掌桥科研
一站式科研服务平台
科技查新
收录引用
专题文献代查
外文数据库(机构版)
更多产品
首页
成为会员
我要充值
退出
我的积分:
中文会员
开通
中文文献批量获取
外文会员
开通
外文文献批量获取
我的订单
会员中心
我的包量
我的余额
登录/注册
文献导航
中文期刊
>
中文会议
>
中文学位
>
中国专利
>
外文期刊
>
外文会议
>
外文学位
>
外国专利
>
外文OA文献
>
外文科技报告
>
中文图书
>
外文图书
>
工业技术
基础科学
医药卫生
农业科学
教科文艺
经济财政
社会科学
哲学政法
其他
工业技术
基础科学
医药卫生
农业科学
教科文艺
经济财政
社会科学
哲学政法
其他
自然科学总论
数学、物理、化学、力学
天文学、地球科学
生物科技
医学、药学、卫生
航空航天、军事
农林牧渔
机械、仪表工业
化工、能源
冶金矿业
电子学、通信
计算机、自动化
土木、建筑、水利
交通运输
轻工业技术
材料科学
电工技术
一般工业技术
环境科学、安全科学
图书馆学、情报学
社会科学
其他
马克思主义、列宁主义、毛泽东思想、邓小平理论
哲学、宗教
社会科学总论
政治、法律
军事
经济
文化、科学、教育、体育
语言、文字
文学
艺术
历史、地理
自然科学总论
数理科学和化学
天文学、地球科学
生物科学
医药、卫生
农业科学
工业技术
交通运输
航空、航天
环境科学、安全科学
综合性图书
自然科学总论
数学、物理、化学、力学
天文学、地球科学
生物科技
医学、药学、卫生
航空航天、军事
农林牧渔
机械、仪表工业
化工、能源
冶金矿业
电子学、通信
计算机、自动化
土木、建筑、水利
交通运输
轻工业技术
材料科学
电工技术
一般工业技术
环境科学、安全科学
图书馆学、情报学
社会科学
其他
自然科学总论
数学、物理、化学、力学
天文学、地球科学
生物科技
医学、药学、卫生
航空航天、军事
农林牧渔
机械、仪表工业
化工、能源
冶金矿业
电子学、通信
计算机、自动化
土木、建筑、水利
交通运输
轻工业技术
电工技术
一般工业技术
环境科学、安全科学
图书馆学、情报学
社会科学
其他
自然科学总论
数学、物理、化学、力学
天文学、地球科学
生物科技
医学、药学、卫生
航空航天、军事
农林牧渔
机械、仪表工业
化工、能源
冶金矿业
电子学、通信
计算机、自动化
土木、建筑、水利
交通运输
轻工业技术
材料科学
电工技术
一般工业技术
环境科学、安全科学
图书馆学、情报学
社会科学
其他
美国国防部AD报告
美国能源部DE报告
美国航空航天局NASA报告
美国商务部PB报告
外军国防科技报告
美国国防部
美国参联会主席指示
美国海军
美国空军
美国陆军
美国海军陆战队
美国国防技术信息中心(DTIC)
美军标
美国航空航天局(NASA)
战略与国际研究中心
美国国土安全数字图书馆
美国科学研究出版社
兰德公司
美国政府问责局
香港科技大学图书馆
美国海军研究生院图书馆
OALIB数据库
在线学术档案数据库
数字空间系统
剑桥大学机构知识库
欧洲核子研究中心机构库
美国密西根大学论文库
美国政府出版局(GPO)
加利福尼亚大学数字图书馆
美国国家学术出版社
美国国防大学出版社
美国能源部文献库
美国国防高级研究计划局
美国陆军协会
美国陆军研究实验室
英国空军
美国国家科学基金会
美国战略与国际研究中心-导弹威胁网
美国科学与国际安全研究所
法国国际关系战略研究院
法国国际关系研究所
国际宇航联合会
美国防务日报
国会研究处
美国海运司令部
北约
盟军快速反应部队
北约浅水行动卓越中心
北约盟军地面部队司令部
北约通信信息局
北约稳定政策卓越中心
美国国会研究服务处
美国国防预算办公室
美国陆军技术手册
一般OA
科技期刊论文
科技会议论文
图书
科技报告
科技专著
标准
其它
美国卫生研究院文献
分子生物学
神经科学
药学
外科
临床神经病学
肿瘤学
细胞生物学
遗传学
公共卫生&环境&职业病
应用微生物学
全科医学
免疫学
动物学
精神病学
兽医学
心血管
放射&核医学&医学影像学
儿科
医学进展
微生物学
护理学
生物学
牙科&口腔外科
毒理学
生理学
医院管理
妇产科学
病理学
生化技术
胃肠&肝脏病学
运动科学
心理学
营养学
血液学
泌尿科学&肾病学
生物医学工程
感染病
生物物理学
矫形
外周血管病
药物化学
皮肤病学
康复学
眼科学
行为科学
呼吸学
进化生物学
老年医学
耳鼻喉科学
发育生物学
寄生虫学
病毒学
医学实验室检查技术
生殖生物学
风湿病学
麻醉学
危重病护理
生物材料
移植
医学情报
其他学科
人类生活必需品
作业;运输
化学;冶金
纺织;造纸
固定建筑物
机械工程;照明;加热;武器;爆破
物理
电学
人类生活必需品
作业;运输
化学;冶金
纺织;造纸
固定建筑物
机械工程;照明;加热;武器;爆破
物理
电学
马克思主义、列宁主义、毛泽东思想、邓小平理论
哲学、宗教
社会科学总论
政治、法律
军事
经济
文化、科学、教育、体育
语言、文字
文学
艺术
历史、地理
自然科学总论
数理科学和化学
天文学、地球科学
生物科学
医药、卫生
农业科学
工业技术
交通运输
航空、航天
环境科学、安全科学
综合性图书
主题
主题
题名
作者
关键词
摘要
高级搜索 >
外文期刊
外文会议
外文学位
外国专利
外文图书
外文OA文献
中文期刊
中文会议
中文学位
中国专利
中文图书
外文科技报告
清除
历史搜索
清空历史
首页
>
外文会议
>
IEEE CPMT Symposium Japan
IEEE CPMT Symposium Japan
召开年:
2014
召开地:
Kyoto(JP)
出版时间:
-
会议文集:
-
会议论文
热门论文
全部论文
全选(
0
)
清除
导出
1.
