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Pacific Rim/ASME international intersociety electronic & photonic packaging conference;INTERpack'97

召开年：1997
召开地：Kohala Coast, HI(US);Kohala Coast, HI(US)
出版时间：-

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1.A Low Cost Bumping Process for Flip Chip-Technology Using Electroless Ni/Au Bumping and Solder Ball Placement

机译：使用化学镍/金凸点和焊球放置的倒装芯片技术的低成本凸点工艺
- 作者：Gerald Motulla;Paul Kasulke;Katrin Heinricht;Andreas Ostmann;Elke Zakel;Herbert Reichl;Ghassem Aszdasht;Joachim kloser
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
2.A Study on the Electrical COnduction Mechanism of Anisotropically Conductive Film(ACF) for lCD Packaging Applicatiosn

机译：液晶显示器包装用各向异性导电膜的电传导机理研究
- 作者：Myung J. Yim;Kyung W. Paik;Yang K. Kim;Hee N. Hwang
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
3.Packaging Technology for the Parallel Supercmputer SX-4

机译：并行超级计算机SX-4的包装技术
- 作者：Eiji Hori;Shinji Mine;Yuji Kuramitsu;Jun Inasaka
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
4.Flip Chip Plastic Ball Grid Array Moisture Performance Utilizing a Selected Material Set

机译：利用所选材料组的倒装芯片塑料球栅阵列水分性能
- 作者：Mona A. Chopra;Bill Mace;James R. Guajardo
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
5.Development of Low Pressure Contact Method in CSP (Fine Pitch BGA) Testing

机译：在CSP（Fine Pitch BGA）测试中开发低压接触方法
- 作者：Toshiyuki Motooka;Shigeyuki Maruyama;Makoto Haseyama;Naomi Miyai;Satoru Zama;Hitoshi Yuzawa
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
6.PC Card Packaging Technology with BGA and Build up PWB

机译：采用BGA和PWB的PC卡封装技术
- 作者：Toshiyasu Takei;Akio Yoshida;Tomoyuki Kubota;Shigeyuki Ogata
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
7.Application of Low Mcms to Mobile Personal Computers

机译：Low Mcms在移动个人计算机中的应用
- 作者：Akihiro Dhya;Manabu Bonkohaa;Masafumi Nakamura;Tuneaki Tajima
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
8.Analysis of Stress Condition for Organic Multi-Chip Package

机译：有机多芯片封装的应力条件分析
- 作者：Shogo Mizumoto;Yutaka Tsukada;Itsuroh Shishido
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
9.Low Cost Underbump Metallization by Electroless Ni/Au Plating for Chip Scale Packages

机译：用于芯片级封装的化学镀镍/金低成本低成本凸点金属化
- 作者：Christina C. Tui;T.B. Lim;Y.C. Tao;C.Q. Cui
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
10.Strategies for Optimization of Electronic Package Designs and Manufacturing Processes

机译：电子封装设计和制造工艺的优化策略
- 作者：Ganesh Subbarayan;Roop L. Mahajan
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
11.Decreasing the Time-to-Market Through Virtual Risk Assessment and Risk Mitigation

机译：通过虚拟风险评估和缓解风险来缩短上市时间
- 作者：Michael G. Pecht
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
- accelerated test;
- computer-aided engineering;
- physics-of-failure qualification;
- reliability;
- risk assessment;
12.Challenges in Optoelectronic Packaging

机译：光电封装的挑战
- 作者：Robert J. Hannemann
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
13.Packaging Technologies for Optoelectronic Devices

机译：光电器件封装技术
- 作者：Fuminori Ishitsuka
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
14.A Perspective on the Intrinsic and Practical Limits of Cooling Technology for Future Computer Products-From Laptops to Superservers

机译：未来计算机产品（从笔记本电脑到超级服务器）散热技术的内在和实用限制的观点
- 作者：Richard C. Chu
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
15.Keynote Speech Surface Mount Packging Assembly-Past, Present, Future

机译：主题演讲：表面贴装包装和组装-过去，现在和将来
- 作者：Jennie S. Hwang
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
16.A Paradign Shift: The Emerging Role of Professional Societies in Developing Microelectronics and Photonics Ppackaging Technology

机译：范式转变：专业协会在发展微电子学和光子学包装技术中的新兴作用
- 作者：Ralph W. Wyndrum
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
17.Next Generation of Packaging Challenges and Recent Dvances

机译：下一代包装挑战和最新进展
- 作者：Rao R. Tummala
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
18.Packaging Technology in Japan - Now and Future -

机译：日本的包装技术-现在和将来-
- 作者：Yoichi Hiruta
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
19.Plastic Packaging-Related Consortia Activities-An Update

