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Conference on Metrology, Inspection, and Process Control for Microlithography

召开年：2020
召开地：San Jose(US)
出版时间：-

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1.Metrology for Advanced Transistor and Memristor Devices and Materials

机译：先进晶体管和忆阻器设备与材料的计量
- 作者：Alain C. Diebold;Nathaniel C. Cady
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- MMSE;
- scatterometry;
- Nanowire FETs;
- Nanosheet FETs;
- optical metrology;
2.Understanding advanced DRAM edge placement error budget and opportunities for control

机译：了解高级DRAM边缘放置错误预算和控制机会
- 作者：Jaeseung Jeong;Jinho Lee;Jinsun Kim;Sunyoung Yea;Chan Hwang;Seung Yoon Lee;Jeongjin Lee;Joonsoo Park;Peter Nikolsky;Daniel Park;Antonio Corradi;Hyun-Woo Yu;Sun-Wook Jung;Denis Ovchinnikov;Vadim Timoshkov;Isabel de la Fuente Valentin;Yuxiang Yin;Kaustubh Padhye;Wim Tel;Harm Dillen;Koen Thuijs;Daan Slotboom;Miao Wang;Rhys Su;Marc Kea;Jin-Woo Lee;Yun-A Sung;Sang-Uk Kim;Young-Hoon Song;James Lee;Oh-Sung Kwon
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Edge Placement Error;
- EPE Budget Breakdown;
- EPE Improvement;
- DRAM;
- stochastics;
- CDU;
- Overlay;
- control;
3.Real-time full-wafer design-based inter-layer virtual metrology

机译：基于实时全晶片设计的层间虚拟度量
- 作者：Lianghong Yin;John Sturtevant;Alberto Lopez Gomez;Shumay Shang;Young Chang Kim;Kostas Adam;Marko Chew;Abhinandan Nath;Boris Habets;Manuela Gutsch;Philip Groeger
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Wafer disposition;
- yield;
- rework;
- turn-around-time;
- inter-layer checking;
- hotspot;
- computational lithography;
- virtual metrology;
- self-aligned via;
- multiple patterning;
4.Atom Probe Tomography using Extreme-Ultraviolet Light

机译：使用极紫外光的原子探针层析成像
- 作者：Luis Miaja-Avila;Ann N. Chiaramonti;Benjamin W. Caplins;David R. Diercks;Brian P. Gorman;Norman A. Sanford
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Atom probe microscopy;
- extreme ultraviolet;
- high-harmonic generation;
5.VIA Dishing Metrology for Novel 3D NAND Using Neural Network Assisted White Light Interferometry

机译：使用神经网络辅助白光干涉仪的新型3D NAND的VIA碟形计量
- 作者：Sicong Wang;Xiaoye Ding;Yi Zhou;Yanzhong Ma;Le Yang;Chi Chen;Lu Chen
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- WLI;
- Dishing;
- Neural Network;
- Metrology;
- 3D NAND;
- Bonding;
- Machine learning;
6.High resolution acoustic metrology by combining high GHZ frequency ultrasound and scanning probe microscopy

机译：结合高GHZ频率超声和扫描探针显微镜的高分辨率声学计量
- 作者：Maarten H.van Es;Benoit A.J. Quesson;Abbas Mohtashami;Daniele Piras;Kodai Hatakeyama;Laurent Fillinger;Paul L.M.J. van Neer
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Scanning Probe Microscopy;
- Acoustic Microscopy;
- High Resolution;
- Buried Structures;
7.Inline Part Average Testing (I-PAT) for Automotive Die Reliability

机译：在线零件平均测试（I-PAT），提高汽车模具的可靠性
- 作者：John C. Robinson;Kara Sherman;David W. Price;Jay Rathert
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Inline Inspection;
- Part Average Testing (PAT);
- Screening;
- Reliability;
- I-PAT;
8.Multi-beam Inspection (MBI) Development Progress and Applications

