首页>外文会议>其他>IMAPS International Conference and Exhibition on High Temperature Electronics

IMAPS International Conference and Exhibition on High Temperature Electronics

召开年：
召开地：
出版时间：-

会议文集：-

会议论文

热门论文

全部论文

全选（0）

1.HIGH TEMPERATURE HYBRID NANODIAMOND SENSOR SYSTEMS

机译：高温混合纳米金刚胺传感器系统
- 作者：John R. Fraley;Lauren Kegley;Stephen Minden;Jimmy L. Davidson;David Kerns
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
2.High Temperature Dynamic Pressure Measurements Using Silicon Carbide Pressure Sensors

机译：使用碳化硅压力传感器的高温动态压力测量
- 作者：Robert S. Okojie;Roger D. Meredith;Clarence T. Chang;Ender Savrun
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- SiC Pressure Sensor;
- Dynamic Test;
- And High Temperature;
3.Stress Intensity of Delamination in a Sintered-Silver Interconnection

机译：烧结银互连中分层的压力强度
- 作者：D. J. DeVoto;P. P. Paret;A. A. Wereszczak
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- Bonded interfaces;
- Sintered-silver;
- Reliability;
- Delamination;
- Stress intensity;
4.Effect of Sn Component Surface Finish on 92.5Pb-5Sn-2.5Ag

机译：SN组分表面光洁度在92.5pb-5sn-2.5ag上的影响
- 作者：Harry Schoeller;Martin Anselm;Imran Khan;Eric Cotts
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- High temperature solder;
- Surface finish;
- Fatigue;
- Microstructure;
5.Galvanic Isolation of Logic Signals at Extreme Temperatures

机译：极端温度下逻辑信号的电流隔离
- 作者：Bruce Ferguson
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
6.Modeling of Thermomechanical Behaviour of Wire Bonded Electronic Devices under Combined Thermal and Vibration Loads

机译：混合热振动载荷钢丝粘合电子设备热机械性能建模
- 作者：R. Man;C. Liu;M. Mirgkizoudi;S. Riches
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- Wire bonding reliability;
- Combined high temperature amp;
- vibration;
- FEA;
7.GaN Power Module with High Temperature Gate Driver and Insulated Power Supply

机译：GaN电源模块具有高温栅极驱动器和绝缘电源
- 作者：Remi PERRIN;Dominique BERGOGNE;Christian MARTIN;Bruno ALLARD
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- GaN;
- Dedicated Driver;
- High-Temperature;
- Power-Supply;
8.Reliability and Corrosion Resistance of High Temperature Lead-Free BiAgX Paste

机译：高温无铅BIAGX浆料的可靠性和耐腐蚀性
- 作者：HongWen Zhang;RunSheng Mao;Ning-Cheng Lee;Satoshi Tanimoto
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
9.The Effects of Repeated Refresh Cycles on the Oxide Integrity of EEPROM Memories at High Temperature

机译：重复刷新循环对高温EEPROM存储器氧化物完整性的影响
- 作者：Lynn Reed;Vema Reddy
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- EEPROM;
- Data Retention;
- Oxide Damage;
- Refresh Cycle;
10.Has Microelectronic MCM Technology Matured and is it Capable of Servicing the Widespread Needs of Down Well 225°C Operating Applications in the Oil and Gas Industry?

机译：有微电子MCM技术成熟，它能够为石油和天然气行业中的225°C操作应用的广泛需求提供服务吗？
- 作者：Bob Hunt
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
11.Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg

机译：设计和制造双侧冷却，SiC，高温逆变腿
- 作者：Raphael RIVA;Cyril BUTTAY;Marie-Laure LOCATELLI;Vincent BLEY;Bruno ALLARD
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- 3-D packaging;
- Sandwich module;
- JFET;
- Silver sintering;
- Silver migration;
12.Characterization of Thick Film Technology for 300°C Packaging

机译：300°C包装厚膜技术的表征
- 作者：Rui Zhang;R. Wayne Johnson;Vinayak Tilak;Tan Zhang;David Shaddock
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- High Temperature;
- Packaging;
- Thick Film;
13.High Temperature Laminate Characterization

机译：高温层压性表征
- 作者：David Shaddock;Liang Yin
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- High Temperature Electronics;
- High Temperature Packaging;
- Reliability;
14.Practical Oil Field Requirements for New High-Temperature Batteries

