recirculating Loop Thermosyphon Cooling Systems using Low GWP R1234ze and R1234yf
机译:
使用低GWP R1234ze和R1234yf的完全被动式单循环循环热虹吸冷却系统的实验性能
作者:
Filippo Cataldo
;
John Richard Thome
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
condensation;
cooling;
evaporation;
friction;
global warming;
heat transfer;
high-pressure techniques;
natural convection;
refrigerants;
thermal resistance;
63.
Prediction of Regime Transition in Two Phase Flow Microchannels Based on Ultrathin Liquid Film Interfacial Instability
机译:
基于超薄液膜界面不稳定性的两相流微通道热力学过渡预测
作者:
Meisam Habibi Matin
;
Saeed Moghaddam
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
bubbles;
film flow;
flow instability;
hydrodynamics;
liquid films;
microchannel flow;
perturbation theory;
two-phase flow;
64.
Optimization of Liquid Cooling Microchannel in 3D IC using Complete Converging and Diverging Channel Models
机译:
使用完整的收敛和扩散通道模型优化3D IC中的液体冷却微通道
作者:
Leslie K. Hwang
;
Beomjin Kwon
;
Martin D. F. Wong
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
heat sinks;
microchannel flow;
numerical analysis;
thermal management (packaging);
thermal resistance;
three-dimensional integrated circuits;
65.
A Central Cooling Structure for Motorized Spindles: Principle and Application
机译:
电动主轴中央冷却结构:原理与应用
作者:
Feng Liang
;
Jianmin Gao
;
Fajing Li
;
Liang Xu
;
Zhao Wang
;
Hongquan Jiang
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
finite element analysis;
grinding;
heat pipes;
machine tool spindles;
production engineering computing;
66.
Heat Transfer Augmentation Using Scale-Roughened Surfaces for Low-Reynolds Number Flows Generated by Piezoelectric Fans
机译:
使用缩放粗糙表面增强压电风扇产生的低雷诺数流的传热
作者:
Navid Dehdari Ebrahimi
;
Y. Sungtaek Ju
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
channel flow;
convection;
cooling;
fans;
flow simulation;
jets;
laminar flow;
piezoelectricity;
thermal management (packaging);
67.
Experimental Investigation of Direct Contact Baseplate Cooling for Electric Vehicle Power Electronics
机译:
电动汽车电力电子设备直接接触底板冷却的实验研究
作者:
Jasper Nonneman
;
Stephan Schlimpert
;
Ilya TJollyn
;
Peter Sergeant
;
Michel De Paepe
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
channel flow;
cooling;
flow sensors;
heat sinks;
laminar flow;
microchannel flow;
mixtures;
organic compounds;
pipe flow;
pressure sensors;
temperature measurement;
thermal management (packaging);
thermal resistance;
viscosity;
water;
68.
Dynamic Thermal Management Of Silicon Interconnect Fabric Using Flash Cooling
机译:
利用闪速冷却对硅互连结构进行动态热管理
作者:
Ujash Shah
;
Umesha Mogera
;
Pranav Ambhore
;
Boris Vaisband
;
Subramanian S. Iyer
;
Timothy S. Fisher
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
elemental semiconductors;
integrated circuit interconnections;
integrated circuit packaging;
integrated circuit reliability;
silicon;
temperature distribution;
thermal conductivity;
thermal management (packaging);
69.
Thermal Analysis of a 3D Flip-chip Fan-out Wafer Level Package (fcFOWLP) for High Bandwidth 3D Integration
机译:
用于高带宽3D集成的3D倒装芯片扇出晶圆级封装(fcFOWLP)的热分析
作者:
H. Oprins
;
E. Beyne
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
finite element analysis;
flip-chip devices;
integrated circuit interconnections;
silicon;
thermal analysis;
thermal management (packaging);
three-dimensional integrated circuits;
wafer level packaging;
70.
Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5D Si Interposer Packages
机译:
用于高性能2.5D Si中介层封装的聚合物3D打印喷射冲击冷却器的热分析
作者:
T.-W. Wei
;
H. Oprins
;
V. Cherman
;
I. De Wolf
;
G. Van der Plas
;
E. Beyne
;
M. Baelmans
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
cooling;
elemental semiconductors;
heat sinks;
integrated circuit packaging;
jets;
nozzles;
silicon;
thermal analysis;
thermal management (packaging);
three-dimensional printing;
71.
Hotspot Management by Holey Silicon-Metal Composites for 1 kW/cm
2
and Beyond
机译:
多孔硅金属复合材料在1 kW / cm
2 sup>及更高功率下的热点管理
作者:
Zongqing Ren
;
Ziqi Yu
;
Jae Choon Kim
;
Jaeho Lee
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
electron-phonon interactions;
elemental semiconductors;
heat sinks;
integrated circuit design;
silicon;
thermal conductivity;
thermal management (packaging);
thermal resistance;
thermoelectric cooling;
three-dimensional integrated circuits;
wafer level pack;
72.
