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International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics

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1.Design of epoxy for UV laser cure

机译：UV激光固化环氧树脂的设计
- 作者：Heiner Bayer
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
2.Development of low temperature processable core material for embedded inductor

机译：用于嵌入式电感的低温可加工芯材的开发
- 作者：Liu C.K.;Cheng P.L.;Law Y.W.;Chong I.T.;Lam D.C.C.
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
3.Uricase enzyme types immobilized in poly-N-methylpyrrole for biosensor applications

机译：用于生物传感器应用的聚氢甲基吡咯中固定的URICase酶类型
- 作者：Hunor Santha;Robert Dobay;Gabor Harsanyi
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
- Uric acid sensor;
- N-methyl-pyrrole;
- Uricase enzyme;
4.Development of low temperature processable core material for embedded inductor

机译：用于嵌入式电感的低温可加工芯材的开发
- 作者：C. K. Liu;P. L. Cheng;Y. W. Law;I. T. Chong;David C. C. Lam
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
5.Low-transmission-loss modified cyanate ester materials for high-frequency applications

机译：用于高频应用的低传导损耗改性氰酸酯材料
- 作者：Daisuke Fujimoto;Yasuyuki Mizuno;NozomuTakano;Shigeo Sase;Harumi Negishi;Takeshi Sugimura
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
6.Quantitative analysis of resistance of printed resistors

机译：印刷电阻阻力的定量分析
- 作者：P. L. Cheng;T. W. Law;C. K. Liu;I. T. Chong;David C. C. Lam
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
7.Design of epoxy resins for UV laser cure

机译：UV激光固化环氧树脂的设计
- 作者：Bayer H.
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
8.A lamination technique of LCP/Cu for electronic packaging

机译：电子包装LCP / Cu的层压技术
- 作者：Tadatomo Suga;Atsushi Takahashi;Matiar Howlader;Kinji Saijo;Shinji Oosawa
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
9.The effects of temperature and humidity aging on the contact resistance of novel electrically conductive adhesives

机译：温湿度老化对新型导电粘合剂接触电阻的影响
- 作者：G. Van Wuytswinkel;G. Dreezen;G. Luyckx
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
- Conductive adhesive;
- Contact resistance;
- Impact resistance;
- Drop test;
- Shear strength surface mount;
- Corrosion;
10.Modelling electrical conductivity of anisotropic chemical adhesives

机译：各向异性化学粘合剂的电导率建模
- 作者：Stephane Charruau
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
11.Thermal aspects of GaAs power FET attachment using isotropically conductive adhesive

机译：使用各向同性导电粘合剂的GaAs功率FET附件的热方面
- 作者：M. Mayer;J. Nicolics;G. Hanreich;M. Mundlein
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
12.Application of adhesives in MEMS and MOEMS assembly: a review

机译：粘合剂在MEMS和MOEMS组装中的应用：综述
- 作者：Farhad Sarvar;David A. Hutt;David C. Whalley
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
13.Thick film coating materials and fast conformal coating processes - a contradiction?

机译：厚膜涂料和快速保形涂层工艺 - 矛盾？
- 作者：Manfred Suppa;Carsten Schauer
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
14.Double-layer no-flow underfill materials and process

机译：双层无流量填充材料和过程
- 作者：Zhuqing Zhang;C. P. Wong
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
15.Encapsulant characterization - valuable tools for process setup and failure analysis

机译：密封剂表征 - 流程设置和故障分析的有价值工具
- 作者：K. -F. Becker;T. Braun;M. Koch;D. Vogel;R. Aschenbrenner;H. Reichl;H. -W. Hagedorn;J. Neumann-Rodekirch
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
16.Isotropically conductive adhesives for high power electronics applications

机译：高功率电子应用的各向同性导电粘合剂
- 作者：Kristian Olsson;Daniel Johansson;Shiming Lil;Karsten Ovesen;Johan Liu
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年
17.Effects of moisture and temperature ageing on reliability of interfacial adhesion with black copper oxide surface

机译：水分和温度老化对黑氧化铜表面界面粘合性可靠性的影响
- 作者：Mohamed Lebbai;Otto Y. M. Lam;Jang-Kyo Kim
- 会议名称：《International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics》 | 2002年