机译：新型高温电池的实用油田要求
- 作者：Randy Normann
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
15.High-Temperature, High-Dielectric-Constant Capacitors for Power Inverters in Hybrid Electric Vehicles

机译：用于混合动力电动车辆的电力逆变器的高温高介电常数电容器
- 作者：U. Balachandran;M. Narayanan;B. Ma
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- Ferroelectric film;
- Ceramic dielectrics;
- PLZT;
- Dielectric property;
- Embedded capacitor;
16.Nanocomposite Film Dielectrics for High Temperature Power Conditioning Capacitors

机译：用于高温功率调节电容器的纳米复合膜电介质
- 作者：Kirk Slenes;Lew Bragg
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- Fluorenone polyester;
- Nanocomposite;
- Capacitor;
- Volumetric efficiency;
17.A Comparison of Multilayer Ceramic Capacitor Technologies for High Temperature Applications

机译：多层陶瓷电容器技术对高温应用的比较
- 作者：Craig Nies;Scott Harris;Stanley Cygan
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- Capacitor;
- Dielectric;
- Relaxor;
- High temperature;
18.SiGe Amplifier and Buffer Circuits for High Temperature Applications

机译：SiGe放大器和用于高温应用的缓冲电路
- 作者：Dylan B. Thomas;Nelson E. Lourenco;John D. Cressler;Steven Finn
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- Silicon-germanium;
- SiGe HBT;
- Operational amplifier;
- Output buffer;
19.High Temperature CMOS Reliability and Drift

机译：高温CMOS可靠性和漂移
- 作者：Shane Rose
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- CMOS Reliability;
- ASIC;
- Voltage Regulator;
- High Temperature Electronics;
20.Thermomechanical Stresses in Copper Films at Elevated Temperature

机译：升高温度下铜膜的热机械应力
- 作者：Martin Lederer;Javad Zarbakhsh;Rui Huang;Thomas Detzel;Brigitte Weiss
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- Copper films;
- Temperature cycle;
- Plasticity modeling;
- Thermomechanical stress;
- Wafer curvature;
21.High temperature solders containing Aluminum and Zinc

机译：含铝和锌的高温焊料
- 作者：H. R. Kotadia;O. Mokhtari;M. Bottrill;M. P. Clode;M. A. Green;S. H. Mannan
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- Pb-free solder;
- Intermetallic;
- Interfacial reactions;
- Sn-Ag-Cu alloys;
22.High Temperature Performance of Normally-off SiC JFET's Compared to Competing Approaches

机译：与竞争方法相比，常关SIC JFET的高温性能
- 作者：J. B. Casady;D. C. Sheridan;A. Ritenour;V. Bondarenko;R. Kelley
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- SiC;
- JFET;
- Enhancement-mode;
- Normally-off;
- Temperature;
- Module;
23.Reliability Assessment of Passives for 300°C using HALT

机译：使用停止使用300°C的可靠性评估
- 作者：David Shaddock;Vinayak Tilak;Tan Zhang;Rui Zhang;R. Wayne Johnson
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- High Temperature;
- Capacitor;
- Resistors;
24.Capacitor Characterization Study for a High Power, High Frequency Converter Application

机译：高功率，高频转换器应用的电容器表征研究
- 作者：William C. Lanter;Hiroyuki Kosai;Tyler Bixel;B. Allen Tolson;Jeffery Stricker;James Scofield;Navjot Brar;Biswajit Ray
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- High Temperature;
- High Power;
- Capacitor;
- DC-DC Converter;
- Capacitor Packaging;
25.Robust Class-I BME Ceramic Capacitors for High Temperature Applications

机译：用于高温应用的强大级别BME陶瓷电容器
- 作者：Abhijit Gurav;Xilin Xu;Jim Magee;Jeff Franklin;Travis Ashburn
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- High temperature capacitor;
- BME MLCC;
- C0G;
- X9G;
26.Design of High Temperature EMI Input Filter for a 2 KW HVDC-fed Inverter

