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Japan International Electronic Manufacturing Technology Symposium

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1.Low Temperature Co-fireable Multilayer Ceramic Substrate With Internal Capacitor

机译：具有内部电容器的低温共用多层陶瓷基板
- 作者：Ochi H.;Baba Y.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
2.An Intelligent Adaptive Manufacturing Method With App~cation To Electronics Assembly

机译：应用APP〜阳离子的智能自适应制造方法
- 作者：Standridga C.R.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
3.Photointerrupter Using Three-dimensional Molded Plastic Plated With Conductive Wiring

机译：光器使用具有导电布线的三维模压塑料
- 作者：Matsuoka N.;Kimoto M.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
4.A Comparative Study Of Cohhercially Availarle No-Clean Solder Pastes : The Influence Of A Protective Atmosphere

机译：共同可用无清洁焊膏的比较研究：保护气氛的影响
- 作者：Potier N.;Mellul S.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
5.Degradation Of Tab Outer Lead Contacts Due To The Au Concentration In Eutectic Tin/lead Solder

机译：由于共晶锡/铅焊料中的Au浓度，凸片外铅接触的劣化
- 作者：Zakel E.;Azdasht G.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
6.Molding Compound Trends In A Denser Packaging World. I. Technology Evolution

机译：模塑复合趋势在密集包装世界中。 I.技术演变
- 作者：Nguyen L.T.;Lo R.H.Y.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
7.Comparison Of Reliability And Chacteristics Between Two Types Of Adhesiveless 2-metal Tab Tape

机译：两种粘合性2金属标签胶带之间的可靠性和特性的比较
- 作者：Mashiko Y.;Nishiyarna S.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
8.Proceedings Of 1993 Japan International Electronic Manufacturing Technology Symposium

机译：1993年日本国际电子制造技术研讨会
- 作者：Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
9.Future Prospects For The Multimedia Society And Hard-ware Technologies

机译：多媒体社会和硬件技术的未来前景
- 作者：Yasuda H.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
10.Repair Of Flip Chips (dca) On Glass Epoxy Printed Circuit Boards

机译：玻璃环氧印刷电路板上的翻盖（DCA）修理
- 作者：Miller D.;Gregorich T.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
11.Near Surface Region Of Modified Saw Substrates As A Component Of Layered Structure

机译：改性锯基板的近表面区域作为分层结构的组件
- 作者：Kapelewski J.;Dukata A.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
12.Liquid Crystal Displays: Tue Prominent Canoidate For Multimedia Displays

机译：液晶显示器：Multimedia显示器突出的CANOIDATE
- 作者：Funada F.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
13.An In-line Vacuum Deposition System Wih A Capability Of Compo!ite Fabrication Process On Large Deposition Area

机译：在线真空沉积系统WI H Compo的能力！大沉积区域上的制造过程
- 作者：Kauoka H.;Kokaku Y.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
14.Experimental Analytical Study Of Fine Pitch Qfp Solder-joint Reliability

机译：细沥青QFP焊点可靠性的实验分析研究
- 作者：Kojima Y.;Sakiura J.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
15.Hardware Technologies For Pen-based Computers

机译：基于笔的计算机的硬件技术
- 作者：Yamamoto H.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
16.A 1.5 Ghz-band Saw Filter Using Flip-chip-bonding Technique

机译：使用倒装芯片粘合技术的1.5 GHz带锯滤波器
- 作者：Onishi K.;Seki S.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
17.Stress Analysis On Hybrid Multilayer Substrate Composed Of Polyimide And Ceramics

机译：由聚酰亚胺和陶瓷组成的混合多层基板的应力分析
- 作者：Arima H.;Sotokawa E.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
18.A New Ionic Type Photosensitive Polyimide For Microelectronics

机译：一种用于微电子的新型离子型光敏聚酰亚胺
- 作者：Asano M.;Eguchi M.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
19.Interactions Between Thick Film Resistors And Alumina Substrate