机译：与塑料包装有关的财团活动-最新动态
- 作者：L.T. Nguyen;R.W. Johnson
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
20.Evolution of Microelectronics Packaging in Taiwan Getting ready for BGA and MCM

机译：台湾微电子封装的发展为BGA和MCM做准备
- 作者：Albert W. Lin
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
21.Process Modeling, Optimization and COntrol in Electronics Manufacturing

机译：电子制造中的过程建模，优化和控制
- 作者：Roop L. Mahajan
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
22.Impact of the Manufacturing Process on Component Package Design

机译：制造过程对组件包装设计的影响
- 作者：Virginia M. Miller;Hanna Kanciak
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
23.Fuzzy Logic Based Regression Models for Electronics Manufacturing Applications

机译：电子制造应用中基于模糊逻辑的回归模型
- 作者：Brain Schaible;Y.C. Lee
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
24.High Performance Underfills for Low-Cost Flip-Chip Applications

机译：低成本倒装芯片应用的高性能底部填充
- 作者：C.P. Wong;S. Shi;G. Jefferson
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
25.Novel Anisotropic COnductive Films with Area-Arrayed Conducting Particles

机译：具有区域排列导电粒子的新型各向异性导电膜
- 作者：Yasushi Gotoh;Itsuo Watanabe
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
26.Electrical Contact Reliability in Anisotropic Conducting Adhesives Connections for Flip Chip Technology

机译：倒装芯片技术的各向异性导电胶连接中的电接触可靠性
- 作者：Samjid H. Mannan
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
27.High-Frequency Measurements and Modelling of Anisotropic Electrcally Conductive Adhesive Flip-Chip Joint

机译：各向异性导电胶倒装芯片接头的高频测量和建模
- 作者：Markus Dernevik;Rolf Sihlbom;Zonghe Lai;Piotr Starski;Johan Liu
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
28.Piezoresistive Measurement of Mechanical Stress in Epoxy Underfilled Flip-Chip-Board (FCOB) Devices

机译：环氧未填充倒装芯片板（FCOB）器件中机械应力的压阻测量
- 作者：Jon B. Nysaether;Pontus Lundstrom;Johan Liu
- 会议名称：《》 | 1997年
29.Conductive Adhesive Joint Reliability Under 'Full-Cure' Conditions

机译：“完全固化”条件下的导电胶接点可靠性
- 作者：Johan Liu;Pontus Lundstrom;Katrin Gustafsson;Zonghe Lai
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
30.The Preliminary Development of a Novel Corrosion Resistant Plastic Package

机译：新型耐腐蚀塑料包装的初步开发
- 作者：K. Jayaraj;L. Felton;B. Farrell;T. Tiano
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
31.Advanced Encapsulation Processing for Low Cost Electronics Assembly-A Cost Analysis

机译：用于低成本电子组装的高级封装处理-成本分析
- 作者：Nathan W. Pascarella;Daniel F. Baldwin
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
32.Advanced Flip Chip Materials: Reflowable Underfill Systems

机译：先进的倒装芯片材料：可回流的底部填充系统
- 作者：Daniel R. Gamota;Cindy M. Melton
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
33.Die-Bonding in Cmicro-Electronic Packaging by Oscillatory Squeezing

机译：振荡挤压在微电子封装中的模压接合
- 作者：K.J. Zwick;P.S. Ayyaswamy;I.M. Cohen
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
34.An Engineering Model To Simulate the Thermal Response of Electronic Devices During Pulsed Nd: YAG Laser Welding

机译：模拟电子设备在脉冲Nd：YAG激光焊接过程中热响应的工程模型
- 作者：S.E. Gianoulakis;J.M. Prinbach;T.E. Voth;P.W. Fuerschbach
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
35.Ball Size and HAZ as Functions of EFO Parameters for Gold Bonding Wire

机译：焊球尺寸和热影响区作为金键合线EFO参数的函数
- 作者：Wei Qin;M. Cohen;P.S. Ayyaswamy
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
36.Finite Element Simulation of Wire Looping During Wirebonding

机译：引线键合过程中绕线的有限元模拟
- 作者：A.A.O. Tay;B.C. Seah;S.H. Ong
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
37.Radiative Heat Transfer in an RTP Chamber

机译：RTP腔室中的辐射热传递
- 作者：J.C. Chai;P. Dutta
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
38.Recent Advances in the Use of Plasma Etching for Micro-Machining

机译：等离子刻蚀在微加工中的最新进展
- 作者：J. Johnson;Michael W. DeVre;Russell J. Westerman
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
39.Characterization of Mechanical Properties of Thin Films Using Micromechancial Silicon Device