Organic-inorganic hybrid materials for wavelength division multiplexing filter in self-written waveguide module
机译:
自写波导模块中用于波分复用滤波器的有机-无机杂化材料
作者:
Sugihara Okihiro
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
optical communication;
optical filters;
optical waveguides;
organic-inorganic hybrid materials;
refractive index;
spin coating;
wavelength division multiplexing;
LISW optical waveguide;
UV-curing;
bi-directional process;
insertion loss;
light-induced self-written optical waveguide;
multilayer filter;
mutual spin-coating;
optical communication wavelength demultiplexing;
optical module;
organic-inorganic hybrid material;
photocurable resin;
refractive index;
wavelength division multiplexing filter;
Filtering theory;
Nonhomogeneous media;
Optical fiber filters;
Optical fibers;
light-induced self-written waveguide;
multilayer filter;
optical module;
organic-inorganic hybrid materials;
2.
Photosensitive insulation coating for a copper redistribution layer process
机译:
用于铜再分布层工艺的光敏绝缘涂料
作者:
Matsutani Hiroshi
;
Mitsukura Kazuyuki
;
Makino Tatsuya
;
Duval Fabrice
;
Detalle Mikael
;
Miller Alice
;
Beyne Eric
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
coating techniques;
copper;
dielectric materials;
insulation;
integrated circuit interconnections;
mechanical properties;
photolithography;
three-dimensional integrated circuits;
CA6001B;
RDL structures;
copper interconnection;
copper redistribution layer process;
dielectric layer coatings;
electrical measurement;
interposer processing TSV;
lithographic performance;
mechanical performance;
minimum resolution;
patterned insulation layers;
positive-tone photosensitive insulation coating;
test wafer processing;
through-silicon via;
Coatings;
Copper;
Dielectrics;
Electric variables measurement;
Insulation;
Silicon;
Through-silicon vias;
TSV;
dielectric;
interposer;
redistribution;
resolution;
stress;
3.
Plenary invited
机译:
全体会议邀请
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
Visualization;
Waveguide components;
4.
Visualization of tissue collagen with femtosecond laser: application to skin diagnosis and cell culture
机译:
飞秒激光可视化组织胶原蛋白:在皮肤诊断和细胞培养中的应用
作者:
Araki Takeshi
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
biomedical engineering;
biomedical equipment;
biomedical optical imaging;
cellular biophysics;
high-speed optical techniques;
laser applications in medicine;
molecular biophysics;
molecular configurations;
optical harmonic generation;
optical microscopy;
proteins;
skin;
SHG microscopy application;
cell culture application;
cell culture engineering;
femtosecond laser;
noninvasive collagen structure observation;
nonstaining collagen structure observation;
second harmonic generation microscopy;
skin diagnosis application;
tissue collagen visualization;
Laser mode locking;
Measurement by laser beam;
Microscopy;
Optical attenuators;
Optical fiber polarization;
Optical microscopy;
Skin;
SHG light;
collagen;
engineered cell;
in situ visualization;
laser microscope;
5.
Over-1000-channel hybrid integrated light source with laser diode arrays on a silicon waveguide platform for ultra-high-bandwidth optical interconnections
机译:
硅波导平台上具有激光二极管阵列的1000通道以上混合集成光源,用于超高带宽光学互连
作者:
Shimizu Tsuyoshi
;
Hatori Nobuaki
;
Ishizaka Masashige
;
Yamamoto Takayuki
;
Nakamura T.
;
Okano Makoto
;
Mori Marco
;
Arakawa Yasuhiko
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
elemental semiconductors;
integrated optics;
integrated optoelectronics;
light interference;
light sources;
optical interconnections;
optical waveguides;
optimisation;
semiconductor laser arrays;
silicon;
Si;
bit rate 10 Tbit/s;
laser diode array chips;
multichannel hybrid integrated light source;
over-1000-channel hybrid integrated light source;
photonics-electronics convergence system;
power consumption;
silicon waveguide platform;
thermal interference;
ultrahigh-bandwidth interchip interconnections;
ultrahigh-bandwidth optical interconnections;
Integrated optics;
Interference;
Light sources;
Optical arrays;
Optical interconnections;
Optical waveguides;
Silicon;
Diode Laser Array;
Hybrid Integration;
Optical Interconnection;
6.
Evaluation of thermal interface material with electric capacitance measurement: A new method using metal meshes to present finer surface roughness levels
机译:
通过电容测量评估热界面材料:一种使用金属网格呈现更精细表面粗糙度的新方法
作者:
Saito Yuya
;
Suzuki Satoshi
;
Komuro Takanori
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
capacitance measurement;
contact resistance;
heat sinks;
surface roughness;
thermal resistance;
thermal resistance measurement;
electric capacitance measurement;
electrical capacitance measurement;
electronic devices;
heat sink;
metal meshes;
surface roughness;
thermal contact resistance;
thermal interface material evaluation;
thermal interface materials;
thermal resistance measurement;
Capacitance;
Capacitance measurement;
Heat sinks;
Materials;
Metals;
Thermal resistance;
Asker C hardness;
Capacitance measurement;
Thermal interface material;
Thermal resistance;
7.
Highly moisture resistant IGZO films with a barrier layer for flexible transparent conductive substrates
机译:
具有防潮层的高耐湿性IGZO膜,用于柔性透明导电基板
作者:
Nagamoto Koichi
;
Hara Tenshi
;
Sakuma H.
;
Ishii Kazuki
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
II-VI semiconductors;
electric properties;
flexible electronics;
gallium;
glass;
indium;
moisture;
plastics;
sputter deposition;
substrates;
ultraviolet spectra;
visible spectra;
zinc compounds;
DC magnetron sputtering method;
IGZO films;
ZnO:Ga,In;
alkali free glass;
barrier layer;
electrical properties;
flexible display;
flexible sensor electrode;
flexible transparent conductive substrates;
high gas barrier plastic substrates;
highly transparent conductive polycrystalline;
lighting application;
moisture resistant films;
solar cell application;
structural properties;
Films;
Glass;
Moisture;
Plastics;
Resistance;
Substrates;
Zinc oxide;
Flexible Devices;
GZO;
Gas barrier films;
IGZO;
Transperent Conducitive oxide (TCO);
Zinc Oxide;
8.
