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Topical Meeting on Electrical Performance of Electronic Packaging
Topical Meeting on Electrical Performance of Electronic Packaging
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1.
A frequency expansion technique based on iterative solver and lump matrices
机译:
一种基于迭代求解器和块矩阵的频率扩展技术
作者:
An-Yu Kuo
;
Xiao Lin
;
Proekt L.
;
Yu Zhu
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
Maxwell equations;
electromagnetic field theory;
electromagnetic wave propagation;
finite element analysis;
iterative methods;
Lanczos algorithm;
electromagnetic equations;
finite element method;
frequency dependent material properties;
frequency domain expansion;
2.
EMI evaluation of a differential signaling interconnect at 3.2 Gbps
机译:
EMI评估3.2 Gbps的差分信令互连
作者:
Hao Shi
;
Echevarria V.
;
Beyene W.T.
;
Xingchao Yuan
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
electromagnetic interference;
integrated circuit interconnections;
3.2 Gbit/s;
800 Mbit/s;
EMI antenna;
XDR memory channel;
clock nets;
controller socket;
data patterns;
differential signaling interconnect;
differential signaling scheme;
differential signaling syst;
3.
Massively parallel conformal FDTD on a BlueGene supercomputer
机译:
蓝冠超计算机上大规模平行的共形FDTD
作者:
Hashemi M.R.
;
Mittra R.
;
Wenhua Yu
;
de Araujo D.N.
;
Cases M.
;
Pham N.
;
Matoglu E.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
finite difference time-domain analysis;
mainframes;
multiprocessor interconnection networks;
parallel machines;
BlueGene supercomputer;
electrical interconnects;
finite difference time domain code;
high-end server;
parallel conformal code;
parallel supercomputer;
4.
A parallel multilevel low-rank decomposition algorithm for fast simulation of high-speed electronic interconnect and packages
机译:
高速电子互连和包装快速仿真的平行多级低秩分解算法
作者:
Chuanyi Yang
;
Chakraborty S.
;
Gope D.
;
Ouyang G.
;
Jandhyala V.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integral equations;
integrated circuit interconnections;
integrated circuit packaging;
fast integral equation;
high-speed electronic interconnect;
high-speed electronic packages;
inter-process communication;
large scale simulation;
linear scalability;
load-balanc;
5.
The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM
机译:
加速全波模型的使用来分析高效地区的电力岛耦合
作者:
Morsey J.
;
Deutsch A.
;
Libous J.P.
;
Surovic C.
;
Rubin B.J.
;
Jiang L.
;
Eisenberg L.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
ball grid arrays;
fast Fourier transforms;
integral equations;
integrated circuit modelling;
HyperBGA SCM;
accelerated full-wave modeling;
accelerated full-wave solver;
adjacent power islands;
direct integral equation solutions;
full-wave electromagnetic field so;
6.
A high-sensitivity active magnetic probe using CMOS integrated circuits technology
机译:
使用CMOS集成电路技术的高灵敏度活性磁探头
作者:
Aoyama S.
;
Kawahito S.
;
Yasui T.
;
Yamaguchi M.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
CMOS integrated circuits;
integrated circuit measurement;
magnetic devices;
preamplifiers;
probes;
silicon-on-insulator;
CMOS integrated circuits technology;
CMOS-SOI technology;
active magnetic probe;
electric field suppression;
electrical switching;
near field me;
7.
Frequency domain analysis of the multi-tap driver in high speed links
机译:
高速链路中多次抽头驱动器的频域分析
作者:
Quint D.
;
Bois K.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
driver circuits;
frequency response;
frequency-domain analysis;
high-speed integrated circuits;
integrated circuit interconnections;
channel frequency response;
frequency domain analysis;
high speed links;
multitap link driver circuits;
tap settings;
8.
Solving low frequency EM-CKT problems using the PEEC method
机译:
使用PEEC方法解决低频EM-CKT问题
作者:
Gope D.
;
Ruehli A.
;
Jandhyala V.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
electric field integral equations;
equivalent circuits;
PEEC matrix;
current basis function;
electric field integral equation method;
low frequency behavior;
low frequency combined electromagnetic circuit;
low-frequency conditioning;
partial element equivalent c;
9.
Crosstalk analysis by fast computational algorithms
机译:
快速计算算法串扰分析
作者:
Qian Z.G.
;
Xiong J.
;
Sun L.
;
Chiang I.T.
;
Chew W.C.
;
Jiang L.J.
;
Chu Y.H.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
crosstalk;
integrated circuit interconnections;
criss-cross line structure;
crosstalk analysis;
crosstalk effect;
fast computational algorithm;
low frequency fast algorithm;
time domain signal;
10.
Multi-level parametric model order reduction for interconnect networks
机译:
互连网络的多级参数模型顺序减少
作者:
Min Ma
;
Tze-Mun Leung A.
;
Khazaka R.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit interconnections;
integrated circuit modelling;
singular value decomposition;
Krylov based PMR;
interconnect networks;
model order reduction method;
multilevel parametric model;
reduced macromodels;
reduced order models;
11.
Mid frequency decoupling using embedded decoupling capacitors
机译:
使用嵌入式去耦电容进行中频去耦
作者:
Muthana P.
;
Swaminathan M.
;
Engin E.
;
Markondeya Raj P.