机译：使用微机械硅器件表征薄膜的机械性能
- 作者：Kazuo Sato;Tetsuo Yoshioka;Mitsuhiro Shikida;Masanori Yamasaki
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
40.MEMS Technology in Data Storage System

机译：数据存储系统中的MEMS技术
- 作者：Lijun Tong;Ralph Ahlgren;Vijay Dhingra
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
41.Radiation From Printed Circuits

机译：印刷电路的辐射
- 作者：Tapan K. Sarkar
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
42.Mechanical Design for the Personal Messenger~TM Wireless Modem

机译：Personal Messenger〜TM无线调制解调器的机械设计
- 作者：Tateshi Yamada;P.C low
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
43.A Wideband Ceramic Package for DC-18 GHz Microwave Applications

机译：用于DC-18 GHz微波应用的宽带陶瓷封装
- 作者：M.P.R. Panicker;N.L. Greenman;M.S. Hyslop;D. Doriet
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
44.Failure Mechanisms of Microwave (MMIC) Packaging

机译：微波（MMIC）包装的失效机理
- 作者：Nickoloaos Strifas;Aris Christou
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
45.Drop Impact Simulation of a Custom Pager Product

机译：定制寻呼机产品的跌落冲击仿真
- 作者：Ben Nagaraj
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
46.MPMS: the 'Super' Microwave Package of the Future

机译：MPMS：未来的“超级”微波包装
- 作者：Edward J. Jones
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
47.A Total Product Life Cycle Porfile Approach to Reliability Analysis for Low Cost Crystal Oscillators

机译：低成本晶体振荡器可靠性分析的总产品生命周期Porfile方法
- 作者：K.X. Hu;T. Knecht;C.P. Yeh;G. Mui;K.W. Wyatt
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
48.RF MOdeling of Flip-Chip Interconnects in Coplanar Waveguide Circuits

机译：共面波导电路中倒装芯片互连的射频建模
- 作者：Zhiping Feng;Wenge Zhang;K.C. Gupta;Y.C. Lee
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
49.Environmental Pakaging lessues in Direct Access Storage Devices

机译：直接存取存储设备中的环境包装问题
- 作者：Kenneth Altshuler
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
50.Application of MR Heads for Hard Disk Drives

机译：MR磁头在硬盘驱动器中的应用
- 作者：Frich Sawatzky
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
51.Optioelectronic Packaging Using Polymer Waveguides

机译：使用聚合物波导的光电封装
- 作者：Julian Bristow;Yue Liu;Mary Hibbs-Brenner;Allen Cox;Lynn Galarneaau;David Greenlaw;Yung Liu;Herb Cole
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
52.Three Dimensional Tapered Optical Polymeric Waveguides for Optoelectronic Packaging

机译：用于光电包装的三维锥形光学聚合物波导
- 作者：Ray T. Chen;Linghui Wu;Feiming Li;Suning Tang
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
53.Optical Packaging of Organic Polymer ELectro-Optic Guided Wave Devices

机译：有机聚合物电导波器件的光学包装
- 作者：William. H. Steier;Antao Chen;Vadim Chuyanov;Filix I. Marti-Crrera;Sean Carner;Mehrdad Ziari;L.R. Dalton
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
54.Polymeric Materials for Optoelectronic Devices

机译：光电器件用高分子材料
- 作者：Jerome D. Swalen
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
55.Multi-tap Electro-optic Waveguide Interconnects for Module-Level Packaging

机译：用于模块级封装的多抽头电光波导互连
- 作者：Rick Lytel
- 会议名称：《》 | 1997年
56.Evaluation of Aging Induced Gradual Changes in Diode Lasers

机译：半导体激光器老化引起的渐变的评估
- 作者：Jens W. Tomm;Autur Barwollff;Roland Puchert;Uwe Menzel;Arndt Jaeger;Thomas Elsaesser
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
57.Packaging of Optical Integrated Circuits Used in WDM Optical Communication Systems

机译：WDM光通信系统中使用的光集成电路的封装
- 作者：Chau-Han Lee;Haifeng Li;Sephen Didde;Wenhua Lin;Scott A. Merritt;Yung-Juo. Chen;Mario Dagenais;Dennis R. Stone
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
58.Sputtered c-axis LiNbO_3 thin film on Si for waveguide applications

机译：在Si上溅射c轴LiNbO_3薄膜用于波导应用
- 作者：S. Tan;H. Han;R. Boudreau;T.E. Schlesinger;M. Migliuolo
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
59.Optical Coupling With Tapered Polymer Waveguides

