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Design, Test, Integration & Packaging on MEMS/MOEMS, 2008 Symp on

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1.A piecewise-linear reduced-order model of squeeze-film damping for deforarnable structures including large displacement effects

机译：包含大位移效应的可变形结构挤压膜阻尼的分段线性降阶模型
- 作者：Missoffe A.;Juillard J.;Aubry D.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
2.Design and analysis of a chaotic micromixer with vortices modulation

机译：具有涡旋调制的混沌微混合器的设计与分析
- 作者：Tung K. Y.;Yang J. T.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
3.Design and fabrication of high numerical aperture and low aberration Bi-convex micro lens array

机译：高数值孔径低像差双凸微透镜阵列的设计与制作
- 作者：Jhy-Cherng Tsai;Ming-Fong Chen;Hsiharng Yang
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
4.Megasonic enhanced electrodeposition

机译：兆声增强电沉积
- 作者：Kaufmann Jens;Desmulliez Marc P.Y.;Price Dennis
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
5.Geometrical variation analysis of an electrothermally driven polysilicon micoactuator

机译：电热驱动多晶硅微致动器的几何变化分析
- 作者：Shamshirsaz M.;Maroufi M.;Asgari M.B.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
- Analytical model;
- Electrothermal microactuator;
- Finite element model;
- Geometrical variations;
6.Model based sensor system for temperature measurement in R744 air conditioning systems

机译：基于模型的传感器系统，用于R744空调系统中的温度测量
- 作者：Reitz Sven;Schroth Andrews;Schneider Peter
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
7.RF-MEMS switched varactors for medium power applications

机译：用于中功率应用的RF-MEMS开关变容二极管
- 作者：Maury F.;Pothier A.;Crunteanu A.;Conseil F.;Blondy P.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
8.Cell trapping utilizing insulator-based dielectrophoresis in the open-top microchannels

机译：在敞开式微通道中利用基于绝缘子的介电泳进行细胞捕获
- 作者：Jen Chun-Ping;Huang Yao-Hung;Chen Teng-Wen
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
9.Hybridization of magnetism and piezoelectricity for an energy scavenger based on temporal variation of temperature

机译：基于温度随时间变化的能量清除剂的磁和压电混合
- 作者：Carlioz Louis;Delamare Jerome;Basrour Skandar;Poulin Guylaine
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
10.Modelling MEMS structures using Cosserat theory

机译：使用Cosserat理论对MEMS结构建模
- 作者：Calis M.;Lagrouche O.;Desmulliez M.P.Y.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
11.Automatic wire bonder designed for MEMS packaging

机译：专用于MEMS封装的自动引线键合机
- 作者：Yanjie Liu;Yuetao Liu;Lining Sun
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
12.Linear and non linear behavior of mechanical resonators for optimized inertial electromagnetic microgenerators

机译：优化惯性电磁微型发电机的机械谐振器的线性和非线性行为
- 作者：Serre C.;Perez-Rodriguez A.;Fondevilla N.;Martincic E.;Morante J.R.;Montserrat J.;Esteve J.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
13.Integrated 3D sound intensity sensor with four-wire particle velocity sensors

机译：集成3D声强传感器和四线粒子速度传感器
- 作者：Yntema D.R.;van Honschoten J.W.;Wiegerink R.J.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
14.Microfluidic device for continuous magnetophoretic separation of red blood cells

机译：用于连续磁泳分离红细胞的微流体装置
- 作者：lliescu Ciprian;Barbarini Elena;Avram Marioara;Xu Guolin;Avram Andrei
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
15.Simulation of coating -visco-elastic liquid in the Micro-nip of metering size press

机译：定量施胶机微压区中涂层粘弹性液体的模拟
- 作者：El-Sadi Haifa;Esmail Nabil
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
16.Micro-tensile tests on micromachined metal on polymer specimens: Elasticity, plasticity and rupture

机译：在聚合物样品上对微机械加工的金属进行微拉伸试验：弹性，可塑性和断裂
- 作者：Seguineau C.;Ignat M.;Malhaire C.;Brida S.;Lafontan X.;Desmarres J.-M.;Josserond C.;Debove L.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
17.Flexible micro thermoelectric generator based on electroplated Bi2+xTe3−x

机译：基于电镀Bi 2 + x Te 3-x 的柔性微热发电机
- 作者：Schwyter Etienne;Glatz Wulf;Durrer Lukas;Hierold Christofer
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
18.Design and fabrication of a novel micro electromagnetic actuator