机译：厚膜电阻器和氧化铝基材之间的相互作用
- 作者：Moriwaki H.;Suzuki A.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
20.Zone-melting Recrystallization Of Si Films By Flat Gas Flame Heating

机译：通过平坦气体火焰加热区熔融再结晶Si薄膜
- 作者：Kanai S.;Futagi S.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
21.Design Abstract For Manufacturing Of High Density Wire Bonded VLSI Packages

机译：设计摘要用于制造高密度线键合VLSI封装
- 作者：Guernalec J.-Y.;Joly J.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
22.A Low Cost Multi-chip Module Using Fine Line Thick Film And Solder Ball Bump Interconnection Methods

机译：使用细线厚膜和焊球凸块互连方法的低成本多芯片模块
- 作者：Segawa M.;Saito Y.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
23.Cream Solder Inspection Technology By Projecting Phase-shifted Fringes

机译：通过投影阶段移位的条纹膏状焊接检查技术
- 作者：Shlgeyama Y.;Kakimori N.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
24.Whisker Reinforced Copper / Glass-ceramic Multilayer Substrate

机译：晶须增强铜/玻璃 - 陶瓷多层基板
- 作者：Ikuina K.;Kimura M.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
25.Water-based Copper Oxide Compositions For Microcircuit Applications

机译：用于微电路应用的水基氧化铜组合物
- 作者：Wang C.B.;Yokotani Y.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
26.Trace Element Effect On Tin-lead (60-40) Solder Wetting

机译：对锡铅（60％-40％）焊料润湿的痕量元素效应
- 作者：Nianzu Wu;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
27.Surface Deftct Inspection For Small Sizes Of Chip- Electronic-Parts Applying Color lmage Analysis Techniques

机译：芯片电子零件的表面缺陷检测应用彩色图像分析技术
- 作者：Tanigichi K.;Nagata S.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
28.Numerical Calculation Of Ground-plane Impedance In Multilayer Printed Circuit Boards

机译：多层印刷电路板地面阻抗的数值计算
- 作者：Sakakibara K.;Mikazuki T.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
29.Towards Low Cost High Density Bumping

机译：朝向低成本高密度凸起
- 作者：Aintila A.;Jarvinen E.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
30.Develop Of Thick Copper Film Metallized Alumina Substrate for Small Size, High Power, On-Board Power Supply

机译：开发厚铜薄膜金属化氧化铝基板，用于小尺寸，高功率，板载电源
- 作者：Tedoriya K.;Kanamaru A.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
31.Optical Waveguide-to-photodiode Coupling Technique Using Total Internal Reflection Mirrors Fabricated In Polyimide Optical Waveguides

机译：使用聚酰亚胺光波导中制造的全内反射镜的光波导到光电二极管耦合技术
- 作者：Koike S.;Matsuura N.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
32.Development Of Thick Film Resistors Co-fireable With Ceramic Substrate

机译：用陶瓷基材共用厚膜电阻的开发
- 作者：Kondo R.;Suzuki Y.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
33.Low Frequency Noise Measurements On The Light Output And Current Of Laser Diodes

机译：光输出和激光二极管电流的低频噪声测量
- 作者：Shiyuan Yang;Mizunami T.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
34.An Automatically Assembled Miniaturized SMD Isolator For 1.9ghz Band Communications Systems

机译：用于1.9GHz频段通信系统的自动组装的小型SMD隔离器
- 作者：Ishikawa Y.;Okada T.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
35.Thermal Interaction In Ld Arrays

机译：LD阵列中的热交互
- 作者：Hayashi T.;Sate K.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
36.Surface Mount Type Sam Filter For Hand-held Telephones

机译：用于手持式电话的表面安装型SAM过滤器
- 作者：Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
37.Conditions For Reliable Ball-wedge Copper Wire Bonding

机译：可靠球楔铜线键合的条件
- 作者：Caers J.F.J.M.;Bischoff A.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
38.An Ultra Miniature Surface Mount Radio Frequency Coaxial Connector