;
Rao Tummala
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
UHF integrated circuits;
integrated circuit packaging;
thin film capacitors;
0.1 to 2 GHz;
board capacitors;
digital systems;
embedded decoupling capacitors;
embedded package capacitors;
mid frequency decoupling;
on-chip capacitance;
power/ground planes;
solder bal;
12.
System-level BER test and jitter extraction of a 6.4Gbps parallel chip to chip bus on the first generation CELL/spl trade/ processor
机译:
系统级别BER测试和抖动提取6.4Gbps并行芯片到第一代单元/ SPL贸易/处理器上的芯片总线
作者:
Madden C.
;
Kyung Suk
;
Torres A.
;
Jie Shen
;
Kizer J.
;
Ken Chang
;
Xingchao
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
built-in self test;
error statistics;
jitter;
microprocessor chips;
system buses;
6.4 Gbit/s;
BER test;
CELL processor;
bit counter;
bit error rate;
built-in self-test;
chip to chip bus;
deterministic jitter;
error counter;
jitter extraction;
jitter measurement method;
13.
A new method to achieve improved accuracy with IBIS models
机译:
一种实现提高宜必思型号的准确性的新方法
作者:
Varma A.
;
Steer M.
;
Franzon P.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
CMOS integrated circuits;
SPICE;
circuit simulation;
driver circuits;
equivalent circuits;
integrated circuit modelling;
integrated circuit noise;
CMOS voltage-mode driver circuit;
HSPICE;
IBIS models;
current-mode LVDS driver circuit;
equivalent circuits;
ground bo;
14.
A three-stage preconditioner for geometries with multiple holes and handles in integral equation-based electromagnetic simulation of integrated packages
机译:
具有多孔的几何形状的三阶段预处理器,并在集成封装的整体式电磁仿真中处理
作者:
Chakraborty S.
;
Gope D.
;
Ouyang G.
;
Jandhyala V.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
computational electromagnetics;
integral equations;
integrated circuit packaging;
iterative methods;
trees (mathematics);
arbitrary-shaped geometries;
basis function rearrangement;
electromagnetic components;
electromagnetic simulation;
incomplete LU;
integral equ;
15.
Application of a dispersive hybrid phase-pole macromodel to the time-domain simulation of frequency-dependent lossy interconnects
机译:
分散式混合相位极Macromodel在频率依赖性损耗互连时域模拟的应用
作者:
Zhong B.
;
Dvorak S.L.
;
Prince J.L.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
Bessel functions;
integrated circuit interconnections;
integrated circuit modelling;
time-domain analysis;
broadband transient simulator;
canonical Bessel-function-based integral;
dispersive hybrid phase-pole macromodel;
frequency-dependent lossy interconnects;
16.
Combining rational interpolation with the vector fitting method
机译:
将Rational Interpolation与载体拟合方法相结合
作者:
Mekonnen Y.S.
;
Schutt-Aine J.
;
Jilin Tan
;
Kumar C.
;
Milosevic D.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
convergence of numerical methods;
integrated circuit interconnections;
interpolation;
poles and zeros;
domain partitioning;
high-order rational approximation;
initial poles;
numerical stability;
partitioned bandwidth;
rational interpolation method;
vector fitting;
17.
Models for pre-layout inductance estimation including frequency effects on current return path in advanced digital circuits
机译:
预布局电感估计的模型,包括高级数字电路中电流返回路径的频率效应
作者:
David L.
;
Cregut C.
;
Huret F.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
inductance;
integrated circuit design;
integrated circuit interconnections;
integrated circuit modelling;
clock frequency;
current return path localization;
digital circuits;
frequency effects;
high-speed digital design;
on-chip interconnect;
pre-layout inductance;
18.
A novel graph partitioning technique for enhancing the computational efficiency of the loop-tree generalized PEEC modeling of 3D interconnects
机译:
一种新的曲线划分技术,用于提高3D互连的环路树广义PEEC建模的计算效率
作者:
Aosheng Rong
;
Cangellaris A.C.
;
Limin Dong
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
equivalent circuits;
integrated circuit interconnections;
integrated circuit modelling;
trees (mathematics);
3D interconnects;
G-PEEC model;
electromagnetic model;
electromagnetic response;
generalized PEEC model;
generalized partial-element-equivalent-circuit;
gr;
19.
Impact of probe placement on high frequency measurements of on-chip interconnects
机译:
探头放置对片上互连高频测量的影响
作者:
Jooyong Kim
;
Neikirk D.P.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
copper;
integrated circuit interconnections;
microwave measurement;
Cu;
copper interconnects;
high frequency measurements;
microwave probes;
on-chip interconnects;
phase error;
probe placement;
20.
Improving the efficiency of passivity compensation schemes via adaptive sampling
机译:
通过自适应采样提高被动补偿方案的效率
作者:
Grivet-Talocia S.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
eigenvalues and eigenfunctions;
integrated circuit modelling;
iterative methods;
accuracy-controlled sampling;
adaptive frequency sampling;
adaptive sampling;
imaginary Hamiltonian eigenvalues;
iterative multishift Arnoldi scheme;
lumped macromodels;
passivity co;
21.
A finite-volume method for on-package IR drop characterization
机译:
用于封装IR DROP表征的有限体积法
作者:
Xin Wu
;
Chetan Desai
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
Laplace equations;
electric potential;
finite volume methods;
integrated circuit packaging;
linear differential equations;
control-volume numerical method;
finite-volume method;
multigrid linear solver;
on-package IR drop analysis;
power delivery analysis;
steady-;
22.