机译：2 KW HVDC馈电器的高温EMI输入滤波器设计
- 作者：Remi ROBUTEL;Christian MARTIN;Herve MOREL;Cyril BUTTAY;Dominique BERGOGNE;Nicolas GAZEL
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- EMC;
- High temperature;
- EMI Filter;
- Choke;
- Common Mode;
- Differential mode;
27.Assessment of Au-Ge Die Attachment for an Extended Junction Temperature Range in Power Applications

机译：评估AU-GE模具附件在电力应用中的扩展结温范围内
- 作者：Satoshi Tanimoto;Kohei Matsui;Yoshinori Murakami;Hiroshi Yamaguchi;Hajime Okumura
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- High temperature;
- Power device;
- SiC;
- Au-Ge;
- Die attachment;
- Ceramic substrate;
28.Swelling Phenomena in Sintered Silver Die Attach Structures at High Temperatures: Reliability Problems and Solutions for an Operation above 350°C

机译：烧结银模具的膨胀现象在高温下的结构：可靠性问题和解决方案，用于350°C以上的操作
- 作者：N. Heuck;S. Mueller;G. Palm;A. Bakin;A. Waag
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
29.Edge-Controlled Mechanical Failure of Si and SiC Semiconductor Chips

机译：Si和SiC半导体芯片的边缘控制机械故障
- 作者：A. A. Wereszczak;O. M. Jadaan;T. P. Kirkland
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- Weibull distribution;
- Failure probability;
- Strength;
- Tensile stress;
- Strength-limiting flaw;
- Reliability;
30.Performance and Reliability of MEMS Gyroscopes and Packaging at High Temperatures

机译：MEMS陀螺仪和高温包装的性能和可靠性
- 作者：Patrick McCluskey;Chandradip Patel;David Lemus
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- MEMS;
- Sensors;
- Packaging;
- Reliability;
- Tracking;
31.Performance and Reliability Characteristics of 1200 V, 100 A, 200°C Half-Bridge SiC MOSFET-JBS Diode Power Modules

机译：1200 V，100 A，200°C半桥SIC MOSFET-JBS二极管电源模块的性能和可靠性特性
- 作者：James D. Scofield;J. Neil Merrett;Anant Agarwal;Scott Leslie
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- High temperature;
- SiC power module;
- SiC MOSFET;
- Reliability testing;
32.Comparison of High Temperature Operation of Silicon Carbide MOSFETs and Bipolar Junction Transistors

机译：碳化硅MOSFET和双极结晶体管高温操作的比较
- 作者：Jim Richmond;Sei-Hyung Ryu;Qingchun (Jon) Zhang;Brett Hull;Mrinal Das;Albert Burk;Anant Agarwal;John Palmour
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- Silicon Carbide;
- MOSFET;
- BJT;
- Transistor;
- Reliability;
33.Effect of High Temperature Ageing on Active and Passive Power Devices

机译：高温老化对主动和无源电气设备的影响
- 作者：Cyril BUTTAY;Remi ROBUTEL;Christian MARTIN;Christophe RAYNAUD;Simeon DAMPIENI;Dominique BERGOGNE;Thibaut CHAILLOUX
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- SiC;
- High temperature capacitor;
- Magnetic material;
- Schottky diode;
34.285°C Resi e Analysis

机译：285°C Reses和分析
- 作者：Mark Hahn;Ron Smith;Milton Watts
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- High Temperature Electronics;
- Resistors;
- Aging;
- Drift;
35.Stacked Ceramic Capacitors for High Temperatures (≥ 200°C)

机译：用于高温的堆叠陶瓷电容器（≥200°C）
- 作者：John Bultitude;Lonnie Jones;John McConnell;Abhijit Gurav
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- Stacked ceramic capacitors;
- BME MLCC;
- C0G;
- HMP Solders;
- High temperature Interconnects;
36.Design Considerations for Reliable High Temperature Operation of Wet Electrolytic Tantalum Capacitors

机译：湿式电解钽电容可靠高温操作的设计考虑因素
- 作者：Jeremy Ladd
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
37.Performance of commercial SOI driver in harsh conditions (up to 200°C)

机译：商用SOI驱动程序在恶劣条件下的性能（最多200°C）
- 作者：K. El Falahi;B. Allard;D. Tournier;D. Bergogne
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- Driver;
- SOI;
- High temperature;
- Characterization;
38.High Temperature Inverter for Airborne Application