机译：新型微电磁致动器的设计与制造
- 作者：Chia-Yen Lee;Zgen-Hui Chen;Hsien-Tseng Chang;Chiang-Ho Cheng;Chih-Yung Wen
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
19.A new four states high deflection low actuation voltage electrostatic MEMS switch for RF applications

机译：用于射频应用的新型四态高偏转低激励电压静电MEMS开关
- 作者：Robin Renaud;Touati Salim;Segueni Karim;Millet Olivier;Buchaillot Lionel
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
- RF MEMS switch;
- SPDT;
- electrostatic actuator;
20.Manufacturing of a micro probe using supersonic aided electrolysis process

机译：使用超声辅助电解工艺制造微探针
- 作者：Shyu R.F.;Weng Feng-Tsai;Chi-Ting Ho
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
21.A nanostructual microwave probe used for atomic force microscope

机译：用于原子力显微镜的纳米结构微波探针
- 作者：Ju Y.;Hamada M.;Kobayashi T.;Soyama H.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
22.Process nano scale mechanical properties measurement of thin metal films using a novel paddle cantilever test structure

机译：使用新型桨式悬臂测试结构对金属薄膜进行过程纳米级机械性能测量
- 作者：Chi-Jia Tong;Ming-Tzer Lin
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
23.Invited talk 2: MEMS-enabled smart autonomous systems

机译：邀请演讲2：启用MEMS的智能自主系统
- 作者：Van Hoof Chris
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
24.A low-cost through via interconnection for ISM WLP

机译：ISM WLP的低成本直通互连
- 作者：Jingli Yuan;Won-Kyu Jeung;Chang-Hyun Lim;Park Seung-Wook;Young-Do Kweon;Sung Yi
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
25.Package hermeticity testing with thermal transient measurements

机译：具有热瞬态测量的封装气密性测试
- 作者：Vass-Varnai Andras;Rencz Marta
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
26.Numerical investigation of laser-assisted nanoimprinting on a copper substrate from a perspective of heat transfer analysis

机译：传热分析视角的铜基激光辅助纳米压印数值研究
- 作者：Chun-Ping Jen
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
27.Design optimization for an electro-thermally actuated polymeric microgripper

机译：电热致动聚合物微型夹具的设计优化
- 作者：Voicu R.;Muller R.;Eftime L.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
28.Porous alumina based capacitive MEMS RH sensor

机译：多孔氧化铝基电容MEMS RH传感器
- 作者：Juhasz Laszlo;Vass-Vamai Andras;Timar-Horvath Veronika;Desmulliez Marc P.Y.;Dhariwal Resh S.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
29.Contactless thermal characterization of high temperature test chamber

机译：高温试验箱的非接触式热特性
- 作者：Szucs Z.;Bognar Gy.;Szekely V.;Renczl M.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
- High temperature test chamber;
- IR sensor;
- infrared radiation;
- temperature mapping;
30.Numerical and compact modelling of squeeze-film damping in RF MEMS resonators

机译：RF MEMS谐振器中挤压膜阻尼的数值和紧凑模型
- 作者：Veijola T.;Lehtovuori A.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
31.Optimization of efficiency and energy density of passive micro fuel cells and galvanic hydrogen generators

机译：无源微型燃料电池和原电池氢发生器的效率和能量密度的优化
- 作者：Hahn Robert;Wagner Stefan;Krumbholz Steffen;Reichl Herbert
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
32.Sub-µ structured lotus surfaces manufacturing

机译：亚微米结构莲花表面制造
- 作者：Worgull M.;Heckele M.;Mappes T.;Matthis B.;Tosello G.;Metz T.;Gavillet J.;Koltay P.;Hansen H. N.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
33.Low actuation voltage totally free flexible RF MEMS switch with antistiction system

机译：低启动电压，完全自由的带有防粘滞系统的柔性RF MEMS开关
- 作者：Touati S.;Lorphelin N.;Kanciurzewski A.;Robin R.;Rollier A.-S.;Millet O.;Segueni K.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
34.Copper electrodeposition for 3D integration

机译：用于3D集成的铜电沉积
- 作者：Beica Rozalia;Sharbono Charles;Ritzdorf Tom
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
35.New high fill-factor triangular micro-lens array fabrication method using UV proximity printing