机译：超小型表面安装射频同轴连接器
- 作者：Ogura H.;Sayanagi K.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
39.Development Of 'The Maple Method'

机译：“枫木方法”的发展
- 作者：Endoh K.;Nozawa K.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
40.High-pin-count Quad Flat Package With Thin-film Termination Resistors

机译：具有薄膜终端电阻的高引脚数四边形封装
- 作者：Sasaki S.;Kishimoto T.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
41.Air Cooling Of Mcms Mounted On Card-on- Board Packaging Systems

机译：安装在卡板上的封装系统上的MCM的空气冷却
- 作者：Harada A.;Kaneko Y.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
42.An Ultra Miniaturized Dielectric Band Pass Filter For 800 Mhz Band Cordless Telephone System

机译：用于800 MHz频段无绳电话系统的超小型化介质带通滤波器
- 作者：Tsujiguchi T.;Katoh H.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
43.Study On High Frequency Permeability Of Magnetic Multilayer Films

机译：磁性多层薄膜高频渗透性研究
- 作者：Senda M.;Ishii O.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
44.Thin Film Tri-electrode Electroluminescent Display Device And The Effect Of Aging Process On Its Parameters

机译：薄膜三电极电致发光显示装置及老化过程对其参数的影响
- 作者：Porada Z.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
45.A New Circuit Patterning Method For PCBs

机译：一种用于PCB的新电路图案化方法
- 作者：Yoshizumi A.;Shimizu S.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
46.Automation Of Memory Failure Analysis By Combining An Expert System With A Memory Tester/analyzer

机译：通过将专家系统与内存测试仪/分析仪相结合来自动化内存故障分析
- 作者：Hamada H.;Tsujide T.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
47.Recent Progress On Opto-electronics Technology For Future Muti-media World

机译：未来Muti-Media World Opto-Electronic技术技术的最新进展
- 作者：Kobayashi K.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
48.Superminiaturized Leadless Double-em-awed Mixer-modulator With Thick Film Print /fire Process

机译：具有厚膜印花/消防过程的超常见性无铅双EM-AWED混频器调制器
- 作者：Ohsawa M.;Ando Y.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
49.Tape Automated Bonding Packages: Electrical Considerations For High Frequency Applications

机译：磁带自动粘接包：高频应用的电气考虑因素
- 作者：Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
50.Fine Pitch Tab-lsi Interconnection Technology In MCM

机译：MCM中精细间距Tab-LSI互连技术
- 作者：Mori F.;Kudo K.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
51.Plasma Enhanced Cvd Method For Simultaneous Deposition On Both Sides Of The Substrate And Lts Application To The In-line Multilayer Deposition System

机译：等离子体增强的CVD方法，用于在基板两侧的同时沉积和LTS应用到线多层沉积系统
- 作者：Kokaku Y.;Inaba H.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
52.Small-sized 10-gbit/s Optical Transmitter And Receiver Modules Including 8-bit Mux/demux Ics

机译：小型10-Gbit / s光发射器和接收器模块，包括8位Mux / Demux IC
- 作者：Umeda T.;Kaminishi K.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
53.Author Index

机译：作者索引
- 作者：Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
54.Development Of Zero X-y Shrinkage Sintered Ceramic Substrate

机译：零X-Y收缩烧结陶瓷基材的开发
- 作者：Nishikawa H.;Tasaki M.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
55.Comparaitve Economic Analysis Of Mcm-d Fabrication Costs

机译：MCM-D制造成本的比较经济分析
- 作者：Garrout P.;Heistand R.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
56.Fail Bit Analysis System For Semiconductor Memory Wafers

机译：半导体存储器晶片的故障位分析系统
- 作者：Ishikawa S.;Ishihara K.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
57.A For 3D Assembly Simulation System Parts With Geometric Deviations

机译：A用于3D组装仿真系统部件，具有几何偏差
- 作者：Inoue K.;Okano A.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
58.Multichip Module For 156mb/s Optical Interface