机译：锥形聚合物波导的光耦合
- 作者：R. Brain Hooker;Regis S. Fan;Dominic J. Goodwill;Brian K. McComas
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
60.Polymers, Packaging; and Optical Waveguides

机译：聚合物，包装；和光波导
- 作者：A.R. Mickelson
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
61.EDA and CFD Tool Interoperability: the Concurrent Design of a PowerPC~TM Microprocessor-based Microcomputer

机译：EDA和CFD工具的互操作性：基于PowerPC〜TM微处理器的微型计算机的并行设计
- 作者：Gary Kromann;Vincent Pimont;Steve Addison
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
62.Thermal Analysis and Optimization of the Series E Powerpc Computer System

机译：E系列Powerpc计算机系统的热分析和优化
- 作者：David L. Lober
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
63.Thermal and Airflow Analysis of Sequent's New Generation Pentium ProdirectRBased Enterprise Server

机译：Sequent新一代基于Pentium ProdirectR的企业服务器的散热和气流分析
- 作者：Henry C. Bosak
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
64.Instability Analysis for Ultra Thin Quad Flat Pack

机译：超薄四方扁平包装的不稳定性分析
- 作者：Xinyu Dou;Chao-pin Yeh;Dawei Zheng;Deith Boardman;Greg Ridsdale
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
65.Solidis: A Tcad Environment for Packaging Simulation

机译：Solidis：包装仿真的Tcad环境
- 作者：Jorg M. Funk;Lars H. Bomholt;Renzo P. Paganini;Hans-Petter Lien;Wolfgang Fichtner
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
66.Modulus Measurements and Creep Effects on CTE Measurements of Thin Polymer Films

机译：聚合物薄膜的模量测量和蠕变对CTE测量的影响
- 作者：Claudius Feger
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
67.CAD/E requirements and usage for reliability assessment of electronic products

机译：CAD / E要求和用于电子产品可靠性评估的用途
- 作者：Michael Osterman;Thomas Stadteman;Randy Wheeler
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
68.Wind-Induced Noise Simulation for Portable Electronics

机译：便携式电子设备的风致噪声仿真
- 作者：Xiaohua Wu;Xinyu Dou;Chao-pin Yeh;Karl Wyatt
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
69.Optimal Design of Land Grid Array Conenctors

机译：陆网阵列连接器的优化设计
- 作者：A. Deshpande;G. Subbarayan
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
70.Bonding at Room Temperature and Fluxless Reflow of Copper and Lead-free Solder

机译：室温下的键合和铜和无铅焊料的无助焊剂回流
- 作者：Ken-ichiro Tango;Junji Shibata;Naoe Hosada;Tadatomo Suga
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
71.An Integrated Software Tool for the Thermomechanical Analysis of Electronic Chips

机译：电子芯片热力学分析的集成软件工具
- 作者：Stefan Kjellberg;Damian McGuckin;Tom Kisielewicz;Kohei Ando
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
72.Analysis of Polymer Flow DUE To Capillary Forces for Flip-Chip Package Designs

机译：倒装芯片封装设计中由于毛细力引起的聚合物流动分析
- 作者：Takayuki Masunaga;Tetsuro Niishimura;Takahito Nakazawa
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
73.Thermomechanical CAD/CAE Integration in the Tiger PWA Toolset

机译：Tiger PWA工具集中的热机械CAD / CAE集成
- 作者：Russell S. Peak;Robert E. Fulton;Suresh K. Sitaraman
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
74.Thermal Stress Reduction Effect in SMD by Resin Insulationlayer on Metal Base PWB

机译：树脂绝缘层在金属基板上的贴片热应力降低效果
- 作者：Toshihiko Sayama;Takeshi Takayanagi
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
75.Employing Computer-Aided Design Tools for Reliable Die Attachment

机译：使用计算机辅助设计工具来可靠地固定模具
- 作者：Thomas J. Stadteramn;Rhonda M. Anderson;William F. Braerman;Michael W. Deckert
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
76.Structural Optimization of Electronic Components by Using Statistical Optimation Method

机译：统计优化方法的电子零件结构优化
- 作者：Takayoshi Kashiwamura;Masaki Shiratori;Qiang Yu
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
77.Cad-Based Analysis Tools for Electronic Packaging Design

机译：基于Cad的电子包装设计分析工具
- 作者：Wen X. Zhou;Chien H. Hsiung;Robert E. Fulton;Xun Fei Yin;Chao-Pin Yeh;Karl Wyatt
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
78.Development of Optimized Component-Level Thermal Behavioral Models of a Plastic-Ball-Grid Array Interconnect Technology for AIR Cooled Applications