机译：多光束检测（MBI）的开发进度和应用
- 作者：Eric Ma;Weiming Ren;Xinan Luo;Shuo Zhao;Xuerang Hu;Xuedong Liu;Chiyan Kuan;Kevin Chou;Martijn Maassen;Weihua Yin;Aiden Chen;Niladri Sen;Martin Ebert;Lei Liu;Fei Wang;Oliver D. Patterson
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Multiple beam;
- MBI;
- EUV;
- high throughput;
- EBI;
- ebeam inspection;
9.Stochastic model prediction of pattern-failure

机译：模式失效的随机模型预测
- 作者：Sophie (Hyejin) Jin;John Sturtevant;Shumay Shang;Lianghong Yin;Kevin Ahi
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Stochastic;
- model;
- patterning-failure;
- SRAF printing;
- pattern-collapse;
10.Novel post-lithography macro inspection strategies for advanced legacy fab challenges

机译：新型光刻后宏观检测策略，应对先进的传统晶圆厂挑战
- 作者：A. Bordogna;S. Seminato;A. Corno;A. Beccalli;L. Motta;G. Pistone;F. Ferrario;P. Piacentini;B. Micali;P. Sharma;L. Bouckou;P. Parisi;T. Groos
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- lithography;
- yield improvement;
- defect inspection;
- defect reduction;
- process control;
11.3D-NAND Wafer Process Monitoring Using High Voltage SEM with Auto e-Beam Tilt Technology

机译：使用自动电子束倾斜技术的高压SEM进行3D-NAND晶圆工艺监控
- 作者：Leeming Tu;Jian Mi;Henry Fan;Haydn Zhou Felix Xiong;Luise Tu;Gangyi Chen;Chuanyu Shao;Long Zhang;Shinji Kubo
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- high voltage SEM;
- HAR;
- Auto e-beam tilt;
- CD;
- Bending;
- Overlay;
12.3D analysis of high-aspect ratio features in 3D-NAND

机译：3D-NAND中高纵横比特征的3D分析
- 作者：Jens Timo Neumann;Dmitry Klochkov;Thomas Korb;Sheetal Gupta;Amir Avishai;Ramani Pichumani;Keumsil Lee;Alex Buxbaum;Eugen Foca
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- 3D tomography;
- FIB-SEM;
- 3D-NAND;
- high aspect ratio;
- metrology;
- defect detection;
- volume reconstruction;
- large data analysis;
13.Accuracy improvement of 3D-profiling for HAR features using deep learning

机译：使用深度学习提高用于HAR功能的3D轮廓的精度
- 作者：Wei Sun;Pushe Zhao;Yasunori Goto;Takuma Yamamoto;Taku Ninomiya
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- 3D-profiling;
- deep learning;
- high-voltage CD-SEM;
- BSE;
- high-aspect-ratio;
14.Machine learning and hybrid metrology using HV-SEM and optical methods to monitor channel hole tilting in-line for 3D NAND wafer production

机译：使用HV-SEM和光学方法进行机器学习和混合计量，以监控3D NAND晶圆生产中的通道孔倾斜
- 作者：Michael Meng;Leeming Tu;Jian Mi;Haydn Zhou;Xi Zou
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Machine learning;
- Tilt;
- 3D NAND;
- HAR;
- HV-SEM;
- Optical metrology;
15.Comparing Edge Detection Algorithms: their impact on unbiased roughness measurement precision and accuracy

机译：比较边缘检测算法：它们对无偏粗糙度测量精度和准确性的影响
- 作者：Chris A. Mack
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Power Spectral Density;
- PSD;
- line-edge roughness;
- linewidth roughness;
- LER;
- LWR;
- unbiased roughness;
- CD-SEM;
- noise floor;
16.Comparison of SEM and AFM performances for LER reference metrology

机译：LER参考计量的SEM和AFM性能比较
- 作者：Ryosuke Kizu;Ichiko Misumi;Akiko Hirai;Satoshi Gonda
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
17.White-light Mueller-matrix Fourier scatterometry for the characterization of nanostructures with large parameter spaces

机译：白光穆勒矩阵傅里叶散射法用于表征具有大参数空间的纳米结构
- 作者：M. L. Godecke;K. Frenner;W. Osten
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
18.X-Ray Metrology of Nanowire/ Nanosheet FETs for Advanced Technology Nodes