机译：高温逆变器用于机载应用
- 作者：Fabien Dubois;Dominique Bergogne;Damien Risaletto;Remi Robutel;Herve Morel;Regis Meuret;Sonia Dhokkar
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- Voltage Source Inverter;
- SiC JFET;
- Gate driver;
- DC-link capacitor;
- Normally-on devices protection;
39.Parylene HT: A High Temperature Vapor Phase Polymer for Electronics Applications

机译：聚苯乙烯HT：用于电子应用的高温气相聚合物
- 作者：Rakesh Kumar
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- Parylene HT;
- Electronics;
- Protection;
- Reliability and packaging;
40.A Universal BCD-on-SOI Based High Temperature Short Circuit Protection for SiC Power Switches

机译：基于USIC电源开关的通用BCD-ON-SOI高温短路保护
- 作者：Liang Zuo;S. K. Islam;M. A. Huque;C. Su;B. J. Blalock;L. M. Tolbert
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- SiC;
- BCD-on-SOI;
- High-voltage;
- Short-circuit protection;
- High-temperature;
41.Rugged ICs against Corrosion, Shock plus Hotter Temperatures

机译：崎岖的IC抗腐蚀，冲击加上热温
- 作者：James J. Wang
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
42.A High-Temperature Folded-Cascode Operational Transconductance Amplifier in 0.8-μm BCD-on-SOI

机译：高温折叠式共级运行跨导放大器，在0.8-μmbcd-on-soi中
- 作者：C. Su;B. J. Blalock;S. K. Islam;L. Zuo;L. M. Tolbert
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
43.Extreme thermal resistance of all-polyimide bondlines with TPI adhesive

机译：全聚酰亚胺键合带TPI粘合剂的极端热阻
- 作者：Jim Fraivillig
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
44.A System On Chip (SOC) ASIC chipset for Aerospace and Energy Exploration Applications

机译：用于航空航天和能源勘探应用的芯片（SOC）ASIC芯片组系统
- 作者：Bhal Tulpule;Bruce Ohme;Al Behbahani;John Gerety
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
45.Pressureless, Low Temperature Sintering of Micro-scale Silver Paste for Die Attach for 300°C Applications

机译：用于模具的微级银浆的无压，低温烧结为300°C应用
- 作者：Fang Yu;R. Wayne Johnson;Michael Hamilton
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- High temperature operation;
- Die attach;
- Sintered Ag;
- Reliability;
46.Characterization of AgBiX Solder Paste on Thick Film for 200°C Applications

机译：厚膜上Agbix焊膏的表征200°C应用
- 作者：Zhenzhen Shen;Wayne Johnson;Michael C. Hamilton
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- Thick film;
- Soldering;
- Die attach;
47.Thermo-mechanical simulation of sintered Ag die attach for high temperature applications

机译：烧结AG模具的热电机模拟高温应用
- 作者：M. F. Sousa;M. V. Dijk;H. Walter;C. Weber;M. Hutter;H. Oppermann;O. Wittler;K. D. Lang
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
48.Using Parallel High Voltage Multipliers for 100kV Downhole Neutron Generator Power Supplies

机译：使用平行高压倍增器100KV井下中子发生器电源
- 作者：Gary Hanington
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
49.High Temperature Microelectromechanical Systems Using Piezoelectric Aluminum Nitride

机译：采用压电铝氮化物的高温微机电系统
- 作者：Benjamin A. Griffin;Scott D. Habermehl;Peggy J. Clews
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- MEMS;
- Aluminum nitride;
- Silicon carbide;
- Piezoelectric;
- High temperature;
50.Characterization of Circuit Blocks for Configurable Analog-Front-End

机译：可配置模拟端的电路块的特征
- 作者：Bruce W. Ohme;Mark R. Larson;Bhal Tulpule;Alireza Behbahani
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- High Temperature Electronics;
- High Temperature SOI CMOS;
- Analog Front End;
51.500 kHz – 5 MHz Phase-Locked Loops in High-Temperature Silicon Carbide CMOS

机译：高温碳化硅CMOS中500 kHz - 5 MHz相位锁环
- 作者：Paul Shepherd;Ashfaqur Rahman;Shamim Ahmed;A. Matt Francis;Jim Holmes;H. Alan Mantooth
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
52.Packaging Technology for High Temperature Capacitive Pressure Sensors

机译：高温电容式压力传感器的包装技术
- 作者：Liang-Yu Chen;Glenn M. Beheim;Roger D. Meredith
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- High temperature;
- Packaging;
- Pressure sensor;
53.Class-I and Class-II Ceramic Capacitors for High Temperature Applications

机译：用于高温应用的I类和II类陶瓷电容器
- 作者：Abhijit Gurav;Xilin Xu;Jim Magee;Reggie Phillips;Travis Ashburn
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- High temperature capacitor;
- BME MLCC;
- C0G;
- X9G;
- X7R;
- Ceramic Capacitor;
54.Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material?