Performance Evaluation of Liquid 3D Chip Cooling Systems Under Non-Uniform Power Density: Effects of Inlet and Plenum Configurations
机译:
非均匀功率密度下液态3D芯片冷却系统的性能评估:入口和进气口配置的影响
作者:
Soheil Soleimanikutanaei
;
Cheng-Xian Lin
;
Nezih Pala
;
Gang Quan
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
cooling;
heat conduction;
heat sinks;
microchannel flow;
numerical analysis;
temperature distribution;
thermal management (packaging);
73.
Impact of Fans Location on the Cooling Efficiency of IT Servers
机译:
风扇位置对IT服务器散热效率的影响
作者:
Sadegh Khalili
;
Mohammad Tradat
;
Bahgat Sammakia
;
Husam Alissa
;
Cheng Chen
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
computer centres;
cooling;
electronics packaging;
energy conservation;
fans;
power aware computing;
74.
An Accurate Fast Fluid Dynamics Model for Data Center Applications
机译:
适用于数据中心应用的精确快速流体动力学模型
作者:
Wei Tian
;
Jim VanGilder
;
Michael Condor
;
Xu Han
;
Wangda Zuo
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
computer centres;
finite volume methods;
flow simulation;
turbulence;
75.
Balancing Cooling and IT Airflow with Dampers in Ceiling-Ducted Hot-Aisle Containment in Data Centers
机译:
在数据中心通过天花板引导的热通道气流遏制器中,利用阻尼器平衡冷却和IT气流
作者:
James VanGilder
;
Yan Zhang
;
Stephen Linder
;
Michael Condor
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ceilings;
computational fluid dynamics;
computer centres;
cooling;
fans;
pipe flow;
pressure measurement;
shock absorbers;
space cooling;
vibration control;
76.
Energy Audit of Data Centers and Server Rooms on an Academic Campus—A Case Study
机译:
大学校园数据中心和服务器机房的能源审计—案例研究
作者:
Mehul Patel
;
Ameya Upadhyay
;
Fabio Battaglia
;
Farah Singer
;
Michael Ohadi
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
auditing;
computational fluid dynamics;
computer centres;
cooling;
energy conservation;
energy consumption;
power aware computing;
77.
Experimental Characterization of Different Condenser Technologies in a Passive Two-Phase Cooling System for Thermal Management of Electronics
机译:
电子热管理被动式两相冷却系统中不同冷凝器技术的实验表征
作者:
Chiara Falsetti
;
Raffaele L. Amalfi
;
Todd Salamon
;
Jackson B. Marcinichen
;
John R. Thome
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
computational fluid dynamics;
condensation;
condensers (steam plant);
cooling;
fans;
friction;
heat exchangers;
microchannel flow;
pipe flow;
pipes;
refrigerants;
refrigeration;
thermal management (packaging);
thermal resistance;
two-phase flow;
78.
Combined Conduction and Natural Convection Cooling of Offshore Power Cables in Porous Sea Soil
机译:
多孔海土壤中海洋电缆的传导和自然对流联合冷却
作者:
Ilya TJollyn
;
Manly Callewaert
;
Jasper Nonneman
;
Johan Van de Wauw
;
Bernd Ameel
;
Michel De Pacpe
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
convection;
cooling;
finite difference methods;
flow through porous media;
heat conduction;
heat transfer;
laminar flow;
natural convection;
offshore installations;
permeability;
power cables;
soil;
structural engineering;
thermal conductivity;
79.
A Single Flexible Coldplate Cools Multiple Devices
机译:
单个柔性冷板可冷却多个设备
作者:
Shurong Tian
;
Todd Takken
;
Mark Schultz
;
Yuan Yao
;
Paul Coteus
;
Chris Marroquin
;
Kevin OConnell
;
Howard Vic Mahaney
;
Anil Yuksel
;
Michael Ellsworth
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
cooling;
graphics processing units;
heat sinks;
solders;
thermal conductivity;
thermal management (packaging);
voids (solid);
80.
Characterization of Viscoelastic Response of Underfill Materials
机译:
底部填充材料的粘弹性响应的表征
作者:
Promod R. Chowdhury
;
Jeffrey C. Suhling
;
Pradeep Lall
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
creep;
deformation;
electronics packaging;
encapsulation;
integrated circuit manufacture;
polymers;
stress relaxation;
stress-strain relations;
viscoelasticity;
81.
Evolution of the Mechanical Behavior of Lead Free Solders Exposed to Thermal Cycling
机译:
热循环下无铅焊料机械行为的演变
作者:
S. M. Kamrul Hasan
;
Abdullah Fahim
;
Jeffrey C. Suhling
;
Sad Hamasha
;
Pradeep Lall
会议名称:
《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》
|
2019年
关键词:
ageing;
copper alloys;
elastic moduli;
elasticity;
reflow soldering;
silver alloys;
solders;
solidification;
stress-strain relations;
tensile strength;
thermal shock;
tin alloys;
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