机译：用于先进技术节点的纳米线/纳米片FET的X射线计量
- 作者：Madhulika Korde;R. Joseph Kline;Daniel F. Sunday;Nick Keller;Subhadeep Kal;Cheryl Alix;Aelan Mosden;Alain C. Diebold
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- X-Ray scattering;
- CDSAXS;
- Nanowire FETs;
- Nanosheet FETs;
- metrology;
- SiGe etch characterization;
19.Nanoscale grating characterization through EUV spectroscopy aided by machine learning techniques

机译：借助机器学习技术通过EUV光谱表征纳米光栅
- 作者：Lukas Bahrenberg;Sven Glabisch;Serhiy Danylyuk;Moein Ghafoori;Sophia Schroder;Sascha Brose;Jochen Stollenwerk;Peter Loosen
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- extreme ultraviolet;
- critical dimension;
- spectrometer;
- scatterometry;
- neural networks;
- metrology;
- process control;
- finite elements method;
- rigorous simulation;
20.Understanding the influence of 3D sidewall roughness on observed line-edge roughness in scanning electron microscopy images

机译：了解3D侧壁粗糙度对扫描电子显微镜图像中观察到的线边缘粗糙度的影响
- 作者：L. van Kessel;T. Huisman;C.W. Hagen
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Scanning electron microscopy;
- Line edge roughness;
- Sidewall roughness;
- Metrology;
- Monte Carlo methods;
21.Three-Dimensional Feature Characterization by Inline Xe Plasma FIB - Delayering and Deep Milling Implementation

机译：在线Xe等离子体FIB的三维特征表征-延迟和深铣削实现
- 作者：Franz Niedermeier;Agnes Fros;Max Boeckl;Wolfgang Kipferl;Michaela Braun;Albert Birner;Haim Pearl;Thomas Schubert;Allen Lee
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
22.A Hybrid Total Measurement Uncertainty Methodology for Dual Beam FIB/SEM Metrology

机译：双光束FIB / SEM计量的混合总测量不确定度方法
- 作者：Ardavan Zandiatashbar;Chester Chien
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- TMU;
- FIB;
- dual beam;
- metrology;
- FMP;
23.EUV scatterometer with multiple orders of high-harmonic generation

机译：具有多个高次谐波产生量的EUV散射仪
- 作者：Y. S. Ku;W. T. Wang;Y. C. Chen;M. C. Chang;C. L. Yeh;C. W. Lo
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Scatterometer;
- Extreme Ultraviolet;
- High-order Generation;
24.Sensitivity analysis for the detection of pitchwalk in self-aligned quadruple patterning by GISAXS

机译：GISAXS对自对准四重图案中的音高步距进行检测的灵敏度分析
- 作者：Maren Casfor Zapata;Nando Farchmin;Mika Pflueger;Konstantin Nikolaev;Victor Soltwisch;Sebastian Heidenreich;Christian Laubis;Michael Kolbe;Frank Scholze
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- X-ray scattering;
- FEM;
- GISAXS;
- polynomial chaos;
- pitchwalk;
25.Contact Etch process control application for advanced NAND memory structures

机译：用于高级NAND存储器结构的Contact Etch过程控制应用程序
- 作者：R. Kris;G. Klebanov;I. Friedler;E. Sommer;E. Frishman;S. Duvdevani Bar;J. Geva;V. Mirovoy;N. Teomim;D. Rathore;D. Rogers;J. Chess;B. Watson
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- 3D-NAND;
- CD Metrology;
- SEM Metrology;
- Contact Etch;
- Classification;
26.Taking the multi-wavelength DBO to the next level of accuracy and robustness

机译：使多波长DBO达到更高的准确性和鲁棒性水平
- 作者：Jinsun Kim;Jeongjin Lee;Chan Hwang;Seung Yoon Lee;Wooyoung Jung;Joonsoo Park;Kaustuve Bhattacharyya;Arie den Boef;Simon Mathijssen;Marc Noot;Farzad Farhadzadeh;Daniel Park;Kaustubh Padhye;Se-Ra Jeon;Seung-Bin Yang;Won-Jae Jang;Oh-Sung Kwon
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Overlay;
- on-product;
- diffraction;
- DBO;
- scatterometer;
- metrology;
- accuracy;
- robustness;
- intra target;
- asymmetry;
- swing-curve.;
27.Run to run and model variability of overlay high order process corrections for mean intratield signatures