机译：MultiChip模块为156MB / s光学接口
- 作者：Tanaka H.;Nagaoka R.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
59.On Chip Digital Output Semiconductor Sensor Employing Cmos Inverter Array

机译：在芯片数字输出半导体传感器上采用CMOS逆变器阵列
- 作者：Kasamatsu A.;Bom-yun Kim;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
60.I/O Pin Solder Point Inspection System

机译：I / O PIN焊点检测系统
- 作者：Koezuka T.;Suto Y.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
61.A Synthesis Of Adaptive Control Systems For Industrial Robots

机译：工业机器人自适应控制系统的合成
- 作者：Filaretov V.F.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
62.Robust Fault Detection In Technological Equipment

机译：技术设备中的强大故障检测
- 作者：Zhirabok A.N.;Preobrazhenskaya O.V.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
63.Manufacturing A Fine Pattern Fpc Of Aluminum-polyester Composite

机译：制造铝 - 聚酯复合材料的精细图案FPC
- 作者：Kohara I.;Takaishi M.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
64.Joint Of High Tc Superconductor With Low Loss And High Strength

机译：具有低损耗和高强度的高TC超导体的关节
- 作者：Suzuki N.;Ishii O.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
65.Error-free Subsystem Optical Interconnections

机译：无差错子系统光学互连
- 作者：Takai A.;Haneda M.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
66.Packaging Of Pointing Device For Notebook PC With 84/89 Keys

机译：带84/89键的笔记本电脑指向装置的包装
- 作者：Yamada S.;Twchiya K.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
67.Package Deformation And Cracking Mechanism Due To Reflow Soldering

机译：回流焊接引起的包装变形和裂缝机制
- 作者：Sawada K.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
68.2-d Measuring Fiber-optic Network

机译：2-D测量光纤网络
- 作者：Kulchin Y.N.;Vitrlk O.B.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
69.Hermetic Sealing Method For High-speed Mcms

机译：高速MCMS的密封方法
- 作者：Handa T.;Iida S.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
70.Adaptlive Solder Paste Composites Smart Solder Pastes

机译：适配焊膏复合材料智能焊膏
- 作者：Val C.;Leroy M.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
71.Ceramic Flat Packages For High-speed And High-frequency

机译：用于高速和高频的陶瓷平包
- 作者：Nacata K.;Miyamoto T.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
72.Applications And Technology For Laminate Multicihip Modules

机译：层压多线模块的应用和技术
- 作者：Crowley R.T.;Vardaman E.J.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
73.Development Of A Laser Function Trimming For Car Radio Tuners

机译：开发汽车无线电调谐器的激光功能修剪
- 作者：Kagiya Y.;Sato T.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
74.Diagnosis Of Dynamic Processes Described By Nonlinear Uncertain Models

机译：非线性不确定模型描述的动态过程的诊断
- 作者：Shumsky A.Y.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
75.Automotive Printed Wiring Board Manufacturers Succeed With 100 Solids Con Formal Coatings And No-clean Flux

机译：汽车印刷配线板制造商成功搭配100％固体涂层和无清洁的通量
- 作者：Wilson S.;Fogelsinger-Huss M.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
76.A New Washingless Hybrid-mounting Technique For Bare Chip ICs And SMDs

机译：一种新的裸芯片IC和SMD的无涤合金安装技术
- 作者：Ozaki H.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
77.Nonvolatile Memory Based On Reversible Phase Transition In Chalcogenide Semiconductor Thin Film

机译：基于硫属化物半导体薄膜可逆相转变的非易失性记忆
- 作者：Nakayama K.;Kitagawa T.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
78.Thermally Conductive Circuit Board Using Anodized Aluminum And Polymer Thick Film

机译：采用阳极氧化铝和聚合物厚膜的导热电路板
- 作者：Takeda K.;Uematsu Y.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
79.Shaping And Coupling Of Optical Thick Film Waveguides