Analysis of novel technology for power and signal integrity using a metal particle conductive layer
机译:
使用金属粒子导电层分析功率和信号完整性的新技术
作者:
Sasaoka Naoto
;
Oono Masato
;
Ueda Chihiro
;
Otsuka Kanji
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
power cables;
power electronics;
printed circuits;
PCB;
binder resin;
clock frequency;
conductive paste;
electronic circuits;
electronic systems;
frequency 1 GHz to 5 GHz;
ground lines;
metal particle conductive layer;
polyimide copper clad laminate;
power integrity;
power lines;
printed circuit boards;
signal integrity;
silver flakes;
size 60 mum;
transmission line test coupon measurements;
Conductivity;
Curing;
Dielectrics;
Metals;
Polyimides;
Power transmission lines;
Transmission line measurements;
impedance;
power integrity;
signal integrity;
9.
A feasibility study of novel packaging technology for low cost and high performance systems
机译:
用于低成本和高性能系统的新型包装技术的可行性研究
作者:
Iguchi Daisuke
;
Umekawa Hideyuki
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
electronics packaging;
high-k dielectric thin films;
integrated circuit interconnections;
system-on-chip;
3d electromagnetic modeling;
PDN characteristics;
PDN impedance;
SoC;
ground planes;
high-dielectric ultra thin film;
interposer;
large scale system on chips;
low impedance power distribution route;
packaging technology;
power distribution network characteristics;
Capacitors;
Impedance;
Inductance;
Packaging;
Power distribution;
Semiconductor device measurement;
System-on-chip;
capacitor;
power distribution network;
power integrity;
system on chip;
10.
A study on differential mode to common mode conversion due to asymmetric structure in differential transmission line
机译:
差分传输线中非对称结构引起的差分模式到共模转换的研究
作者:
Motohashi Ayumi
;
Nakamoto Fujiyuki
;
Sasaki Yutaka
;
Oka Naoto
;
Oh-Hashi Hideyuki
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
capacitors;
electromagnetic interference;
electromagnetic waves;
equivalent circuits;
high-speed integrated circuits;
transmission lines;
EMI equipment design stage;
additional patterns;
asymmetric structure;
capacitance;
common mode signal conversion ratio evaluation;
differential mode signal;
differential transmission line;
electrical components;
electromagnetic radiation performance;
equivalent circuit model;
high electrical balance degration;
high speed digital interconnections;
shunt capacitor;
Arresters;
Capacitance;
Capacitors;
Integrated circuit modeling;
Metals;
Power transmission lines;
Transmission line measurements;
EMC;
EMI;
common-mode signal;
component;
differential transmission line;
11.
A compact 25-Gbit/s ?? 4ch optical interconnect module with straddle-shaped optical and electrical interface
机译:
紧凑型25 Gb / s ??具有跨形光电接口的4通道光学互连模块
作者:
Matsuoka Yasutaka
;
Yong Lee
;
Arimoto Hideo
;
Sato Mitsuhisa
;
Komatsuzaki Shinji
;
Ogura Akira
;
Yamazaki Kinya
;
Sunaga Yoshinori
;
Takai Toshiaki
;
Chujo Norio
;
Matsushima Naoki
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
electro-optical devices;
integrated optics;
integrated optoelectronics;
optical communication equipment;
optical couplers;
optical fabrication;
optical interconnections;
EOM fabrication;
bit rate 25 Gbit/s;
compact optical interconnect module;
electrical interface;
embedded optical module;
error-free optical transmission;
high transmission density;
on-board optical interconnections;
optical-coupling tolerance;
rack-to-rack optical interconnections;
straddle-shaped optical interface;
High-speed optical techniques;
Integrated optics;
Optical coupling;
Optical crosstalk;
Optical device fabrication;
Optical interconnections;
Optical transmitters;
compact;
interconnect;
module;
optical;
12.
IO interface for over 25Gbps operation with low power
机译:
IO接口可实现25Gbps以上的低功耗运行
作者:
Otsuka Kanji
;
Fujii Fumiaki
;
Akiyama Yoko
;
Hashimoto Koji
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
CMOS integrated circuits;
adaptive equalisers;
low-power electronics;
power consumption;
transistor circuits;
CMOS transistor;
IO circuit;
IO interface;
IO receiver;
IO transmitter;
Interlaken protocols;
SerDes protocols;
adaptive equalizer;
balanced concurrent design;
board design;
chip design;
cloud computing;
high bandwidth IO systems;
low power consumption;
mother board wiring;
open termination circuit system;
parasitic capacitances;
plug-in board;
timing adjust circuits;
CMOS integrated circuits;
Clocks;
Receivers;
Silicon;
Standards;
Timing;
Wiring;
high band I/O interface;
low power IO;
ultra high speed IOs;
13.
Fabrication for low-loss polymer optical waveguides with 90° bending using the Mosquito method
机译:
使用Mosquito方法制造弯曲90°的低损耗聚合物光波导
作者:
Takahashi Asami
;
Ishigure Takaaki
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
gradient index optics;
optical fabrication;
optical losses;
optical polymers;
optical waveguides;
90° bending;
Mosquito method;
graded index circular core multimode polymer optical waveguides;
low bending loss;
low-loss polymer optical waveguide fabrication;
radius 1 mm;
Insertion loss;
Loss measurement;
Optical device fabrication;
Optical interconnections;
Optical polymers;
Optical waveguides;
boardlevel integration;
optoelectronics packaging subsystems;
polymer optical waveguide;
14.
Novel exposure system for FOWLP and MCM photolithopraphy process
机译:
用于FOWLP和MCM光刻的新型曝光系统
作者:
kitamura Kokoro
;
Nakai K.
;
Matsui H.
;
Nagao T.
;
Norimitsu Y.
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
multichip modules;
photolithography;
reticles;
substrates;
wafer level packaging;
MCM photolithography process;
alignment exposure;
direct imaging technology;
exposure system;
fan-out WLP;
fan-out process;
mold substrate;
no-mask;
reconfigured substrate;
reticle;
silicon chips;
wafer level package;
Current measurement;
Design automation;
Displacement measurement;
Position measurement;
Resists;
Semiconductor device measurement;
Substrates;
Compensation of chip displacement;
Direct imaging;
FOWLP;
Fan-Out;
Maskless;
WLP;
15.