机译：烧结银作为粘结界面材料的独特性和挑战？
- 作者：A. A. Wereszczak;Z. Liang;M. K. Ferber;L. D. Marlino
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- Sintering;
- Interconnection;
- Surface topography;
- Processing;
- Pad shape and size;
55.Development of a 300°C capable SiC based operational amplifier

机译：开发300°C的基于SIC的运算放大器
- 作者：Vinayak Tilak;Cheng-Po Chen;Peter Losee;Emad Andarawis;Zachary Stum
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- High Temperature;
- Silicon carbide;
- MOSFETs;
56.Modeling and Simulation of the Thermal Drift Characteristics of the Piezoresistive Pressure Sensor

机译：压阻压力传感器的热漂移特性的建模与仿真
- 作者：R. Otmani;N. Benmoussa;K. Ghaffour
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- Carriers Mobility;
- Offset Voltage;
- Piezoresistivity;
- Pressure;
- Sensor;
- Silicon;
57.Compact modeling of the high temperature effect on the single event transient current generated by heavy ions in SOI 6T-SRAM

机译：高温效应对SOI 6T-SRAM的沉重离子产生的单一事件瞬态电流的型号
- 作者：E. Boufouss;J. Alvarado;D. Flandre
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
58.Development of a SiC SSPC Module with Advanced High Temperature Packaging

机译：高级高温包装SIC SSPC模块的开发
- 作者：Douglas C. Hopkins;Yuan-Bo Guo;Herbert E. Dwyer;James D. Scofield
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- SSPC;
- SiC;
- High Temperature;
59.'Migration of Sintered Nanosilver Die-attach Material on Alumina Substrate at High Temperatures'

机译：“在高温下烧结纳米ilve模具材料迁移氧化铝基材”
- 作者：Yunhui Mei;Dimeji Ibitayo;Xu Chen;Susan Luo;Guo-Quan Lu
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2010年
- High-temperature die-attach;
- Low-temperature sintering;
- Nanosilver paste;
- Silver migration;
60.High Temperature 0.35 Micron Silicon-on-Insulator CMOS Technology

机译：高温0.35微米硅式绝缘体CMOS技术
- 作者：Holger Kappert;Stefan Dreiner;Dirk Dittrich;Katharina Grella;Andreas Kelberer;Miriam Klusmann;Norbert Kordas;Andre Kosfeld;Alexander Schmidt;Uwe Paschen
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- High Temperature;
- SOI;
- CMOS;
- 0.35 micron;
61.HPHT cased-hole CCL tool enhancement via DSP techniques for accurate depth control in wire-line well interventions

机译：HPHT套管CCL工具通过DSP技术提升，用于线线井干预中的精确深度控制
- 作者：Rito Mijarez;David Pascacio;Ricardo Guevara;Carlos Tello;Olimpia Pacheco;Joaquin Rodriguez
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
62.Integrated Protection Circuits for an NMOS Silicon Carbide Gate Driver Integrated Circuit

机译：用于NMOS碳化硅栅极驱动器集成电路的集成保护电路
- 作者：Paul Shepherd;Dillon Kaiser;Michael Glover;Sonia Perez;A. Matt Francis;H. Alan Mantooth
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
63.A 200°C Motor Control ASIC

机译：200°C电机控制ASIC
- 作者：Steve J. A. Majerus;Daniel T. Goff;Walter Merrill
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- Instrumentation amplifier;
- Sigma-delta converter;
- Motor driver;
- Buck converter;
- PWM controller;
64.A 200°C Quad-Output Buck Type Switched Mode Power Supply IC