机译：运行并建模叠加高阶过程校正的平均可变产量内签名的可变性
- 作者：Benjamin Duclaux;Maxime Gatefait;Olivier Mermet;Jean-Damien Chapon
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Overlay;
- Advanced Process Control;
- High Ordermodeling;
- Correctionper Exposure (CPE);
28.Stitched overlay evaluation and improvement for large field applications

机译：拼接叠加评估和大范围应用的改进
- 作者：Michael May;Blandine Minghetti;Jerome Depre;Yoann Blancquaert;Pui Lam;Celine Lapeyre;Joungchel Lee
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- pattern placement;
- stitched field;
- overlay model;
- μDBO;
- Multi-Layer targets (MLT);
- Metrology;
- YieldStar;
- Scatterometry;
29.The application of a Rapid Probe Microscope (RPM) for investigating 1D and 2D structures from EUV lithography

机译：快速探针显微镜（RPM）在EUV光刻中研究一维和二维结构的应用
- 作者：Andrew D.L. Humphris;Alain Moussa;Mircea Dusa;Anne-Laure Charley;Elis Newham;Jenny Goulden;Lei Feng;Christopher Bevis
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- probe microscopy;
- AFM;
- 3D;
- EUV;
30.Process Context Based Wafer Level Grouping Control- An Advanced Overlay Process Correction designed for DRAM 1z nm node in High Volume Manufacturing

机译：基于过程上下文的晶圆级分组控制-为大规模生产中的DRAM 1z nm节点设计的高级覆盖过程校正
- 作者：Linmiao Zhang;William Susanto;Katsumasa Takahashi;Albert Chen;Tim Tang;Yi Zou;Chenxi Lin;Simon Hastings;Samee Ur Rehman;Manouk Rijpstra;Alfonso Sun
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Overlay;
- Advanced process correction;
- Wafer level control;
31.On Product Overlay Metrology Challenges in Advanced Nodes

机译：先进节点中的产品叠加计量学挑战
- 作者：Andrei Shchegrov;Philippe Leray;Yuri Paskovei;Liran Yerushalmi;Efi Megged;Yoav Grauer;Roel Gronheid
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- On Product Overlay (OPO);
- Overlay (OVL);
- DRAM;
- Logic;
- Foundry;
- 3D NAND;
- Extreme UV (EUV);
- Imaging-Based Overlay (IBO);
- Scatterometry Based Overlay (SCOL);
- Overlay metrology targets;
32.EUV Photoresist Reference Metrology Using TEM Tomography

机译：使用TEM层析成像的EUV光致抗蚀剂参考计量
- 作者：Mark Biedrzycki;Umesh Adiga;Andrew Barnum;Alain Moussa;Jason Arjavac;Rose Marie Haynes;Anne-Laure Charley;Phillipe Leray;Dmitry Batuk
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- TEM;
- EUV Photoresist;
- Reference Metrology;
- Tomography;
- Automated Metrology;
- Resist Encapsulation;
33.Novel on-product Focus Metrology for EUV enabling direct focus monitoring and control for EUV systems

机译：用于EUV的新型产品聚焦测量技术，可直接监视和控制EUV系统
- 作者：Inbeom Yim;Koshiba Dakeshi;Chan Hwang;Seung Yoon Lee;Jeongjin Lee;Joonsoo Park;Jenny Yueh;Ali Ghavami;Bart Segers;Miguel Garcia Granda;Yutao Gui;Eric Janda;Frank Staals;Se-Hui Lee;Seung-Bin Yang;Yoon-Tae Lee;Se-Ra Jeon;Daniel Park;Ewoud van West;Elliott McNamara
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Focus;
- EUV;
- DBF;
- accuracy;
- precision;
- multi wavelength;
- monitoring;
- control;
34.Using e-Beam inspection and overlay as tool for identifying process weaknesses in semiconductor processing