机译：利用紫外线邻近印刷的新型高填充因子三角微透镜阵列制造方法
- 作者：Lin T.-H.;Yang H.;Chao C.-K.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
36.Micromachined inclinometer based on fluid convection

机译：基于流体对流的微机械测斜仪
- 作者：Crespy N.;Courteaud J.;Combette P.;Temple Boyer P.;Giani A.;Foucaran A.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
37.High density out-of-plane microprobe array

机译：高密度平面外探针阵列
- 作者：Huang C.H.;Tsou C.;Lai T.H.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
38.In-plane bistable nanowire for memory devices

机译：平面双稳态纳米线用于存储设备
- 作者：Charlot B.;Sun W.;Yamashita K.;Fujita H.;Toshiyoshi H.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
39.Hot roller embossing for the creation of microfluidic devices

机译：热辊压花，用于创建微流控设备
- 作者：Ng S. H.;Wang Z. F.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
40.Micro-electroforming metallic bipolar electrodes for mini-DMFC stacks

机译：微型DMFC堆栈的微电铸金属双极电极
- 作者：Shyu R. F.;Yang H.;Lee J.-H.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
41.Single chip sensing of multiple gas flows

机译：单芯片感应多种气流
- 作者：Bruschi P.;Dei M.;Piotto M.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
42.Optimization and AMS modeling for design of an electrostatic vibration energy harvester’s conditioning circuit with an auto-adaptive process to the external vibration changes

机译：优化和AMS建模，以设计一种可自动适应外部振动变化的静电振动能量采集器的调节电路
- 作者：Galayko Dimitri;Basset Philippe;Paracha Ayyaz Mahmood
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
43.Study of first-order thermal ΣΔ architecture for convective accelerometers

机译：对流加速度计的一阶热ΣΔ结构研究
- 作者：Leman Olivier;Mailly Frederick;Latorre Laurent;Nouet Pascal
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
44.Design and fabrication of condenser microphone using wafer transfer and micro-electroplating technique

机译：利用晶圆转移和微电镀技术设计电容麦克风
- 作者：Zhen-Zhun Shu;Ming-Li Ke;Guan-Wei Chen;Ray-Hua Horng;Chao-Chih Chang;Jean-Yih Tsai;Chung-Ching Lai;Ji-Liang Chen
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
45.Design methodology and manufacture of a microinductor

机译：微电感器的设计方法和制造
- 作者：Flynn D.;Desmulliez M. P.Y.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
46.UV direct-writing of metals on polyimide

机译：紫外线在聚酰亚胺上直接书写金属
- 作者：Ng Jack Hoyd-Gigg;Desmulliez Marc P.Y.;McCarthy Aongus;Suyal Himanshu;Prior Kevin A.;Hand Duncan P.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
47.Technologies for 3D wafer level heterogeneous integration

机译：3D晶圆级异构集成技术
- 作者：Wolf M.J.;Ramm P.;Klumpp A.;Reichl H.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
48.A novel piezoelectric microtransformer for autonomous sensors applications

机译：用于自主传感器应用的新型压电微变压器
- 作者：Sangouard Patrick;Lissorgues Gaelle;Bourouina Tarik
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
49.A microcantilever-based gas flow sensor for flow rate and direction detection

机译：基于微悬臂的气体流量传感器，用于流量和方向检测
- 作者：Yu-Hsiang Wang;Tzu-Han Hsueh;Rong-Hua Ma;Chia-Yen Lee;Lung-Ming Fu;Po-Cheng Chou;Chien-Hsiung Tsai
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
50.Top-down behavioral modeling methodology of a piezoelectric microgenerator for integrated power harvesting systems

机译：用于集成功率收集系统的压电微型发电机的自顶向下行为建模方法
- 作者：Boussetta Hela;Basrour Skandar;Marzencki Marcin
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
51.Validation of compact models of microcantilever actuators for RF-MEMS application

机译：验证用于RF-MEMS应用的微悬臂执行器的紧凑模型
- 作者：Brusa Eugenio;Della Gaspera Antonio;Munteanu Mircea Gh.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
52.RF-MEMS beam components: FEM modelling and experimental identification of pull-in in presence of residual stress

