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IEEE Electrical Design of Advanced Packaging and Systems Symposium

召开年：2014
召开地：Bangalore(IN)
出版时间：-

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1.A case study of BGA package for high speed channel with non-ideal ground induced resonance conditions

机译：非理想接地条件下高速通道BGA封装的案例研究
- 作者：Singh V.K.;Nagpal R.K.;Tripathi J.N.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
2.EMC-aware analysis and design of a low-cost receiver circuit under injection locking and pulling

机译：注入锁定和拉动下低成本接收器电路的EMC意识分析和设计
- 作者：Huynen M.;Stockman G.-J.;Declercq F.;Torfs G.;Bauwelinck J.;Vande Ginste D.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
3.A novel wideband common-mode suppression filter for differential signal transmission

机译：一种用于差分信号传输的新型宽带共模抑制滤波器
- 作者：Fang-Xu Yang;Min Tang;Lin-Sheng Wu;Jun-Fa Mao
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
4.A novel common-mode filter (CMF) design based on signal interference technique

机译：基于信号干扰技术的新型共模滤波器（CMF）设计
- 作者：Chein-Hua Hung;Chih-Ying Hsiao;Tzong-Lin Wu
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
5.A super wideband X-complementary split ring resonator structure for power distribution network

机译：用于配电网的超宽带X互补裂环谐振器结构
- 作者：Ji Zhang;Xiao-Chun Li;Ning Wang;Na Li;Sheng-jie Guo;Jun-Fa Mao
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
6.Study on power supply noise and electromagnetic radiation in relation to chip-package anti-resonance

机译：与芯片封装反谐振有关的电源噪声和电磁辐射的研究
- 作者：Kiyoshige S.;Ichimura W.;Sudo T.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
7.Indirect contact probing method for characterizing via arrays in electronic packaging

机译：电子封装中通过阵列表征的间接接触探测方法
- 作者：JongWoo Jeong;Jingook Kim;Ki Jin Han;No-Weon Kang
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
8.Design space exploration of Through Silicon Vias for high-speed, low loss vertical links

机译：高速，低损耗垂直链路的硅通孔的设计空间探索
- 作者：Kumar S.;Kaur S.;Bakshi M.;Bansal M.;Choudhary M.;Sharma R.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
9.Modular Power System and bus bar scheme in high power communication satellite

机译：大功率通信卫星中的模块化电源系统和母线方案
- 作者：Srivastava V.R.;Poddar P.K.;Veena B.;Chetty S.V.;Lakshminarayana V.;Hariharan V.K.;Ghatpande N.D.;Ekkundi R.S.;Govinda K.V.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
10.Silicon-package power delivery co-simulation with Fully Integrated Voltage Regulators on microprocessors

机译：硅封装电源传输与微处理器上的全集成稳压器共同仿真
- 作者：Govindan S.;Venkataraman S.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
11.Fast and accurate technique to decompose jitter for very long pattern length waveform

机译：快速准确的技术可分解非常长的码型波形的抖动
- 作者：Kho J.;Tan Yih Ling
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
12.Validating 2.5D System-in-Package inter-die communication on silicon interposer

机译：在硅中介板上验证2.5D封装系统间芯片间通信
- 作者：Kumar P.;Naveen H.N.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
13.Inter layer crosstalk between stripline and metal patch

机译：带状线和金属补片之间的层间串扰
- 作者：Chun-Lin Liao
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
- crosstalk;
- printed circuits;
- strip lines;
- interlayer crosstalk;
- metal patch;
- multilayer printed circuit board;
- power plane;
- stripline;
- Capacitors;
- Crosstalk;
- Metals;
- Neck;
- Noise;
- Stripline;
- coupling;
- crosstalk;
- inter layer crosstalk;
- stripline;
14.Null field preconditioner for fast 3D full-wave MoM package-board extraction

机译：空域预处理器可快速提取3D全波MoM封装板
- 作者：Negi Y.K.;Balakrishnan N.;Rao S.M.;Gope D.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
15.Impact of sockets in Package-On-Package electrical validation design considerations

机译：插座对封装式电气验证和设计注意事项的影响
- 作者：Parthasarathy R.;Thomas S.A.;Repala M.M.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
16.Effect of layered media on the parallel plate impedance of printed circuit boards

机译：分层介质对印刷电路板平行板阻抗的影响
- 作者：Dahl D.;Muller S.;Schuster C.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
17.Efficient computation of capacitive coupling between planar and cylindrical interconnections