机译：使用电子束检查和叠加作为工具来识别半导体加工中的工艺缺陷
- 作者：Kwame Owusu-Boahen;Suraj Patil;Arun Vijayakumar;Alex Pate;Carl Han;Jorg Schwitzgebel;Chulwoo Kim;David J. Moreau
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- overlay misalignment;
- process window qualification;
- process margin;
- e-Beam;
- defect detection;
35.Mitigating gain, effort and cost for EOW Overlay Control

机译：减轻EOW覆盖控制的收益，工作量和成本
- 作者：Olivier Mermet;Maxime Gatefait;Didier Dabernat;Florent Dettoni;Benjamin Duclaux;Bertrand Le-Gratiet
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Overlay;
- Advanced Process control;
- High Order modeling;
- Correction per Exposure (CPE). Edge of Wafer;
- Scanner Table;
- Etch;
36.Optical Imaging Metrology Calibration using High Voltage Scanning Electron Microscope at After-Development Inspection for Advanced Processes

机译：在高级工艺的开发后检查中使用高压扫描电子显微镜对光学成像计量学进行校准
- 作者：N. Gutman;I. Tarshish;R. Gronheid;C. Dror;D. Michelsson;H Backhauss;L. Levin;V. Levinski;Y. Paskover;L. Yerushalmi;T. Heidrich;S. Czerkas;U. Pohlmann;F Laske
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
37.High-order field distortion correction using standalone alignment technology with modeling and sampling optimization

机译：使用独立对准技术进行建模和采样优化的高阶场失真校正
- 作者：Takehisa Yahiro;Katsushi Makino;Haruki Saito;Steven Tottewitz;Boris Habets;Patrick Lomtscher;Jiro Hanaue
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Alignment;
- Feed forward correction;
- field distortion;
- Process control;
- sampling plan optimization;
38.Optical Overlay Measurement Accuracy Improvement with Machine Learning

机译：通过机器学习提高光学覆盖测量精度
- 作者：Alexander Verner;Hyunsok Kim;Ikhyun Jeong;Seungwoo Koo;Dongjin Lee;Honggoo Lee;Boaz Ophir;Ohad Bachar;Liran Yerushalmi;Sanghuck Jeon;Dongsub Choi;Jeongpyo Lee
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- On Product Overlay (OPO);
- Overlay (OVL);
- Imaging-Based Overlay (IBO);
- Total Measurement Uncertainty (TMU);
- Machine Learning (ML);
- Accuracy;
- ADI;
- SEM;
- DRAM;
39.Statistical local CD uniformity with novel SEM noise reduction method

机译：利用新型SEM降噪方法统计局部CD均匀性
- 作者：Shinji Kobayashi
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Edge averaging method;
- image noise;
- unbiased LWR;
- measurement length;
- PSD;
- ACF;
- HHCF;
40.On-product focus monitoring and control for immersion lithography in 3D-NAND manufacturing

机译：3D-NAND制造中浸没式光刻的产品上焦点监控
- 作者：Amine Lakcher;Ahmed Zayed;Jennifer Shumway;Jan-Pieter van Delft;Gratiela Isai;Ruxandra Mustata;Arno van den Brink;Taeddy Kim;Jay Jung;Yong-Sik Shin;Soo-Kyung Lee;Paul Boecker;Mohamed El Kodadi;Geert Vinken;ChanHa Park;Sangjun Han;Jeongsu Park;Beomki Shin;Gunwoong Lee
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
41.A Novel Accurate and Robust Technique in After-Etch Overlay Metrology of 3D-NAND's Memory Holes

机译：3D-NAND存储器孔蚀刻后覆盖计量的一种新颖而精确的技术
- 作者：Yaobin Feng;Dean Wu;Pandeng Xuan;Pavel Izikson;Payne Qi;Huanian You;Yvon Chai;Jan Jitse Venselaar;Giulio Bottegal;Gonzalo Sanguinetti;Bert Verstraeten;Tjitte Nooitgedagt;Babak Mozooni
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- 3D-NAND;
- Metrology;
- Overlay;
- Robustness;
- After-etch;
- Intra-die stress;
- In-Device Metrology;
- DUV scanner;
- Lithography;
42.Realizing more accurate OPC models by utilizing SEM contours