机译：RF-MEMS光束组件：在存在残余应力的情况下，有限元建模和拉入的实验识别
- 作者：Ballestra Alberto;Brusa Eugenio;De Pasquale Giorgio;Gh. Munteanu Mircea;Soma Aurelio
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
53.Mechanical fatigue on gold MEMS devices: Experimental results

机译：金MEMS器件的机械疲劳：实验结果
- 作者：De Pasquale G.;Soma A.;Ballestra A.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
54.Haptic sensing for MEMS with application for cantilever and casimir effect

机译：MEMS的触觉传感及其悬臂和卡西米尔效应的应用
- 作者：Calis M.;Desmulliez M.P.Y.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
55.Measurement of large forces and deflections in microstructures

机译：测量微结构中的大力和挠度
- 作者：Hals Kai Axel;Halvorsen Einar;Xuyuan Chen
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
56.The failure mechanisms of micro-scale cantilevers in shock and vibration stimuli

机译：微型悬臂在冲击和振动刺激中的失效机理
- 作者：Sheehy Michael;Reid Michael;Punch Jeff;Goyal Suresh;Kelly Gerard
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
57.Surface features of polymer and ceramic microstructured parts manufactured by micro injection molding

机译：通过微注射成型制造的聚合物和陶瓷微结构零件的表面特征
- 作者：Zhang K.F.;Zhen Lu
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
58.Comparison between damping coefficients of measured perforated structures and compact models

机译：实测多孔结构阻尼系数与紧凑模型的比较
- 作者：Veijola T.;De Pasquale G.;Soma A.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
59.Design and fabrication of acoustic wave actuated microgenerator for portable electronic devices

机译：便携式电子设备声波致动微型发电机的设计与制造
- 作者：Tenghsien Lai;Changhan Huang;Chingfu Tsou
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
60.Fabrication of 3D packaging TSV using DRIE

机译：使用DRIE制作3D封装TSV
- 作者：Puech M.;Thevenoud J.M.;Gruffat J.M.;Launay N.;Arnal N.;Godinat P.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
- Bosch process;
- DRIE;
- Oxide etching;
- PECVD;
- Packaging;
- Silicon etching;
- TSV;
- Tapered profile;
- Via first;
- Via last;
61.Wafer level package for image sensor module

机译：图像传感器模块的晶圆级封装
- 作者：Won Kyu Jeung;Chang Hyun Lim;Jingli Yuan;Park Seung Wook
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
62.High quality factor silicon cantilever driven by PZT actuator for resonant based mass detection

机译：由PZT执行器驱动的高质量因子硅悬臂用于基于共振的质量检测
- 作者：Lu J.;Ikehara T.;Zhang Y.;Mihara T.;Itoh T.;Maeda R.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
63.Fabrication of embedded microvalve on PMMA microfluidic devices through surface functionalization

机译：通过表面功能化在PMMA微流控设备上制造嵌入式微阀
- 作者：Toh A. G. G.;Wang Z.F.;Ng S.H.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
64.On-chip hotplate for temperature control of CMOS SAW resonators

机译：片上加热板，用于控制CMOS SAW谐振器的温度
- 作者：Nordin A. N.;Voiculescu I.;Zaghloul M.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
65.Portable valve-less peristaltic micropump design and fabrication

机译：便携式无阀蠕动微泵设计与制造
- 作者：Yang H.;Tsai T.-H.;Hu c.-c.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
66.Large area roller embossing of multilayered ceramic green composites

机译：多层陶瓷生坯复合材料的大面积辊压纹
- 作者：Shan Xuechuan;Soh Y. C.;P. Shi C. W.;Tay C. K.;Lu C. W.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
67.Study of mechanical response in embossing of ceramic green substrate by micro-indentation

机译：微压痕技术研究陶瓷生坯压花的力学响应
- 作者：Liu Y. c.;Shan Xuechuan
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
68.High aspect pattern formation by integration of micro inkjetting and electroless plating

机译：通过微喷墨和化学镀的集成形成高深宽的图形
- 作者：Gian P. W.;Xuechuan Shan;Liang Y. N.;Lok B. K.;Lu C. W.;Ooi B. L.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
69.Invited talk 1: Integrative MEMS/NEMS technology for micro and nano systems

机译：特邀报告1：适用于微米和纳米系统的集成MEMS / NEMS技术
- 作者：Ghodssi Reza
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
70.The design and characterization of high performance soleno air gap on-chip inductor