A 2-dimensional distributed equivalent circuit model of EBG power distribution network
机译:
EBG配电网络的二维分布式等效电路模型
作者:
Junho Lee
;
Youchul Jeong
;
Joungho Kim
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
equivalent circuits;
lumped parameter networks;
photonic band gap;
2D distributed equivalent circuit model;
EBG power distribution network;
electromagnetic bandgap;
23.
Impact on inter symbol interference (ISI) noise due to simulation error
机译:
对符号帧间干扰(ISI)噪声引起的仿真错误影响
作者:
Bhattacharyya B.K.
;
Bao Shu Xu
;
Bhattacharya S.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
circuit simulation;
integrated circuit interconnections;
integrated circuit noise;
intersymbol interference;
circuit simulation error;
inter symbol interference noise;
interconnect performance;
24.
Using S-parameters successfully in time domain link simulations
机译:
在时域链接模拟中成功使用S参数
作者:
Kaller D.
;
Schuster C.
;
Kwark Y.
;
Altabella D.
;
Bao Truong
;
Zhaoqing Chen
;
Haridass A.
;
Klink E.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
S-parameters;
circuit simulation;
frequency-domain analysis;
time-domain analysis;
S-parameter measurements;
electrical link characterization;
eye diagrams;
frequency domain characterization;
time domain link simulations;
25.
Efficient simulation of transmission lines with EBG ground planes
机译:
高效地面平面的传输线路高效仿真
作者:
Ho J.C.W.
;
Roseanu T.S.
;
Abhari R.
;
Khazaka R.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
circuit simulation;
integrated circuit design;
integrated circuit interconnections;
photonic band gap;
circuit design;
electromagnetic band-gap structures;
lumped element frequency-dependent model;
transmission line simulation;
26.
Surface current modelling of the skin effect
机译:
表面电流建模皮肤效果
作者:
De Zutter D.
;
Rogier H.
;
Knockaert L.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit interconnections;
integrated circuit modelling;
skin effect;
2D on-chip interconnection;
equivalent surface current concept;
inductance matrices;
on-chip interconnect;
resistance matrices;
skin effect;
surface current modelling;
27.
Evaluation and reduction of simulation error of chip-to-chip signal delay
机译:
芯片到芯片信号延迟模拟误差的评估和减少
作者:
Ohshimar T.
;
Nonaka J.
;
Yamada I.
;
Ohno T.
;
Isozaki T.
;
Hachiya K.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
buffer circuits;
circuit simulation;
delays;
integrated circuit measurement;
integrated circuit modelling;
87 ps;
IBIS model;
chip-to-chip delay error;
chip-to-chip signal delay;
core logic cell;
input/output buffer;
simulation error evaluation;
28.
Losses caused by roughness of metallization in printed-circuit boards
机译:
印刷电路板中金属化粗糙度造成的损失
作者:
Deutsch A.
;
Surovic C.
;
Krabbenhoft R.
;
Kopcsay G.V.
;
Chamberlin B.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit metallisation;
printed circuits;
broadband modeling methodology;
causal modeling methodology;
interconnections;
metal roughness;
printed circuit board metallization;
signal integrity;
29.
Methods of eye-pattern window improvement using reflections caused by impedance mismatch: post-emphasis technique
机译:
使用阻抗不匹配引起的反射的眼图窗口改善方法:重点技术
作者:
Yamagishi K.
;
Saito S.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
SPICE;
interconnections;
printed circuit accessories;
transmission lines;
1 m;
5 Gbit/s;
PCB lines;
SPICE simulations;
eye-pattern window height;
eye-pattern window improvement;
high-impedance element;
impedance mismatch reflections;
transmission line;
waveform empha;
30.
Scalable driver I/O macromodels for statistical analysis
机译:
可扩展的驾驶员I / O Macromodels用于统计分析
作者:
Mutnury B.
;
Swaminathan M.
;
Cases M.
;
Pham N.
;
de Araujo D.N.
;
Matoglu E.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
driver circuits;
integrated circuit modelling;
integrated circuit testing;
interpolation;
statistical analysis;
I/O macromodels;
Lagrange interpolation technique;
differential driver circuits;
receiver circuits;
scalable macromodeling;
semiconductor process;
signal;
31.
Differential twinax cable modeling by measured 4-port S-parameters
机译:
通过测量的4端口S参数进行差动双轴电缆建模
作者:
Zhaoqing Chen
;
Prasad M.
;
OConnor D.
;
Bond P.
;
Muszynski A.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
SPICE;
cables (electric);
multiport networks;
transient analysis;
transmission lines;
4-port S-parameters;
SPICE circuit model;
cable delay;
differential twinax cable modeling;
frequency-domain responses;
transient circuit simulation tools;
transmission lines;
32.
Development of molded liquid crystal polymer surface mount packages for millimeter wave applications
机译:
用于毫米波应用的模塑液晶聚合物表面安装封装的研制
作者:
Kunia Aihara
;
Chen A.C.
;
Anh-Vu Pham
;
Roman J.W.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
coplanar transmission lines;
coplanar waveguides;
liquid crystal polymers;
plastic packaging;
surface mount technology;
25 GHz;
coplanar waveguide;
insertion loss;
millimeter wave applications;
molded liquid crystal polymer;
quad flat no-lead;
return loss;
surface m;
33.