In-situ analysis of electrical conductivity evolution in epoxy-based conductive adhesives with Ag loading during curing process
机译:
含Ag的环氧树脂基导电胶固化过程中电导率演化的原位分析
作者:
Inoue M.
;
Sakaniwa Yoshiaki
;
Tada Yasunori
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
conductive adhesives;
curing;
electrical conductivity;
molecules;
resins;
silver;
Ag;
ECA;
binder molecules;
curing process;
electrical conductivity evolution;
electrically conductive adhesives;
epoxy-based binders;
epoxy-based conductive adhesives;
free-damped oscillation method;
gap width;
inter-filler chemistry;
inter-filler electrical conductance;
interface chemistry;
viscoelastic characterization;
Chemistry;
Conductive adhesives;
Conductivity;
Curing;
Monitoring;
Oscillators;
Resistance;
ECAs;
binder chemistry;
curing;
electrical conductivity;
viscoelastic characterization;
16.
Silica nanowires as new coating material for high-efficiency light reflection in LED system
机译:
二氧化硅纳米线是用于LED系统中高效光反射的新型涂层材料
作者:
Shuang Xi
;
Tielin Shi
;
Xiaoping Li
;
Zirong Tang
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
electronics packaging;
integrated optics;
integrated optoelectronics;
light emitting diodes;
lighting;
nanophotonics;
nanowires;
optical elements;
optical films;
silicon compounds;
LED reflector;
LED system;
SiOsub2/sub;
Van der Waals' force;
artful magnetic stirring;
high-efficiency light reflection;
high-efficiency optoelectronic packaging;
lighting systems;
optical coating material;
silica nanowires;
visible wavelength;
Coatings;
Light emitting diodes;
Nanowires;
Optical reflection;
Silicon compounds;
Surface treatment;
LED;
diffusive reflection;
packaging;
silica nanowires;
17.
Soldering material for fine PoP (Package on Package)
机译:
精细PoP的焊接材料(封装封装)
作者:
Hashimoto Yo
;
Nakano Shunsuke
;
Takagi Kazuyoshi
;
Kawamata Yuji
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
fine-pitch technology;
packaging;
soldering;
Type6;
fine PoP;
finer powder;
package on package;
size 0.3 mm;
soldering material;
Hip;
Joints;
Nitrogen;
Powders;
Soldering;
0.3mm pitch BGA;
Soldering;
dippable paste;
18.
Highly heat-resistant bio-based nanofiber substrate for flexible electronics
机译:
高耐热生物基纳米纤维基板,用于柔性电子
作者:
Ming-chun Hsieh
;
Koga Hirotaka
;
Nogi Masaya
;
Suganuma Katsuaki
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
flexible electronics;
nanofibres;
nanoparticles;
substrates;
cellulose nanofibers;
flexible electronics;
heat-resistant bio-based nanofiber substrate;
heat-resistant nanopaper substrates;
silver nanoparticle lines;
size 15 nm to 60 nm;
Conductivity;
Heating;
Ink;
Nanoparticles;
Silver;
Substrates;
Printed electronics;
cellulose nanofiber;
flexible substrates;
19.
Electro-migration behavior in fine pitch SnBi eutectic solder bump interconnections
机译:
细间距SnBi共晶焊料凸点互连中的电迁移行为
作者:
Murayama Kei
;
Aizawa Mitsuhiro
;
Kurihara Takashi
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
electromigration;
integrated circuit interconnections;
solders;
tin compounds;
electromigration behavior;
fine pitch SnBi eutectic solder bump interconnections;
size 25 mum;
size 75 mum;
Bismuth;
Current density;
Gold;
Nickel;
Resistance;
Substrates;
Tin;
Electro-migration;
Fine pitch bump;
SnBi solder;
20.
Improvement of power integrity with thin film capacitors embedded in organic interposer
机译:
嵌入在有机中介层中的薄膜电容器改善了电源完整性
作者:
Yoshizawa Masamitsu
;
Oyamada Seisei
;
Hattori Asobu
;
Nakura Toru
;
Asada Kunihiro
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
large scale integration;
thin film capacitors;
LSI;
Shmoo plots;
on-chip MOS capacitor;
organic interposer;
power integrity;
resonant power supply noise reduction;
thin film capacitors;
Capacitance;
Capacitors;
Large scale integration;
MOS capacitors;
Noise;
Power supplies;
System-on-chip;
embedded capacitor;
interposer;
power integrity;
power supply noise;
thin film capacitor;
21.
Precision assembly of polymer waveguide components for silicon photonic packaging
机译:
用于硅光子封装的聚合物波导组件的精密组装
作者:
Taira Yoichi
;
Numata Hidetoshi
;
Barwicz Tymon
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
elemental semiconductors;
integrated circuit packaging;
nanophotonics;
optical polymers;
optical waveguides;
silicon;
Si;
computer communication;
datacom;
fiber cable;
nanophotonics technology;
optical connector;
optical input/output coupling;
optical polymer waveguides;
optical signals;
photonic packaging;
telecom;
Assembly;
Nanophotonics;
Optical fiber cables;
Optical fiber couplers;
Polymers;
Silicon;
fiber coupler;
passive alignment;
poylmer waveguide film;
silicon photonics;
22.
Simulation of differential skew considering fiber kink effects
机译:
考虑光纤扭结效应的微分偏斜仿真
作者:
Fukumori Taiga
;
Nagaoka Hideaki
;
Mizutani Daisuke
;
Tani Motoaki
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
glass;
insulating materials;
optical fibres;
optical interconnections;
permittivity;
resins;
synchronisation;
cascade connections;
circuit board;
conductor lines;
dielectric constant;
differential signal transmission lines;
differential skew;
fiber kink effects;
glass-cloth-containing insulating layer;
glass-threads;
signal transmission rates;
skew distributions;
transmission delay time difference;
Analytical models;
Integrated circuit modeling;
Printed circuits;
Probability distribution;
Stripline;
Weaving;
Yarn;
Gbps;
glass-cloth;
kink;
probability distribution function;
simulation;
skew;
weave;
yarn;
23.
Development of combined surface activated bonding (SAB) method for hydrophilic wafer bonding
机译:
亲水性晶圆键合的组合表面活化键合(SAB)方法的发展
作者:
He Ruisi
;
Fujino Masahisa
;
Suga Takashi
;
Yamauchi Akira
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
surface treatment;
wafer bonding;
SAB method;
hydrophilic wafer bonding;
relative humidity;
surface activated bonding method;
Bonding;
Ion beams;
Plasma temperature;
Silicon;
Surface treatment;
Wafer bonding;
combined surface activated bonding (SAB);
hydrophilic bonding in vacuum;
wafer bonding;
24.