机译：利用SEM轮廓实现更准确的OPC模型
- 作者：Chih-I Wei;Rajiv Sejpal;Yunfei Deng;Ir Kusnadi;Germain Fenger;Masahiro Oya;Yosuke Okamoto;Kotaro Maruyama;Yuichiro Yamazaki;Sayantan Das;Sandip Haider;Werner Gillijns
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- EUV Lithography;
- SEM Contour;
- Contour-based OPC Modeling;
- 5nm;
- Machine Learning;
43.EB metrology of Ge channel gate-all-around FET: Buckling evaluation and EB damage assessment

机译：Ge通道全能FET的EB测量：屈曲评估和EB损坏评估
- 作者：Takeyoshi Ohashi;Kazuhisa Hasumi;Masami Ikota;Gian Lorusso;Liesbeth Witters;Naoto Horiguchi
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- CD-SEM;
- EB metrology;
- Ge channel;
- gate-all-around;
- nanowire;
- EB damage;
- buckling;
44.Automated semiconductor wafer defect classification dealing with imbalanced data

机译：自动化半导体晶圆缺陷分类处理不平衡数据
- 作者：Po-Hsuan Lee;Zhe Wang;Cho Teh;Yi-Sing Hsiao;Wei Fang
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Automatic Defect Classification;
- semiconductor wafer inspection;
- SMOTE;
- machine learning;
- image classification;
- imbalanced dataset.;
45.SEM Image Quality Enhancement: An Unsupervised Deep Learning Approach

机译：SEM图像质量增强：一种无监督的深度学习方法
- 作者：Liangjiang Yu;Wentian Zhou;Lingling Pu;Wei Fang
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- SEM;
- E-beam;
- Wafer Inspection;
- Unsupervised;
- CNN;
- IQE;
- Throughput;
46.Massive metrology for process development and monitoring applications

机译：用于过程开发和监控应用的大规模计量
- 作者：Kaushik Sah;Sayantan Das;Shifang Li;Christophe Beral;Andrew Cross;Sandip Halder
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- High Sampling Metrology;
- High Spatial Resolution;
- Process Control;
- Process Variation;
- Metrospection;
47.Enabling Accurate and Robust Optical Metrology of In Device Overlay

机译：实现器件内覆盖的准确和鲁棒的光学计量
- 作者：Min-Seok Kang;Chan Hwang;Seungyoon Lee;Jeongjin Lee;Joon-Soo Park;Christian Leewis;Eun-Ji Yang;Do-Haeng Lee;James Lee;Sabil Huda;Noh-Kyoung Park;Anagnostis Tsiatmas;Giulio Bottegal;Amy Wang;Filippo Belletti;Jan Jitse Venselaai;Giacomo Miceli;Izabela Saj;Sam Chen
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Machine Learning;
- Overlay;
- Optical Metrology;
- robustness;
- DRAM;
- after etch;
- in device measurements;
- self-reference;
48.Contour extraction algorithm for edge placement error measurement using machine learning

机译：利用机器学习进行轮廓线边缘误差测量的轮廓提取算法
- 作者：Yosuke Okamoto;Shinichi Nakazawa;Akinori Kawamura;Tsugihiko Haga;Taihei Mori;Kotaro Maruyama;Seul-Ki Kang;Yuichiro Yamazaki
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- D2DB;
- Contour Extraction;
- Machine Learning;
- Edge Placement Error;
49.Color filter and numeric aperture selections for image based overlay measurement in critical recording head manufacturing process

机译：彩色滤光片和数字孔径选择，用于关键记录头制造过程中基于图像的覆盖测量
- 作者：Gavin Mathias;Yi Liu;Richard Schuster;Aaron Bowser
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Overlay (OVL);
- BiB;
- AIM;
- metrology;
- Image-Based Overlay (IBO);
- Total Measurement Uncertainty (TMU);
- Qmerit;
- Tool Introduced Shift (TIS);
- through focus contrast precision;
50.Machine Learning for Tool Induced Shift (TIS) Reduction