Low cost CPU I/O analyzer under system conditions
机译:
低成本CPU I / O分析仪在系统条件下
作者:
Zobin G.
;
Sotman M.
;
Kostinsky A.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
analogue integrated circuits;
built-in self test;
system buses;
test equipment;
CPU I/O analyzer;
I/O testing;
IBIST-DFT functionality;
analog validation;
built-in self-test;
design for testability;
high speed bus validation;
modem buses;
34.
Signal integrity and robustness of ACCI packaged systems
机译:
ACCI打包系统的信号完整性和鲁棒性
作者:
Lei Luo
;
Wilson J.
;
Jian Xu
;
Mick S.
;
Franzon P.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
crosstalk;
integrated circuit interconnections;
integrated circuit noise;
integrated circuit packaging;
AC coupled interconnects;
ACCI packaged systems;
ISI control;
crosstalk;
signal integrity;
switching noise;
35.
Multi-Gb/s I/O link model to hardware correlation
机译:
多GB / S I / O链路模型到硬件相关性
作者:
Timpane T.J.
;
Fox B.A.
;
Maxson M.O.
;
Bartley G.K.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
S-parameters;
SPICE;
circuit simulation;
integrated circuit modelling;
time-domain analysis;
I/O link model;
RLGC models;
S-parameter model;
VNA extracted channel measurement;
end-to-end channel measurement;
hardware correlation;
time-domain simulation;
36.
Complex power distribution network investigation using SPICE based extraction from first principle formulations
机译:
复杂配电网络调查使用第一个原理配方的基于Spice提取
作者:
Selli G.
;
Drewniak J.L.
;
Dubroff R.E.
;
Fan J.
;
Knighten J.L.
;
Smith N.W.
;
Archambeault B.
;
Grivet-Talocia S.
;
Canavero F.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
SPICE;
frequency-domain analysis;
integrated circuit interconnections;
printed circuits;
time-domain analysis;
PCB systems;
SPICE based extraction;
frequency domain analysis;
full-wave modeling;
multilayer printed circuit board;
power distribution network;
time dom;
37.
Analysis of system-level electromagnetic interference from electronic packages and boards
机译:
电子封装和板系统级电磁干扰分析
作者:
Bracken J.E.
;
Polstyanko S.
;
Bardi I.
;
Mathis A.
;
Cendes Z.J.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
electromagnetic interference;
electronics packaging;
finite element analysis;
method of moments;
printed circuits;
2D finite element method;
3D FEM model;
electromagnetic interference;
electronic packages;
full-wave electrical behavior;
method of moments;
planar st;
38.
Characterization of microstrip interconnects over gridded ground planes
机译:
在网格接地平面上的微带互连的特征
作者:
Lin Zhu
;
Melde K.L.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
equivalent circuits;
frequency-domain analysis;
integrated circuit interconnections;
integrated circuit packaging;
microstrip circuits;
time-domain analysis;
equivalent characteristic impedance;
equivalent circuit;
frequency domain measurement;
gridded ground pla;
39.
Extraction of frequency dependent RLCG parameters of the packaging interconnects on low-loss substrates from frequency domain measurements
机译:
从频域测量中提取封装互连的频率相关RLCG参数
作者:
Guang Chen
;
Lin Zhu
;
Melde K.L.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
frequency-domain analysis;
integrated circuit interconnections;
integrated circuit measurement;
integrated circuit packaging;
calibration techniques;
frequency dependent RLCG parameters;
frequency domain measurements;
low-loss substrates;
packaging interconnects;
40.
Nonlinear macromodeling using model order reduction
机译:
使用模型顺序减少的非线性宏观调
作者:
Min Ma
;
Khazaka R.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
electronic design automation;
integrated circuit design;
integrated circuit modelling;
nonlinear network analysis;
time-domain analysis;
design automation;
frequency domain techniques;
linear circuits;
model order reduction;
nonlinear circuits;
nonlinear macromode;
41.
Linear circuit model combination for coupled noise simulation by using directional junction
机译:
使用方向交界处的耦合噪声模拟的线性电路模型组合
作者:
Zhaoqing Chen
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
circuit simulation;
integrated circuit modelling;
integrated circuit noise;
integrated circuit packaging;
circuit level linear model combination technique;
directional junction model;
linear circuit model combination;
multiaggressor single-victim coupled noise;
42.
Performance prediction of on-chip high-throughput global signaling
机译:
片上高吞吐量全局信令的性能预测
作者:
Hashimoto M.
;
Tsuchiya A.
;
Shinmyo A.
;
Onodera H.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit interconnections;
integrated circuit noise;
current-mode differential signaling;
nonzero impedance;
on-chip global signaling;
on-chip transmission lines;
power delivery;
power supply noise;
transmission capacity;
wave pipelining;
43.
Channel timing error analysis for DDR2 memory systems
机译:
DDR2内存系统的信道定时误差分析
作者:
Dan Oh
;
WooPoung Kim
;
Stott B.
;
Ling Yang
;
Yuan C.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
circuit optimisation;
integrated memory circuits;
timing;
667 Mbit/s;
DDR2 memory systems;
channel timing error analysis;
clock jitter;
edge-based timing extraction;
eye diagram;
strobe delay;
timing constraints;
44.