High speed LCP board for 28Gbps transmission through 300mm
机译:
高速LCP板,可通过300mm传输28Gbps
作者:
Kataoka Ryohei
;
Kondo K.
;
Akimich Jun
;
Akiyama Yoko
;
Hashimoto Koji
;
Otsuka Kanji
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
liquid crystal polymers;
printed circuits;
PALAP process;
bit rate 28 Gbit/s;
cloud computing communication;
enterprise routers;
enterprise servers;
fine pitch wiring;
high speed LCP board;
liquid crystal polymer;
magnitude higher bandwidth;
size 300 mm;
Bandwidth;
Copper;
Dielectrics;
Materials;
Rough surfaces;
Surface roughness;
Wiring;
I/O interface wiring;
high speed PC board;
ultra high speed wiring;
25.
Fabrication and electrical characterization of Parylene-HT liner bottom-up copper filled through silicon via (TSV)
机译:
通过硅通孔(TSV)填充的对二甲苯-HT衬里自底向上的铜的制备和电特性
作者:
Bui Thanh Tung
;
Xiaojin Cheng
;
Watanabe N.
;
Kato Fumiki
;
Kikuchi Kazuro
;
Aoyagi Masahiro
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
copper;
electric properties;
electroplating;
etching;
integrated circuit manufacture;
organic insulating materials;
permittivity;
polymers;
silicon;
three-dimensional integrated circuits;
vapour deposition;
Cu;
DC leakage;
Si;
TSV;
bottom-up copper filled through silicon via;
dielectric constant;
electrical characterization;
electrical properties;
electroplating processes;
insulation;
parylene vapor deposition;
parylene-HT insulator;
parylene-HT liner;
size 1 mum;
size 100 mum;
size 3 mum;
temperature tolerance;
through via etching;
Capacitance;
Copper;
Fabrication;
Insulators;
Silicon;
Substrates;
Through-silicon vias;
Parylene-HT;
TSV;
TSV liner;
bottom-up copper filled;
electroplating;
26.
Miniaturized LTE modem SiP using novel multiple compartments shielding
机译:
使用新型多隔室屏蔽的小型化LTE调制解调器SiP
作者:
Leou Jl
;
Chen Vincent
;
Chen Jiann-Jong
;
Wang Tao
;
Chang H.
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
Long Term Evolution;
analogue circuits;
digital circuits;
electromagnetic interference;
electromagnetic shielding;
interference suppression;
modems;
telecommunication network reliability;
3GPP LTE category 3;
CE EMI regulatory tests;
FCC EMI regulatory tests;
GCF certification;
PTCRB certification;
RF circuits;
SiP;
analog circuits;
compartment shielding process;
digital circuits;
miniaturized LTE modem;
multiple compartments shielding;
Metals;
Modems;
Performance evaluation;
Radio frequency;
Sensitivity;
Substrates;
Transceivers;
CPS;
LTE;
RF Design;
Shielding;
27.
Design and demonstration of large 2.5D glass interposer for high bandwidth applications
机译:
用于高带宽应用的大型2.5D玻璃中介层的设计和演示
作者:
Sakai Tadashi
;
Sawyer Brett
;
Hao Lu
;
Takagi Yutaka
;
Furuya Ryuta
;
Suzuki Yuya
;
Kobayashi Masato
;
Smet Vanessa
;
Sundaram Venky
;
Tummala Rao
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
chip scale packaging;
glass;
integrated circuit interconnections;
network routing;
FLI;
HBM;
JEDEC high bandwidth memory;
L-S escape routing;
L-S transmission lines;
SnAg solder caps;
chip-level interconnect;
copper microbumps;
daisy chains;
double sided panel processing;
large 2.5D glass interposer;
line and space escape routing;
metal layers;
metal lines;
routing design;
semi additive process;
size 3 mum;
size 300 mum;
size 50 mum;
Assembly;
Bandwidth;
Fabrication;
Glass;
Metals;
Routing;
Silicon;
2.5D assembly;
fine routing;
glass interposer;
28.
Optimizing FCCSP design with Cu-pillar bump in high sensitivity fingerprint sensor
机译:
利用高灵敏度指纹传感器中的铜柱凸点优化FCCSP设计
作者:
Chih-Yi Huang
;
Cheng-Yu Tsai
;
Tsai-Yun Hsieh
;
Chi-Tsung Chiu
;
Chih-Pin Hung
;
Chen-Chao Wang
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
capacitive sensors;
copper;
fingerprint identification;
integrated circuit design;
integrated circuit packaging;
microprocessor chips;
signal processing equipment;
Cu;
FCCSP design optimization;
capacitive fingerprint sensor;
fingerprint identification IC;
fingerprint identification system;
fingerprint sensor performance;
high sensitivity fingerprint sensor;
mobile payment;
package design;
package structure;
personal mobile device;
Capacitance;
Fingerprint recognition;
Fingers;
Integrated circuits;
Materials;
Sensitivity;
Time-domain analysis;
29.
3.3-Tb/s compact optical fiber package using pre-formed optical fiber
机译:
使用预制光纤的3.3-Tb / s紧凑型光纤封装
作者:
Nomura Rika
;
Chujo Norio
;
Mizushima Akiko
;
Matsushima Naoki
;
Fukumiya Kouichi
;
Akutsu Itoe
;
Hata Koji
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
information technology;
optical cables;
optical interconnections;
packaging;
preforms;
bit rate 25 Gbit/s;
bit rate 3.3 Tbit/s;
compact optical fiber package;
information communication technology;
optical cable;
optical fiber protection;
optical modules;
preformed optical fiber;
prototype mock-up board;
rack-to-rack transmission;
routing area reduction;
size 5 m;
transmission performance board-to-board;
Adaptive optics;
Connectors;
Integrated optics;
Optical device fabrication;
Optical fiber cables;
Optical fibers;
forming;
optical fiber;
optical interconnections;
packaging;
30.