机译：机器学习以减少工具引起的换档（TIS）
- 作者：Shlomit Katz;Boaz Ophir;Udi Shusterman;Anna Golotsvan;Liran Yerushalmi;Efi Megged;Yoav Grauer;Jian Zhang;Alimei Shih;Shi-Ming Wei;Judith Yap;Fiona (Shuk Fan) Leung;Pek Beng Ong
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
51.OPO Residuals Reduction with Imaging Metrology Color Per Layer Mode

机译：通过每层成像计量颜色减少OPO残差
- 作者：Shlomit Katz;Honggoo Lee;Dongyoung Lee;Jinsoo Kim;Jaesun Woo;Chunsoo Kang;Chanha Park;Dohwa Lee;Seongjae Lee;Sanghuck Jeon;Dongsub Choi;Anna Golotsvan;Roie Volkovich;Efi Megged
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Overlay (OVL);
- Metrology;
- Inspection;
- Photolithography;
- Foundry;
- DRAM;
- 3D NAND;
- Color Per Layer (CPL);
- Dual-Bandwidth Filters (DBW);
52.A Trainable Die-To-Database for Fast e-Beam Inspection: Learning Normal Images to Detect Defects

机译：用于快速电子束检查的可训练模具到数据库：学习普通图像以检测缺陷
- 作者：Masanori Ouchi;Masayoshi Ishikawa;Shinichi Shinoda;Yasutaka Toyoda;Ryo Yumiba;Hiroyuki Shindo;Masayuki Izawa
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Inspection;
- Defect detection;
- Image processing;
- Machine learning;
- Lithography;
- Scanning electron microscope;
53.A Strengthen Mask r-CNN Method for PFA Image Measurement

机译：用于PFA图像测量的增强掩模r-CNN方法
- 作者：Tung-Yu Wu;Chun Yen Liao;Chun-Hung Lin;Kao-Tsai Tsai;Jun-Sheng Wu;Chao-Yi Huang
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
54.A novel high throughput probe microscope: for measuring 3D structures, designed for In-line, integrated or standalone operation

机译：新型高通量探针显微镜：用于在线，集成或独立操作的3D结构测量
- 作者：A. D. L. Humphris;L. Feng;M. Tedaldi;L. Mudarikwa;D. Ockwell;J. Goulden
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Probe microscope;
- AFM;
- wafer;
- mask;
55.OPO RESIDUALS IMPROVEMENT WITH IMAGING METROLOGY FOR 3D NAND

机译：3D NAND成像技术的OPO残差改进
- 作者：Shlomit Katz;Anna Golotsvan;Yoav Grauer;Efi Megged;Greg Gray;Fiona (Shuk Fan)Leung;Pek Beng Ong;Lei Shi;Jeremy (Shi-Ming) Wei;Wayne (Wei) Zhou;Linfei Gao
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
56.Photosensitive organic insulator photo-cell monitoring through advanced macro inspection

机译：通过先进的宏观检测对光敏有机绝缘子光电池进行监控
- 作者：A.Corno;A.Bordogna;M.Braga;A.Pescalli;F.Ferrario;U.Iessi;P.Canestrari;P.Sharma;M.Salamone;P.Parisi;T. Groos
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
57.Enhancing the applications space of diffraction based overlay metrology by increasing throughput and target pitch flexibility

机译：通过增加吞吐量和目标间距灵活性，扩大基于衍射的叠加计量学的应用空间
- 作者：Simon Mathijssen;Herman Heijmerikx;Farzad Farhadzadeh;Marc Noot;Lineke van der Sneppen;Longfei Shen;Fei Jia;Jolly Xu;Huajun Qin;Arie den Boef;Elliott Me Namara;Kaustuve Bhattacharyya;Chao Fang;Yaobin Feng
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
58.Wavelength influence on the determination of subwavelength grating parameters by using optical scatterometry