On-chip bus interleaving revisited
机译:
正在重新审视片上总线交错
作者:
Elfadel I.M.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
RC circuits;
crosstalk;
integrated circuit design;
integrated circuit interconnections;
integrated circuit noise;
bidirectional buses;
capacitive coupling noise;
electrical models;
global on-chip interconnect;
interconnect design;
local on-chip RC buses;
on-chip hi;
45.
Broadband electromagnetic analysis of interconnects by means of TLM and Krylov model order reduction
机译:
通过TLM和Krylov模型顺序互连的宽带电磁分析
作者:
Lukashevich D.
;
Cangellaris A.
;
Russer P.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
interconnections;
printed circuits;
transfer function matrices;
transmission line matrix methods;
Krylov model order reduction process;
broadband electromagnetic analysis;
broadband electromagnetic response;
multiport transfer function matrix;
planar interconnec;
46.
Efficient passive macromodels for lossy multiconductor transmission lines using high order finite element method
机译:
使用高阶有限元方法的有效多导体传输线的高效无源宏尺寸
作者:
Sampath M.K.
;
Dounavis A.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
approximation theory;
finite element analysis;
integrated circuit interconnections;
integrated circuit modelling;
multiconductor transmission lines;
time-domain analysis;
FEM approximation;
closed-form macromodeling algorithm;
high order finite element method;
lu;
47.
Analysis and issues of developing a build-up laminate multi-chip-module
机译:
开发堆积层压材料多芯片模块的分析与问题
作者:
Becker D.
;
Doyle M.
;
Bartley J.
;
Pease D.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit design;
integrated circuit packaging;
multichip modules;
build-up laminate multichip-module;
electrical analysis;
mechanical analysis;
packaging technology;
single-chip modules;
test vehicle;
thermal analysis;
wiring feasibility study;
48.
Application of transmission line models to backpanel plated through-hole via design
机译:
传输线模型在镀层电镀通孔的应用
作者:
Shaowei Deng
;
Hubing T.H.
;
Drewniak J.L.
;
Jun Fan
;
Knighten J.L.
;
Smith N.W.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
circuit simulation;
finite element analysis;
printed circuit design;
transmission lines;
differential transmission loss;
differential via pair;
full wave FEM modeling;
plated through-hole via design;
printed circuit board;
trace thickness;
transmission line models;
49.
Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications
机译:
混合信号应用交替阻抗电磁带隙(AI-EBG)结构的近场和远场分析
作者:
Jinwoo Choi
;
Dong Gun Kam
;
Daehyun Chung
;
Srinivasan K.
;
Govind V.
;
Joungho Kim
;
Swaminathan M.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit noise;
mixed analogue-digital integrated circuits;
photonic band gap;
SONNET;
alternating impedance electromagnetic bandgap structure;
far field analysis;
full wave solver;
mixed-signal applications;
near field analysis;
noise reduction;
return;
50.
A low-frequency extension of the time-domain adaptive integral method
机译:
时域自适应积分方法的低频扩展
作者:
Yilmaz A.E.
;
Jian-Ming Jin
;
Michielssen E.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
electromagnetic wave propagation;
fast Fourier transforms;
integral equations;
time-domain analysis;
FFT-accelerated time-domain integral-equation solver;
electromagnetic wave transient;
instantaneous field interaction;
low-frequency extension;
power grid;
signal;
51.
Model-order estimation and reduction of distributed interconnects via improved vector fitting
机译:
通过改进的向量拟合进行模型订购估计和分布式互连的减少
作者:
Sung-Hwan Min
;
Heeseok Lee
;
Eunseok Song
;
Yun-Seok Choi
;
Tae-Je Cho
;
Sa-Yoon Kang
;
Se-Yong Oh
;
Swaminathan M.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit interconnections;
transient analysis;
vectors;
distributed interconnects;
model-order estimation;
reduced-order macromodel;
redundant poles;
redundant residues;
transient simulation;
vector fitting;
52.
Simulation of switching noise in on-chip power distribution networks of FPGAs
机译:
FPGA片上电力分配网络的开关噪声模拟
作者:
Lalgudi S.N.
;
Kretchmer Y.K.
;
Swaminathan M.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
application specific integrated circuits;
field programmable gate arrays;
integrated circuit design;
integrated circuit interconnections;
integrated circuit noise;
application specific integrated circuit;
field programmable gate array;
ground grids;
on-chip powe;
53.
The general variational formulas for capacitance parameter extraction
机译:
用于电容参数提取的一般变分式
作者:
Chew W.C.
;
Jiang L.J.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
capacitance measurement;
parameter estimation;
variational techniques;
asymmetrical elastance matrix;
capacitance parameter extraction;
first order data;
general variational formulas;
mutual capacitances;
54.
Modeling and validation of complex midplane in a Blade environment
机译:
刀片环境中复杂中间平面的建模与验证
作者:
Herrman B.
;
Patel P.
;
Hughes J.
;
de Araujo D.N.
;
Cases M.
;
Pham N.
;
Matoglu E.
;
Hashemi R.
;
Mitra R.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit modelling;
network analysers;
network topology;
Blade environment;
BladeCenter system;
channel methodology;
flexible interface;
hardware VNA measurement;
midplane modeling;
midplane product;
midplane validation;
55.