Power efficient data rate for photonic interposer
机译:
光子插入器的节能数据速率
作者:
Chujo Norio
;
Uematsu Yutaka
;
Yasunaga Moritoshi
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
elemental semiconductors;
integrated circuit interconnections;
integrated circuit packaging;
integrated optoelectronics;
large scale integration;
optical transceivers;
power consumption;
silicon;
surface emitting lasers;
LSI;
Si;
VCSEL;
bit rate 10 Tbit/s;
bit rate 40 Tbit/s;
chip-to-chip interconnect;
optical interconnect;
optical transceivers;
photonic interposer;
power consumption;
wiring density;
Bandwidth;
Large scale integration;
Optical devices;
Optical fibers;
Optical interconnections;
Vertical cavity surface emitting lasers;
Wiring;
Optical interconnect;
chip-to-chip;
interposer;
power efficiency;
31.
Measurement and modeling for MOS reverse current of switching DC/DC converter
机译:
开关DC / DC转换器的MOS反向电流的测量与建模
作者:
Terasaki Masahiro
;
Oohashi Yuta
;
Masuyama You
;
Sudo Toshio
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
DC-DC power convertors;
MOSFET;
electric current measurement;
electromagnetic interference;
frequency-domain analysis;
interference suppression;
switching convertors;
time-domain analysis;
DC-DC converter switching loop;
EMI;
MOS reverse current measurement;
MOS reverse current modeling;
MOS reverse current recovering time;
Switching DC-DC Converter;
electromagnetic interference;
electronic component;
electronic system malfunction;
frequency-domain analysis;
parasitic inductance;
power supply voltage;
ringing noise reduction;
ringing noise suppression;
switching frequency;
switching noise;
switching waveform reproduction;
time-domain simulation;
Current measurement;
Frequency measurement;
MOSFET;
Noise;
Semiconductor device measurement;
Switches;
Voltage measurement;
MOS Reverse Current;
Noise Suppression;
Parasitic Inductance;
Ringing Noise;
Switching Loop;
32.
Loss analysis for optical MCM based optical link
机译:
基于光MCM的光链路的损耗分析
作者:
Hsiang-Han Hsu
;
Nakagawa Sachiko
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
data communication;
flip-chip devices;
integrated optoelectronics;
lenses;
multichip modules;
optical fibres;
optical interconnections;
optical links;
photodiodes;
polymers;
surface emitting lasers;
MMF;
VCSEL;
cladding layer;
data receiver;
data transmitter;
double lens connector;
flip chip;
loss analysis;
multimode fiber;
optical MCM link system;
optical link;
optical multichip module;
optochips;
organic substrate;
photodiode;
polymer waveguides;
turning mirror roughness;
vertical-cavity surface-emitting laser;
Application specific integrated circuits;
Integrated optics;
Optical losses;
Optical reflection;
Optical waveguides;
Substrates;
Turning;
link budget;
optical MCM;
polymer waveguide;
33.
Phase stability analysis of swept light source with KTa1???xNbxO3 electro-optic deflector toward Doppler optical coherence tomography
机译:
KTa1 ??? xNbxO3电光偏转器对多普勒光学相干断层扫描技术扫频光源的相位稳定性分析
作者:
Hasegawa Shun
;
Shinagawa Mitsuru
;
Toyoda Seiji
;
Ueno Masahiro
;
Sasaki Yutaka
;
Kobayashi Junya
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
Fourier transform optics;
biomedical optical imaging;
electro-optical deflectors;
jitter;
noise;
optical tomography;
potassium compounds;
tantalum compounds;
Doppler optical coherence tomography;
Fourier transform;
KTasub1-x/subNbsubx/subOsub3/sub;
SS-OCT;
cross correlation;
electro-optic deflector;
fringe waveforms;
jitter;
phase locking;
phase stability analysis;
swept light source;
voltage noise;
Biomedical optical imaging;
Fourier transforms;
High-speed optical techniques;
Jitter;
Light sources;
Noise;
Optical imaging;
Fourier transform;
Jitter;
KTN;
Phase lock;
Phase stability;
SS-OCT;
Voltage noise;
34.
Threshold value estimation of electrical interconnect tests with scan FFs
机译:
具有扫描FF的电气互连测试的阈值估计
作者:
Nambara Kousuke
;
Umezu Shoichi
;
Yotsuyanagi Hiroyuki
;
Hashizume Masaki
;
Shyue-Kung Lu
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
estimation theory;
integrated circuit interconnections;
integrated circuit testing;
printed circuits;
three-dimensional integrated circuits;
3D IC;
dies;
electrical interconnect tests;
estimation method;
printed circuit board;
prototyping IC;
resistive open defects;
threshold value;
Estimation;
Integrated circuit interconnections;
Resistance;
Testing;
Three-dimensional displays;
Through-silicon vias;
3D IC;
TSV;
interconnect test;
open defect;
35.
High aspect ratio TSV etching process for high-capacitor
机译:
高纵横比高硅通孔蚀刻工艺
作者:
Murayama Takahide
;
Sakuishi Toshiyuki
;
Morikawa Yasuhiro
;
Tani Noriaki
;
Saitou Kazuya
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
X-ray photoelectron spectra;
capacitors;
etching;
integrated circuit packaging;
silicon compounds;
three-dimensional integrated circuits;
2.5D silicon interposers;
3D stacked devices;
SiOsubx/sub;
XPS analysis;
anisotropic deep silicon etching method;
capacitor reliability;
cycle etching method;
fluorocarbon polymer;
general anisotropic etching method;
high aspect ratio TSV etching process;
high packaging density;
high-speed signal transmission;
mass production;
next-generation semiconductor device;
noncycle etching method;
periodic roughness;
power saving;
process integration;
scallops;
sidewall protection mechanism;
thru silicon via application;
Capacitors;
Etching;
Plasmas;
Radio frequency;
Reliability;
Silicon;
Through-silicon vias;
Carbon-free;
Reliability;
Scallop-free;
Si-DRIE;
Side-wall protection;
TSV;
36.
Low power penalty, dry-film polymer waveguides for silicon photonics chip packaging
机译:
低功耗,干膜聚合物波导,用于硅光子芯片封装
作者:
Hsiang-Han Hsu
;
Nakagawa Sachiko
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
multichip modules;
optical interconnections;
optical losses;
optical waveguides;
polymers;
DC performance;
alignment tolerance measurement;
coupling loss;
dry film polymer waveguide;
eye pattern;
far field pattern;
high speed performance;
low power penalty waveguide;
near field pattern;
optical multichip module;
silicon photonics chip packaging;
single-mode fiber;
size 10 mum to 14 mum;
waveguide cores;
Couplings;
Loss measurement;
Optical waveguides;
Polymers;
Propagation losses;
Silicon photonics;
Waveguide lasers;
dry film;
polymer waveguide;
37.