机译：一个200°C四输出降压型开关模式电源IC
- 作者：Daniel T. Goff;Steve J. A. Majerus;Walter Merrill
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
65.Dielectric Performance of a High Purity HTCC Alumina at High Temperatures - A Comparison Study with other Polycrystalline Alumina

机译：高温高纯度HTCC氧化铝的介电性能 - 其他多晶氧化铝的比较研究
- 作者：Liang-Yu Chen
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- Packaging;
- High temperature;
- HTCC;
- Alumina;
66.Performance and Reliability Characterization of 1200 V Silicon Carbide Power MOSFETs and JFETs at High Temperatures

机译：高温下1200 V碳化硅电气MOSFET和JFET的性能和可靠性表征
- 作者：Jack Flicker;David Hughart;Robert Kaplar;Stanley Atcitty;Matthew Marinella
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
67.Enhancing Performance and Reliability of High Temperature Electronics through Thermally-Stable Parylene HT

机译：通过热稳定的聚粉HT增强高温电子的性能和可靠性
- 作者：Rakesh Kumar
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- High Temp Electronics;
- Parylene HT;
- Coatings;
- Protection;
- UV Stability;
- Reliability and Packaging;
68.Stress Intensity of Delamination in a Sintered-Silver Interconnection

机译：烧结银互连中分层的压力强度
- 作者：D. J. DeVoto;P. P. Paret;A. A. Wereszczak
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- Bonded interfaces;
- Sintered-silver;
- Reliability;
- Delamination;
- Stress intensity;
69.Modeling of Thermomechanical Behaviour of Wire Bonded Electronic Devices under Combined Thermal and Vibration Loads

机译：混合热振动载荷钢丝粘合电子设备热机械行为的建模
- 作者：R. Man;C. Liu;M. Mirgkizoudi;S. Riches
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- Wire bonding reliability;
- Combined high temperature amp;
- vibration;
- FEA;
70.8-15 KV HIGH TEMPERATURE SIC PIN AND SCHOTTKY RECTIFIERS

机译：8-15 kV高温SiC引脚和肖特基整流器
- 作者：Ranbir Singh;Siddarth Sundaresan
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
71.High Temperature Isolated Switch Mode Power Supply with Integrated Power and Feedback Transformer

机译：高温隔离开关模式电源，集成电源和反馈变压器
- 作者：Harold L. Snyder
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- High Temperature;
- Single Forward Controller;
- SMPS;
- Integrated Power and Feedback Transformer;
- Simulation;
- Measurement;
72.500°C Silicon Carbide MOSFET-Based Integrated Circuits

机译：基于500°C的碳化硅MOSFET集成电路
- 作者：Cheng-Po Chen;Reza Ghandi;Liang Yin;Xingguang Zhu;Liangchun Yu;Steve Arthur;Peter Sandvik
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
73.Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technology

机译：利用MO技术和树脂增强技术研制低温烧结纳米银浆料
- 作者：Koji Sasaki;Noritsuka Mizumura
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
74.The Effects of Repeated Refresh Cycles on the Oxide Integrity of EEPROM Memories at High Temperature

机译：重复刷新周期对高温EEPROM存储器氧化物完整性的影响
- 作者：Lynn Reed;Vema Reddy
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- EEPROM;
- Data Retention;
- Oxide Damage;
- Refresh Cycle;
75.Experimental results of testing high-temperature-high-current pulsed operation of SiC MOSETs and SiC diodes

机译：试验SiC MOSET和SIC二极管高温高电流脉冲操作的实验结果
- 作者：Steven A. Morris;Ruichen Zhao;Zinovy Krugliak
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
76.500°C operation of AlGaN/GaN and AlInN/GaN Integrated Circuits

机译：500°C AlGaN / GaN和Alinn / GaN集成电路的操作
- 作者：Mikhail Gaevski;Jianyu Deng;Grigory Simin;Remis Gaska
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
77.Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg

机译：设计和制造双面冷却，SiC，高温逆变器腿
- 作者：Raphael RIVA;Cyril BUTTAY;Marie-Laure LOCATELLI;Vincent BLEY;Bruno ALLARD
- 会议名称：《IMAPS International Conference and Exhibition on High Temperature Electronics》 | 2014年
- 3-D packaging;
- Sandwich module;
- JFET;
- Silver sintering;
- Silver migration;