机译：波长对光散射法测定亚波长光栅参数的影响
- 作者：Lauryna Siaudinyte;Silvania F. Pereira
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Coherent Fourier scatterometry;
- optical scatterometry;
- coherent light;
- far field;
- near field;
- subwavelength grating;
- grating parameters;
- sensitivity;
59.Nano-scale molecular analysis of positive tone photo-resist films with varying dose

机译：剂量变化的正型光刻胶膜的纳米尺度分子分析
- 作者：Michael J. Eller;Mingqi Li;Xisen Hou;Stanislav V. Verkhoturov;Emile A. Schweikert;Peter Trefonas
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Mass spectrometry;
- exposure dose;
- cluster SIMS;
- chemically amplified resist;
- development;
- photoacid generator;
- molecular characterization;
- nanoscale analysis;
60.Improved Device Overlay by Lit ho Aberration Tracking with Novel Target Design for DRAM

机译：通过小像差跟踪和新颖的DRAM目标设计改善了设备覆盖
- 作者：Xiaolei Liu;Eitan Hajaj;Alon Volfman;Hedvi Spielberg;Yoav Grauer;Raviv Yohanan;Xindong Gao
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
61.OPO Reduction by Novel Target Design

机译：通过新颖的目标设计减少OPO
- 作者：Zephyr Liu;Eitan Hajaj;Ira Naot;Raviv Yohanan;Yoav Grauer
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- On Product Overlay (OPO);
- Overlay (OVL);
- rAIM™;
- AIM®;
- Total Measurement Uncertainty (TMU);
- Accuracy;
- DRAM;
- Foundry Logic;
- 3D NAND;
62.High speed roughness measurement on blank silicon wafers using wave front phase imaging

机译：使用波前相位成像技术对空白硅晶片进行高速粗糙度测量
- 作者：J.M. Trujillo-Sevilla;J.M. Ramos-Rodriguez;J. Gaudestad
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
63.Improving after-etch overlay performance using high-density in- device metrology in DRAM manufacturing

机译：在DRAM制造中使用高密度的器件计量技术来提高蚀刻后覆盖性能
- 作者：Ik-Hyun Jeong;Seung-Woo Koo;Hyun-Sok Kim;Jung-Il Hwang;Dong-Jin Lee;Min- Shik Kim;Jae-Wuk Ju;Kang-Min Lee;Young-Sik Kim;Cees Lambregts;Rizvi Rahman;Marc Hauptmann;Raheleh Pishkari;Allwyn Boustheen;Kwang-Young Hu;Paul Boecker;Dong-Hak Lee;In-Ho Joo;Kang-San Lee
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
64.The improvement of measurement accuracy of SADP pitch walking issue

机译：SADP俯仰步行问题测量精度的提高
- 作者：Pei Liu;Cheng-Zhang Wu;Hung-Wen Chao;Wenzhan Zhou;Yu Zhang;Chan-Yuan Hu;Yujie Xu;Jhen-Cyuan Li;Yen-Chan Chiu;Chun-Han Liu;Ran-Fu Yang;Chi-Hung Wang
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- FinFET;
- SADP;
- Pitch Walking;
- CD;
- CD-SEM;
- TEM;
- Calibration;
65.Metrology of 3D-NAND Structures using Machine Learning Assisted Fast Marching Level-Sets Algorithm

机译：使用机器学习辅助快速行进水平集算法的3D-NAND结构计量
- 作者：Umesh Adiga;Derek Higgins;Sang Hoon Lee;Mark Biedrzycki;Dan Nelson
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- Memory;
- 3D-NAND;
- Fast-marching;
- Level-sets;
66.High speed, high accuracy displacement extraction from sinusoidal like Moire fringes in a novel optical encoding technology

机译：利用新颖的光学编码技术从正弦形像莫尔条纹的高速，高精度位移提取
- 作者：Zhijian Zhong;Chenyi Li;Shiguang Li;Penghao Li;Qingcheng Ma;Haoyuan Zhao;Jing Zhang;Yayi Wei
- 会议名称：《Conference on Metrology, Inspection, and Process Control for Microlithography》 | 2020年
- displacement measurement;
- Moire fringe;
- optical encoder;
- digital grating;
- phase extraction;
- algorithm;