Lifetime evaluation of ultra-thin polymer pulsating heat pipe
机译:
超薄聚合物脉动热管的使用寿命评估
作者:
Ogata Syuuji
;
Sukegawa Eiji
;
Kimura Tomohiro
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
heat pipes;
polymer films;
thermal management (packaging);
PET films;
PPHP;
atmospheric pressure;
casing materials;
gas penetration;
gas-barrier films;
lifetime evaluation;
performance degradation;
polyethylene terephthalate films;
ultra-thin polymer pulsating heat pipe;
Electrical resistance measurement;
Films;
Fluids;
Heating;
Temperature measurement;
Thermal resistance;
gas penetration;
leak rate;
lifetime;
polymer;
pulsating heat pipe;
38.
Power-bus noise reduction using ferrite-covered open stub in printed circuit board
机译:
使用印刷电路板中覆有铁氧体的开口短线来降低电源总线的噪声
作者:
Toyota Yoshitaka
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
interference suppression;
network analysers;
parallel plate waveguides;
printed circuits;
resonator filters;
PCB;
electromagnetic noise propagation;
ferrite-covered open stub;
frequency selectivity;
input impedance characteristics;
parallel plate resonances;
power integrity detraction;
power-bus noise reduction;
power-bus resonance;
power-ground plane;
printed circuit board;
resonant frequency;
resonator filter;
vector network analyzer;
Ferrites;
Impedance;
Loss measurement;
Noise;
Noise reduction;
Propagation losses;
Resonant frequency;
ferrite thin film;
lossy resonator filter;
noise reduction;
open stub;
printed circuit board;
39.
Optical micro sensors integration and application
机译:
光学微传感器集成与应用
作者:
Morita Nobutomo
;
Sawada Renshi
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
Doppler measurement;
bio-optics;
bioMEMS;
blood flow measurement;
elemental semiconductors;
flow sensors;
haemodynamics;
integrated optics;
integrated optoelectronics;
laser applications in medicine;
laser velocimeters;
micro-optomechanical devices;
micromirrors;
microsensors;
optical sensors;
silicon;
wafer level packaging;
Si;
blood flow sensors;
cavities;
low power consumption;
low weight;
microelectromechanical systems;
microlaser Doppler velocimeter;
microoptical encoders;
mirrors;
optical MEMS chip;
optical elements;
optical equipment miniaturization;
optical microsensors integration;
portability;
precise alignment;
three-dimensional electrodes;
through-silicon vias;
wafer-level packaging;
Blood flow;
Doppler effect;
Measurement by laser beam;
Micromechanical devices;
Optical device fabrication;
Optical sensors;
blood flow;
laser Doppler;
micro-encoder;
optical sensor;
system-in-package;
wafer-level packaging;
40.
Novel packaging technologies for FPC-based optical transceiver for high-speed optical interconnect
机译:
用于高速光互连的基于FPC的光收发器的新型封装技术
作者:
Yagisawa Takatoshi
;
Sugawara Mariko
;
Shiraishi Tomohiro
;
Tanaka Kiyoshi
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
electronics packaging;
flexible electronics;
ink jet printing;
integrated optoelectronics;
lenses;
optical interconnections;
optical transceivers;
photodiodes;
printed circuit interconnections;
FPC connector;
electrical packaging;
flexible printed circuit;
frequency bandwidth;
inductive peaking line;
inkjet technology;
integrated lens;
module substrate;
optical engine;
optical interconnect;
optical packaging;
optical transceiver;
packaging technologies;
photodiode;
Adaptive optics;
Bandwidth;
Connectors;
High-speed optical techniques;
Lenses;
Optical device fabrication;
Optical interconnections;
FPC;
connector;
integrated lens;
optical engine;
optical interconnect;
photodiode;
transceiver;
41.
Influence of packaging on frequency drift in MEMS resonators-Dynamic effect of packaging on MEMS device performance
机译:
封装对MEMS谐振器中频率漂移的影响-封装对MEMS器件性能的动态影响
作者:
Nishida Tsutomu
;
Higo Y.
;
Tanigawa H.
;
Suzuki Kenji
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
aluminium;
electronics packaging;
micromechanical resonators;
silicon;
thermal expansion;
MEMS resonators;
Si-Al;
aluminum plate;
dynamic effect;
frequency drift packaging;
microelectromechanical system device performance;
silicon plate;
thermal expansion effect;
Aluminum;
Micromechanical devices;
Resonant frequency;
Silicon;
Strain;
Strain measurement;
Temperature measurement;
42.
Direct core monitoring technique for passive optical alignment between multichannel silicon waveguide and single-mode fiber array
机译:
用于多通道硅波导和单模光纤阵列之间的无源光学对准的直接核心监视技术
作者:
Maruyama Kazunori
;
Youoku Sachihiro
;
Matsumoto Tad
;
Nishiyama Youji
;
Endo Yuta
;
Sekiguchi Shigeyuki
;
Wakana Shinichi
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
elemental semiconductors;
integrated optics;
optical arrays;
optical fibre fabrication;
optical fibre testing;
silicon;
Si;
direct core monitoring technique;
multichannel coupling;
multichannel silicon waveguide;
passive optical alignment;
single-mode fiber array;
Arrays;
Couplings;
Loss measurement;
Optical fiber sensors;
Optical waveguides;
Silicon;
passive optical alignment;
silicon waveguide;
single-mode fiber array;
spot size converter;
43.
Design for PMT connector (polymer waveguides connected with MT connector)
机译:
PMT连接器的设计(与MT连接器连接的聚合物波导)
作者:
Takezaki Motohito
;
Nagase Ryo
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
integrated optoelectronics;
optical polymers;
optical waveguides;
waveguide couplers;
PMT connector;
multifiber ribbons;
optical circuit boards;
polymer waveguides connected with MT connector;
Attenuation;
Connectors;
Optical fiber devices;
Optical fibers;
Polymers;
Optial waveguide;
PMT connector;
44.