Methodology for on-package decoupling capacitor selection with considerations of coupled core and IO power delivery network and simultaneous switching noise effects
机译:
具有耦合核心和IO电力传递网络的考虑和同时开关噪声效应的封装解耦电容选择的方法。
作者:
Mandhana O.P.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
capacitors;
integrated circuit modelling;
integrated circuit noise;
integrated circuit packaging;
logic circuits;
IO power delivery network;
core power delivery network;
core-logic circuits;
current signature spectrum;
multiport broadband package model;
on-die cap;
56.
Application of artificial neural network for efficient hardware characterization of high-speed interconnect systems
机译:
人工神经网络在高速互连系统高效硬件表征中的应用
作者:
Beyene W.T.
;
Ling Yang
;
Madden C.
;
Yuan C.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
high-speed integrated circuits;
integrated circuit interconnections;
integrated circuit measurement;
neural nets;
regression analysis;
IC measurement;
artificial neural network;
chip-to-chip communication system;
hardware characterization;
high-speed interconnect;
57.
A study of signal propagation in nonlinear interconnects
机译:
非线性互连信号传播的研究
作者:
Kasra Payandehjoo
;
Ramesh Abhari
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
circuit simulation;
harmonic generation;
integrated circuit interconnections;
transmission lines;
NLTL circuits;
circuit simulations;
electronic circuits;
harmonic generation;
nonlinear interconnects;
nonlinear transmission line;
signal propagation;
signal transmis;
58.
Surface-based finite element method for large-scale 3D circuit modeling
机译:
基于表面的大型3D电路建模的有限元方法
作者:
Jiao D.
;
Chakravarty S.
;
Changhong Dai
;
Shiuh-Wuu Lee
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
finite element analysis;
integrated circuit modelling;
sparse matrices;
2D surface element;
irregular geometry modeling;
large-scale 3D circuit modeling;
large-scale 3D physical circuit;
sparse matrices;
surface-based finite element method;
59.
Efficient generation of reduced-order interconnect macromodels using RLCG MNA formulation
机译:
使用RLCG MNA配方有效地产生依次互连巨额尺寸
作者:
Ishida T.
;
Tanji Y.
;
Kubota H.
;
Watanabe T.
;
Asai H.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
RC circuits;
integrated circuit interconnections;
integrated circuit modelling;
Krylov subspace methods;
RLCG MNA formulation;
reduced-order interconnect macromodels;
60.
An efficient algorithm for generation of loop-tree basis in 2.5D interconnect models
机译:
2.5d互连模型中的循环树基础的高效算法
作者:
Okhmatovski V.I.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
computational complexity;
integrated circuit interconnections;
integrated circuit modelling;
method of moments;
trees (mathematics);
interconnect models;
loop generation process;
loop-tree basis generation;
loop-tree decomposition;
method of moment;
shortest path;
61.
Power supply noise-aware 3D floorplanning for system-on-package
机译:
电源噪声感知3D平面图用于系统上的包装
作者:
Wong E.
;
Minz J.
;
Sung Kyu Lim
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit layout;
integrated circuit noise;
system-in-package;
3D floorplanning;
3D structure;
3D system-on-package;
decoupling capacitance;
footprint-aware decap insertion;
power supply noise-aware floorplanning;
simultaneous switching noise;
62.
High frequency electrical circuit model of chip-to-chip vertical via interconnection for 3-D chip stacking package
机译:
3-D芯片堆叠封装互连的芯片片垂直的高频电路模型
作者:
Chunghyun Ryu
;
Daehyun Chung
;
Junho Lee
;
Kwangyong Lee
;
Taesung Oh
;
Joungho Kim
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
S-parameters;
equivalent circuits;
integrated circuit interconnections;
integrated circuit measurement;
integrated circuit modelling;
integrated circuit packaging;
3D chip stacking package;
S-parameters;
chip-to-chip vertical via interconnection;
high frequency e;
63.
Delay analysis using FDTD for source synchronous interfaces
机译:
使用FDTD进行源同步接口的延迟分析
作者:
Hashemi M.R.
;
Mittra R.
;
de Araujo D.N.
;
Cases M.
;
Pham N.
;
Matoglu E.
;
Patel P.
;
Herrman B.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
delays;
finite difference time-domain analysis;
integrated circuit interconnections;
integrated circuit modelling;
current return effects;
delay analysis;
delay return effects;
finite difference time domain method;
interconnect structures;
parallel conformal meth;
64.
Combined FDTD/FETD algorithm for ground bounce characterization of differential traces through the planes
机译:
通过平面实现差分痕迹的地面反弹表征的FDTD / FETD算法
作者:
Wei-Da Guo
;
Guang-Hwa Shiue
;
Chien-Min Lin
;
Ruey-Beei Wu
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
finite difference time-domain analysis;
finite element analysis;
integrated circuit modelling;
printed circuits;
finite-difference time-domain algorithm;
finite-element time-domain algorithm;
ground bounce characterization;
ground bounce differential traces;
loc;
65.
Data center server packaging technology
机译:
数据中心服务器包装技术
作者:
Patel P.
;
Herrman B.
;
Hughes J.
;
de Araujo D.N.
;
Cases M.
;
Pham N.