机译：高性能电磁气隙片上电感器的设计与表征
- 作者：Hsieh M.C.;Jair D.K.;Lin C. S.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
71.Micro embossing of ceramic green substrates for micro devices

机译：微型器件用陶瓷生坯的微压花
- 作者：Shan Xuechuan;Ling S. H.;Maw H. P.;Lu C. W.;Lam Y. C.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
72.Open ended microwave oven for packaging

机译：开放式微波炉包装
- 作者：Sinclair K. I.;Tilford T.;Desmulliez M. Y. P.;Goussetis G.;Bailey C.;Parrott K.;Sangster A. J.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
73.Next generation of TCAD environments for MEMS design

机译：用于MEMS设计的下一代TCAD环境
- 作者：Triltsch U.;Buttgenbach S.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
74.Electrostatically driven microgripper integrated piezoresistive force sensor

机译：静电驱动微夹钳集成压阻传感器
- 作者：Tao Chen;Liguo Chen;Lining Sun;Xinxin Li
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
75.Characterization and modeling of an electro-thermal MEMS atructure

机译：电热MEMS结构的表征和建模
- 作者：Szabo P. G.;Szekely V.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
76.Noise-based optimization and noise analysis for resonant MEMS structures

机译：谐振MEMS结构的基于噪声的优化和噪声分析
- 作者：Sharma Mrigank;Kannan Akila;Cretu Edmond
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
77.Integrated RF MEMS/CMOS devices

机译：集成式RF MEMS / CMOS器件
- 作者：Mansour R. R.;Fouladi S.;Bakeri-Kassem M.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
78.Processing and characterization of precision microparts from nickel-based materials

机译：镍基材料制成的精密微零件的加工和表征
- 作者：Allen D. M.;Almond H.J.;Bedner K.;Cabeza M.;Courtot B.;Duvall A.;Impey S.A.;Saumer M.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
79.Through silicon vias as enablers for 3D systems

机译：通过硅过孔作为3D系统的使能器
- 作者：Jung Erik;Ostmann A.;Ramm P.;Wolf J.;Toepper M.;Wiemer M.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
80.On the determination of poisson’s ratio of stressed monolayer and bilayer submicron thick films

机译：确定单层和双层亚微米厚膜的泊松比
- 作者：Martins P.;Malhaire C.;Brida S.;Barbier D.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
81.High density Through Silicon Via (TSV)

机译：高密度硅通孔（TSV）
- 作者：Rimskog Magnus;Bauer Tomas
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
82.High Q-factor CMOS-MEMS inductor

机译：高Q因数CMOS-MEMS电感器
- 作者：Ching-Liang Dai;Jin-Yu Hong;Mao-Chen Liu
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
83.Rejection of power supply noise in wheatstone bridges: Application to piezoresistive MEMS

机译：抑制惠斯通电桥中的电源噪声：在压阻MEMS中的应用
- 作者：Boujamaa El Mehdi;Soulie Yannick;Mailly Frederick;Latorre Laurent;Nouet Pascal
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
- MEMS;
- conditioning electronics;
- noise optimisation;
84.Low-drift flow sensor with zero-offset thermopile-based power feedback

机译：低漂移流量传感器，具有基于零偏移的热电堆功率反馈
- 作者：Dijkstra M.;Lammerink T.S.J.;de Boer M.J.;Berenschot J.W.;Wiegerink R.J.;Elwenspoek M.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
85.High performance microreactor for rapid fluid mixing and redox reaction of ascorbic acid

机译：高性能微反应器，用于抗坏血酸的快速流体混合和氧化还原反应
- 作者：Fang W. F.;Yang J. T.
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
- μ-TAS;
- Ascorbic acid;
- Microfluids;
- Microreactor;
- Redox reaction;
86.Simulation of an electrostatic energy harvester at large amplitude narrow and wide band vibrations

机译：静电能量采集器在大振幅，窄带和宽带振动下的仿真
- 作者：Tvedt Lars Geir Whist;Blystad Lars-Cyril Julin;Halvorsen Einar
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》
87.Fabrication of nanostructured PLGA scaffolds using anodic aluminum oxide templates

机译：使用阳极氧化铝模板制备纳米PLGA支架
- 作者：Hsueh Cheng-Chih;Wang Gou-Jen;Hsu Shan-hui;Hung Huey-Shan
- 会议名称：《Design, Test, Integration Packaging on MEMS/MOEMS, 2008 Symp on》