High-speed optical beam scanning using KTN crystal
机译:
使用KTN晶体的高速光束扫描
作者:
Sakamoto Takanori
;
Toyoda Seiji
;
Ueno Masahiro
;
Kobayashi Junya
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
electro-optical deflectors;
permittivity;
potassium compounds;
tantalum compounds;
thermoelectricity;
KTN crystal;
KTaNbOsub3/sub;
deflector;
frequency 500 kHz;
high frequency operation;
high-speed optical beam scanning;
pentagon-shaped electrode surface;
potassium tantalite niobate;
scan angle;
size 1.5 mm;
temperature dependent-permittivity;
Crystals;
Electrodes;
Electrooptic deflectors;
Heating;
Optical beams;
Permittivity;
Temperature measurement;
Kerr effect;
deflector;
electrooptic effect;
space charge;
45.
Positive-tone photodefinable polyimide for low temperature cure
机译:
用于低温固化的正型光可定义聚酰亚胺
作者:
Matsukawa Daisaku
;
Enomoto Tetsuya
;
Ono Keishi
;
Ohe Masayuki
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
coating techniques;
curing;
thermal management (packaging);
wafer level packaging;
DNQ;
PBO;
aqueous TMAH;
buffer coating;
interlayer dielectric;
low temperature cure;
phenolic hydroxyl groups;
polybenz-oxazoles;
positive-tone photodefinable polyimide;
precyclized polyimide;
protection layer;
reacted epoxide groups;
redistribution layer;
secondary hydroxyl groups;
semiconductor device thermal damage;
wafer level package;
Adhesives;
Chemicals;
Films;
Polyimides;
Resistance;
Low Temperature Cure;
Photosensitivity;
Polyimide;
46.
Fabrication of flexible thermoelectric thin film module using micro porous structure
机译:
利用微孔结构制备柔性热电薄膜组件
作者:
Kato Kazuhiko
;
Muto Tsuyoshi
;
Kondo Toshiaki
;
Miyazaki Koji
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
flexible electronics;
modules;
porous materials;
thermoelectric devices;
thin film devices;
flexible thermoelectric thin film module fabrication;
microporous structure;
smooth structured module;
submicron structured thermoelectric thin film module;
Conductivity;
Films;
Heating;
Plasma temperature;
Substrates;
Thermal conductivity;
bismuth telluride;
microphase separation;
thermoelectric module;
47.
Assembly process for high bandwidth density organic optical MCM
机译:
高带宽密度有机光学MCM的组装工艺
作者:
Tokunari Masao
;
Nakagawa Sachiko
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
electronics packaging;
laser ablation;
mirrors;
multichip modules;
optical fibres;
bare optical chip integration;
compact fiber connectors;
high bandwidth density organic optical MCM;
high packaging density;
laser ablation technique;
lens array assembly process;
manufacturing total internal reflection mirrors;
module surface;
organic optical MCM;
reflow process heat;
High-speed optical techniques;
Integrated optics;
Optical device fabrication;
Optical fibers;
Optical reflection;
flip-chip;
optical interconnections;
optical multi-chip module;
polymer waveguide;
48.
On-board snubber circuit for damping of anti-resonance peak in total PDN
机译:
板上缓冲电路,用于衰减整个PDN中的反谐振峰值
作者:
Yamaguchi Toru
;
Kurita Kanae
;
Sudo Toshio
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
CMOS integrated circuits;
RC circuits;
ball grid arrays;
circuit optimisation;
integrated circuit interconnections;
integrated circuit noise;
integrated circuit packaging;
snubbers;
CMOS integrated circuit;
RC series circuits;
antiresonance peak damping;
antiresonance peak frequency;
ball grid array;
on-board snubber circuits;
optimal circuit parameters;
power supply noise;
quad flat package;
total PDN;
total power distribution network;
Capacitors;
Damping;
Impedance;
Integrated circuit modeling;
Noise;
Power supplies;
Snubbers;
49.
1060-nm VCSEL-based 28-Gb/s ?? 4-channnel optical signal transmission beyond 500-m MMF using high-density parallel-optical modules
机译:
基于1060 nm VCSEL的28 Gb / s ??使用高密度并行光学模块,超过500 m MMF的4通道光信号传输
作者:
Nagashima Kazuya
;
Kise Tomofumi
;
Ishikawa Yozo
;
Nasu Hideyuki
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
binary sequences;
laser cavity resonators;
optical communication equipment;
optical fibre communication;
random sequences;
surface emitting lasers;
4-channnel optical signal transmission;
MMF;
PRBS;
VCSEL;
bit rate 28 Gbit/s;
chromatic dispersion;
error free transmission;
high-density parallel-optical modules;
multimode fiber;
parallel optical link;
pseudorandom binary sequence;
size 50 mm;
solder reflow-capable miniature optical modules;
vertical cavity surface emitting lasers;
wavelength 1060 nm;
Adaptive optics;
Integrated optics;
Optical fibers;
Optical transmitters;
Temperature;
Vertical cavity surface emitting lasers;
28Gb/s;
Sn-Ag-Cu;
VCSEL;
parallel-optical module;
solder-reflow;
50.
Stretchable and deformable electronic systems in thermoplastic matrix materials
机译:
热塑性基质材料中的可拉伸和可变形电子系统
作者:
Loher Thomas
;
Ostmann Andreas
;
Seckel Manuel
会议名称:
《IEEE CPMT Symposium Japan》
|
2014年
关键词:
assembling;
bismuth alloys;
deformation;
flexible electronics;
integrated circuit manufacture;
matrix algebra;
plastics;
polymers;
printed circuits;
solders;
tin alloys;
3D-deformation;
SnBi;
actuator;
aesthetically 3D-shaped surface;
complex electronic system;
contact pad;
deformable electronic system;
deformable electronics material;
distributed sensor;
electronics assembly line;
flat electronic panel;
industrial fabrication environment;
laterally distributed electronic component;
printed circuit board manufacturing;
printed circuit board technology;
reliability issue;
self-supported structure;
sensor integration;
stretchable electronic system;
thermocompression;
thermoforming process;
thermoplastic polymer sheet;
thermoplastic polyurethane matrix material;
under filler;
wet chemical process;
Assembly;
Fabrication;
Integrated circuit interconnections;
Materials;
Printed circuits;
Thermoforming;
Transmission line matrix methods;
assembly;
electronics fabrication;
encapsulation;
free form;
stretchable electronics;
thermoplastic forming;
意见反馈
回到顶部
回到首页