;
Matoglu E.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit packaging;
network servers;
thermal management (packaging);
1U rack systems;
2U rack systems;
BladeCenter packaging technology;
blade server;
data center server;
disk storage;
hot-swappable devices;
network controllers;
power design;
rack-optimize;
66.
The effect of power islands on delta-I noise, interconnect noise, and timing for wide, on-chip data-buses
机译:
功率岛对截至芯片的噪声,互连噪声和时序的影响
作者:
Deutsch A.
;
Smith H.H.
;
Huang H.M.
;
Elfadel A.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit interconnections;
integrated circuit noise;
microprocessor chips;
power supply circuits;
delta-I noise;
interconnect noise;
microprocessor chip;
on-chip data-buses;
power distribution;
power island;
receiver circuits;
67.
Towards a traveling wave power distribution module using micromachined packaging techniques for millimeter and submillimeter wave applications
机译:
朝着采用微机械封装技术的行进波配电模块,用于毫米和淹没波浪应用
作者:
Dickman E.J.
;
Becker J.P.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit packaging;
micromachining;
millimetre wave circuits;
power combiners;
submillimetre wave circuits;
micromachined packaging techniques;
millimeter wave applications;
submillimeter wave applications;
traveling wave power distribution module;
68.
Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz
机译:
产品相关卡和MCM传输线的时间和频域测量结果比较高达65 GHz
作者:
Winkel T.-M.
;
Deutsch A.
;
Katopis G.A.
;
Kopcsay G.V.
;
Klink E.
;
Dyckman W.D.
;
Chamberlin B.J.
;
Grabinski H.
;
Surovic C.W.
;
Liu H.
;
Baks C.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
frequency-domain analysis;
integrated circuit interconnections;
multichip modules;
time-domain analysis;
transmission lines;
MCM transmission lines;
ceramic MCM test line structures;
frequency domain measurement;
low loss card;
material parameters;
multichip modul;
69.
Turbo-SPICE with latency insertion method (LIM)
机译:
带延迟插入方法(LIM)的涡轮香料
作者:
Zhichao Deng
;
Schutt-Aine J.E.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
SPICE;
circuit simulation;
integrated circuit modelling;
time-domain analysis;
K matrix formulation;
LIM-SPICE simulator;
SPICE framework;
latency insertion method;
linear computational complexity;
modified nodal analysis;
mutual inductance;
power distribution netw;
70.
Differential current-mode signaling for robust and power efficient on-chip global interconnects
机译:
用于鲁棒和功率有效的片上整体互连的差分电流模式信号
作者:
Liang Zhang
;
Wilson J.
;
Bashirullah R.
;
Franzon P.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit design;
integrated circuit interconnections;
bridge termination;
current return path control;
current-mode sensing;
differential current-mode signaling;
driver pre-emphasis;
inductance analysis;
interconnect design;
on-chip global interconnect;
71.
Leveraging symbiotic on-die decoupling capacitance
机译:
利用共生的模具去耦电容
作者:
Sotman M.
;
Popovich M.
;
Kolodny A.
;
Friedman E.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
capacitance;
integrated circuit design;
integrated circuit interconnections;
intentional capacitance;
interconnect;
quiescent circuits;
symbiotic on-die decoupling capacitance;
well-junction;
72.
Fully integrated AC coupled interconnect using buried bumps
机译:
完全集成的AC耦合互连使用埋地凸块
作者:
Wilson J.
;
Mick S.
;
Jian Xu
;
Lei Luo
;
Bonafede S.
;
Huffman A.
;
LaBennett R.
;
Franzon P.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit interconnections;
integrated circuit packaging;
soldering;
AC coupled interconnect;
ACCI;
buried solder bump;
capacitors;
data transmission;
ground distribution;
integrated chip;
package technology;
power distribution;
73.
EBG-enhanced split power planes for wideband noise suppression
机译:
EBG增强的宽带噪声抑制的分机电平
作者:
Chien-Lin Wang
;
Guang-Hwa Shiue
;
Ruey-Beei Wu
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
energy gap;
integrated circuit design;
integrated circuit noise;
interference suppression;
electromagnetic band-gap structures;
split power planes;
wideband noise suppression;
74.
Electrical/Optical High Speed Scalability Link Implementation
机译:
电气/光学高速可伸缩性链路实现
作者:
D. Kuchta
;
C. Baks
;
Y. Kwark
;
E. Mintarno
;
D. N. de Araujo
;
M. Cases
;
E. Matoglu
;
N. Pham
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
75.
Investigation of lead frame package interconnection for mm-wave balanced circuit
机译:
MM波平衡电路铅框架包互连的研究
作者:
Ito R.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
Ge-Si alloys;
integrated circuit interconnections;
integrated circuit modelling;
integrated circuit packaging;
millimetre wave integrated circuits;
plastic packaging;
SiGe;
common mode isolation;
device packaging;
differential SiGe circuit;
differential mode inser;
76.
Voltage regulator module noise analysis for high-volume server applications
机译:
高批量服务器应用的电压调节器模块噪声分析
作者:
Matoglu E.
;
Pham N.
;
Selli G.
;
Lai M.
;
Connor S.
;
Drewniak J.L.
;
Archambeault B.
;
Wang D.
;
Kuhn D.
;
Hashemi R.
;
de Araujo D.N.
;
Cases M.
;
Wilkie B.
;
Herrman B.