机译：平面和圆柱互连之间的电容耦合的高效计算
- 作者：Ki Jin Han;Swaminathan M.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
18.Eye-height/width prediction from S-Parameters using bounded size training set for ANN

机译：使用ANN的有界尺寸训练集从S参数进行眼高/宽度预测
- 作者：Ambasana N.;Gope D.;Mutnury B.;Anand G.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
19.Design and analysis for noise suppression of DC/DC converter

机译：DC / DC转换器的噪声抑制设计与分析
- 作者：Terasaki M.;Oohashi Y.;Masuyama Y.;Sudo T.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
20.High-speed data transmission system based on QPSK scheme in substrate integrated waveguide

机译：基板集成波导中基于QPSK方案的高速数据传输系统
- 作者：Ning Wang;Xiao-Chun Li;Xi-Wang Yuan;Pei Yu;Xiao-Jian Ma;Yan Shao;Jun-Fa Mao
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
21.Design and analysis of magnetically coupled coil structures for PCB-to-active interposer wireless power transfer in 2.5D/3D-IC

机译：2.5D / 3D-IC中PCB到有源插入器无线功率传输的磁耦合线圈结构的设计和分析
- 作者：Jinwook Song;Sukjin Kim;Bumhee Bae;Kim J.J.;Jung D.H.;Joungho Kim
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
22.Hybrid silicon and glass interposer for combined optical and memory system-in-package

机译：混合的硅和玻璃中介层，用于组合式光学和存储系统级封装
- 作者：Uematsu Y.;Toyama M.;Yorita C.;Osaka H.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
23.Novel target impedance for power distribution network of simultaneous switching output (SSO) buffers

机译：同步开关输出（SSO）缓冲器的配电网络的新型目标阻抗
- 作者：Jingook Kim;Eunkyeong Park;JongJoo Lee;Kwangsoo Park;Youngwoo Park
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
24.EMI coupling to command lines due to solar array switching strings in spacecraft

机译：由于航天器中的太阳能电池阵列开关串，EMI耦合到命令行
- 作者：Sowjanya P.;Raghavaiah V.;Murthy P.V.N.;Renuka R.;Nagesh S.K.;Thyagaraj M.R.;Rajan G.V.C.;Govinda K.V.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
25.Crosstalk reduction for compact optical transceiver module

机译：紧凑型光收发器模块的串扰减少
- 作者：Cujo N.;Shinkai G.;Matsuoka Y.;Yamashita H.;Yasunaga M.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
26.High-speed data transmission system using half mode substrate integrated waveguide

机译：使用半模衬底集成波导的高速数据传输系统
- 作者：Xi-Wang Yuan;Xiao-Chun Li;Ning Wang;Xiao-Jian Ma;Yan Shao;Jun-Fa Mao
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
27.Challenges of using flex cables in high speed serial links

机译：在高速串行链路中使用柔性电缆的挑战
- 作者：Anand G.;Kumar V.;Vasa M.;Mutnury B.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
28.Resonant power supply noise reduction using on-die decoupling capacitors embedded in organic interposer

机译：使用嵌入在有机中介层中的片上去耦电容器来降低谐振电源噪声
- 作者：Nakura T.;Kano M.;Yoshizawa M.;Oyamada S.;Hattori A.;Asada K.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
29.Methodology to design SATA 3.0 channels with re-driver

机译：使用重新驱动程序设计SATA 3.0通道的方法
- 作者：Kumar V.;Anand G.;Mutnury B.;Kumar S.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
30.Fast incremental 3D full-wave analysis for package-board design iterations via eigen-GCR

机译：通过特征GCR对包装板设计进行快速增量3D全波分析
- 作者：Chatterjee G.;Das A.;Gope D.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
31.De-embedding method and segmentation approach using full wave solver for high speed channels in PCB/package co-design

机译：PCB /封装协同设计中使用全波求解器的高速通道去嵌入方法和分割方法
- 作者：LianKheng Teoh;ChunTong Chiang;Scogna A.C.;Khrone K.;HsuenYen Lee
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
32.Vref optimization in DDR4 RDIMMs for improved timing margins

机译：DDR4 RDIMM中的Vref优化可改善时序裕量
- 作者：Sethuraman S.;Lingambudi A.;Wright K.;Saurabh A.;Kyu-Hyoun Kim;Becker D.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年
33.Guard trace with periodic structure taking signal integrity into account

机译：考虑到信号完整性的周期性结构保护迹线
- 作者：Toyota Y.;Iokibe K.;Watanabe T.
- 会议名称：《IEEE Electrical Design of Advanced Packaging and Systems Symposium》 | 2014年