机译：光厚膜波导的成型与耦合
- 作者：Keresztes-Nagy Z.;Harsany G.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
80.A Stud-bump-bonding Technique For High Density Multi-chip-module

机译：高密度多芯片模块的螺柱凸块键合技术
- 作者：Bessho Y.;Tomura Y.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
81.Optical Delay Tester

机译：光学延迟测试仪
- 作者：Ozaki K.;Nagai T.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
82.A Micro Step Structures Motion Of Polysilicon On Silicon Substrate

机译：多晶硅在硅衬底上的微步结构运动
- 作者：Junqi Zhu;Akiyama T.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
83.A Study Of Polyimide Adhesion To Epoxy Resjn In PFP Using Multivariate Analysis Of XPS Spectra

机译：利用XPS光谱多元分析研究PHP中环氧树脂的聚酰亚胺粘附研究
- 作者：Takeuchi K.;Tsutsui K.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
84.Single Point Outer Mad Bonding Technology For High Pin Count Ceramic PGA

机译：高针计数陶瓷PGA的单点外疯粘接技术
- 作者：Ando T.;Tomioka T.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
85.Super Uniform Silicon Photo Diode Covering From The UV To IR Regions

机译：超均匀硅光光电二极管覆盖从UV到IR区域
- 作者：Fujii Y.;Mori H.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
86.Pin Brazing Technology For A High Performance Aluminum Nitride Package

机译：用于高性能氮化铝包装的销钎焊技术
- 作者：Iyogi K.;Yamakawa K.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
87.Influence Of Newly Molding Compound Properties On Package Failure During Reflow Soldering Process

机译：新建复合性能对回流焊接过程中包装破坏的影响
- 作者：Murayama M.;Ito H.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
88.Erbium-doped Fiber Amplifier

机译：掺铒光纤放大器
- 作者：Kakinuma T.;Shikii S.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
89.Ball Grid Array (BGA): The New Standard For High I/O Surface Mount Packages

机译：球栅阵列（BGA）：高I / O表面贴装的新标准
- 作者：Freyman B.;Marrs R.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
90.High Speed Electrical Characterization And Simulation Of A Pin Grid Array Package

机译：引脚栅格阵列包装高速电气表征及仿真
- 作者：Goodman T.W.;Fujita H.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
91.A Mixed Solder Grid Array And Peripheral Leaded Mcm Package

机译：混合焊料栅格阵列和外围有铅MCM包装
- 作者：Hashemi H.;Olla M.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
92.Thermal Stress Analysis Of Conductive Adhesive Joints

机译：导电粘合剂的热应力分析
- 作者：Ogunjimi A.O.;Whalley D.C.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
93.Planarization Process Of Copper-polyimide Thin Film Multilayer Substrate

机译：铜 - 聚酰亚胺薄膜多层基材的平坦化工艺
- 作者：Kasuya Y.;Takahashi Y.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
94.A Survey Of Critical Metrology Needs For IC Interconnect Processes Based On Assessment By Quality Function Deployment (qfd) Methodology

机译：基于质量函数部署（QFD）方法的评估基于评估的IC互连过程的临界计量需求调查
- 作者：Pope D.E.;Prough S.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
95.New Wave Soldering Machine For Zero Defect Soldering

机译：用于零缺陷焊接的新型波峰焊机
- 作者：Hanamitsu N.;Ohtsubo E.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
96.Fine Pitch And High Lead Count Multilayer Ceramic Qfp

机译：细间距和高铅计数多层陶瓷QFP
- 作者：Nakatsuka Y.;Yamamoto T.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年
97.Polymer Ablation With A High Power Excimer Laser Tool In Manufacturing

机译：用高功率准分子激光工具制造的聚合物消融
- 作者：Wolbold G.E.;Tessle C.L.;Institute of Electric and Electronic Engineer
- 会议名称：《Japan International Electronic Manufacturing Technology Symposium》 | 2001年