;
Patel P.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
circuit noise;
network servers;
power supply circuits;
voltage regulators;
conductive loss;
decoupling capacitors;
dielectric loss;
high-volume server;
irregular power shapes;
noise analysis;
noise coupling problems;
power plane model;
voltage regulator module;
77.
Transition structures for EBG waveguide-based interconnects
机译:
基于EBG波导的互连的过渡结构
作者:
Suntives A.
;
Abhari R.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
coplanar waveguides;
integrated circuit interconnections;
integrated circuit packaging;
photonic band gap;
waveguide transitions;
EBG waveguide-based interconnects;
parametric fullwave simulation scheme;
system packaging;
transition structures;
78.
Understanding how to model difficult features and related physical effects in electrical packages
机译:
了解如何在电包装中模拟困难的特征和相关的物理效果
作者:
Rubin B.J.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit modelling;
integrated circuit noise;
integrated circuit packaging;
apparent shielding ineffectiveness;
coupled line structures;
decoupling capacitors;
electrical package analysis;
ideal conductive enclosures;
negative inductance;
79.
EMI analysis of the LCD panel considering the display driver IC operations
机译:
考虑显示驱动器IC操作的LCD面板EMI分析
作者:
Chang-Woo Ko
;
Young-Seok Hong
;
Woo-Jin Jin
;
Jae-Sam Shim
;
Do-Wan Kim
;
Jong-Bae Lee
;
Joon-Ho Choi
;
Moon-Hyun Yoo
;
Jeong-Taek Kong
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
driver circuits;
electromagnetic interference;
integrated circuit noise;
liquid crystal displays;
EMI aggressor;
EMI analysis;
EMI noise level;
LCD panel;
decoupling capacitor;
display driver integrated circuit;
electromagnetic interference;
liquid crystal display;
80.
CMOS ICs power-supply related decoupling properties
机译:
CMOS IC电源相关的解耦属性
作者:
Vikinski O.
;
Waizman A.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
CMOS integrated circuits;
integrated circuit modelling;
power supply circuits;
CMOS integrated circuits;
decoupling properties;
die capacitance;
intentional decoupling elements;
on-die decoupling;
on-die inherent decoupling elements;
package-die resonance;
power d;
81.
On chip circuit model for accurate mid-frequency simultaneous switching noise prediction
机译:
关于精确中频同步开关噪声预测的芯片电路模型
作者:
Tingdong Zhou
;
Strach T.
;
Becker W.D.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
integrated circuit modelling;
integrated circuit noise;
chip leakage;
clock frequency noise;
intrinsic capacitance extraction;
mid-frequency SSN prediction;
on chip circuit model;
on chip power grid;
simultaneous switching noise prediction;
voltage controlled lea;
82.
Discontinuity impacts and design considerations of high speed differential signals in FC-PBGA packages with high wiring density
机译:
具有高布线密度的FC-PBGA封装中高速差分信号的不连续性影响和设计考虑
作者:
Nanju Na
;
Audet J.
;
Zwitter D.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
S-parameters;
ball grid arrays;
integrated circuit design;
integrated circuit packaging;
4 to 6 Gbit/s;
BGA via structure;
FCPBGA package discontinuity;
PTH via structure;
S-parameters;
TDR waveforms;
differential mode;
high speed SerDes signals;
high speed differen;
83.
Waveform relaxation techniques for simulation of coupled interconnects with frequency-dependent parameters
机译:
用于模拟耦合互连参数的波形松弛技术
作者:
Nakhla N.
;
Ruehli A.
;
Nakhla M.
;
Achar R.
;
Changzhong Chen
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
circuit simulation;
integrated circuit interconnections;
integrated circuit modelling;
iterative methods;
coupled interconnects simulation;
frequency-dependent parameters;
high-speed circuits;
interconnect structure;
limiting factor;
transverse partitioning;
wavef;
84.
Co-simulation of signal and power delivery networks with causality
机译:
因果关系信号和电力传递网络的共模
作者:
Mandrekar R.
;
Srinivasan K.
;
Engin E.
;
Swaminathan M.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
crosstalk;
frequency response;
integrated circuit interconnections;
transient analysis;
causality;
delay extraction;
power delivery network;
power distribution network;
signal co-simulation;
signal frequency response;
transient response;
transient simulation;
85.
Reducing the impact of power supply noise on microprocessor performance
机译:
降低电源噪声对微处理器性能的影响
作者:
Rahal-Arabi T.
;
Wong K.L.
;
Ma M.
;
Barkatullah J.
;
Taylor G.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
clocks;
integrated circuit noise;
microprocessor chips;
power supply circuits;
130 nm;
200 to 500 MHz;
clock distribution network;
data tracking;
filter design;
microprocessor performance;
power supply noise;
86.
Derivation of a network macromodel model with delay extraction for efficient time-domain simulation of lossy transmission lines
机译:
具有延迟提取的网络Macromodel模型的推导,以实现有效传输线的有效时域仿真
作者:
Blevins C.
;
Weisshaar A.
会议名称:
《Topical Meeting on Electrical Performance of Electronic Packaging》
|
2005年
关键词:
SPICE;
integrated circuit interconnections;
integrated circuit modelling;
time-domain analysis;
transmission lines;
Hspice;
coupled transmission line;
delay extraction;
delayless network;
ideal transmission line;
lossy transmission line;
network macromodel model;
ra;
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