机译：风冷应用的塑料-球栅阵列互连技术的最佳组件级热行为模型的开发
- 作者：Sarang Shidore;Gary Kromann;Steve Addison
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
79.A Methodology for Thermal Characterisation of IC Packages Part I: Experimental Validation of Detailed Models

机译：IC封装热特性的方法学，第一部分：详细模型的实验验证
- 作者：John D. Parry;Harvey I. Rosten
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
80.A Methodology for Thermal Characterisation of IC Packages Part II: Generation of Reliable Boundary Condition Independent Compact Models

机译：IC封装热特性的方法论第二部分：可靠的边界条件无关的紧凑模型的生成
- 作者：John D. Parry;Harvey I. Rosten
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
81.Optimization of High Pin Count Cavity-Up Enhanced Plastic Ball Grid Array (EPBGA) Packages For Robust Design

机译：高引脚数腔增强型塑料球栅阵列（EPBGA）封装的优化设计
- 作者：Atila Mertol
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
82.Failure Analysis of Brittle Components in Electronic Packaging

机译：电子包装中脆性部件的失效分析
- 作者：Terry Baughn;Shea Chen
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
83.Miscellaneous Modeling Issues in Thermomechanical Stress Analysis of Surface-Mount Interconencts

机译：表面安装互连的热机械应力分析中的其他建模问题
- 作者：Abhijit Dasgupta;Krishna Darbha;Prateek Dujari;Peter Haswell;Sharon Ling;C. Scott Sealing;Pradeep Sharma;Kumar Upadhyayula
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
84.Analysis and Design of At-Cut Quartz Resonators by Three Dimensional Finite Element Method

机译：三维有限元法分析石英谐振器
- 作者：Masahiko Kadokura;Tei Hirashima;Yukinori Sasaki
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
85.Thermomechanical Stress Analysis of BGA Interconnects Using the Mdrr Technique

机译：使用Mdrr技术的BGA互连的热机械应力分析
- 作者：S. Ling;A. Dasgupta
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
86.Polarimetry of the Raman Specirum for Stressed Silicon Crystal

机译：拉曼光谱对应力硅晶体的极化测定
- 作者：Yasushi Niitsu;Eiichi Suzuki;Tomo Ikebe;Teruki Ikeda;Yusel Ookubo
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
87.Phtotelastic Property of Gallium Arsenide Crystal

机译：砷化镓晶体的光弹性
- 作者：Kenji Gomi;Yasushi Niitsu
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
88.Investigation of Deformation Characteristics of Electronic Solders Using A Novel Stress Straim-Microprobe (SSM): Application to Solder Aging and Life Prediction

机译：使用新型应力应变微探针（SSM）研究电子焊料的变形特性：在焊料老化和寿命预测中的应用
- 作者：K. Linga Murty;Fahmy M. Haggag
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
89.The Evaluation of Photosensitive Polyimide for High Performance Stress Buffer Applications

机译：用于高性能应力缓冲液的光敏聚酰亚胺的评估
- 作者：Edward Prack;Ziep Tran;Craig Franklin;Steve Tanner;Dan O. Murray
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
90.Unified Multi-Axial Sub-Micron Fatigue Tester for Miniaturized Specimens

机译：用于小型样品的统一多轴亚微米疲劳测试仪
- 作者：Minfu Lu;Zhengfang Qian;Sheng Liu
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
91.Characterization of Flip Chip Bump Failure Modes Using Gigh Frequency Acoustic Micro Imaging

机译：使用高频率声显微成像表征倒装芯片凸点故障模式
- 作者：Janet E. Semmens;Lawrence W. Kessler
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
92.Errors in Strain Gage Testing Theory for Thermal Expansion Measurement

机译：用于热膨胀测量的应变计测试理论中的误差
- 作者：Wilfred E. Desaulnier
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
93.Effect of Roundness Given to Corner of Angled Metal Line On Electromigration Failure

机译：有角度的金属线的圆度对电迁移破坏的影响
- 作者：Kazuhiko Sasagawa;Naoaki Nakamura;Masumi Saka;Hiroyuki Abe
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
94.Development of High-Resolution Probe for Scanning Acoustic Tomographs of Electronic Parts

机译：电子零件声层析成像扫描高分辨率探头的研制
- 作者：Ken Takeuchi;Shoji Yamaguchi
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
95.Thermo-Mechanical Behaviors of Electronic Packaging Materials and Structures by High Temperature Moire Interferometry

机译：电子包装材料和结构的高温莫尔干涉仪的热机械行为
- 作者：Daqing Zou;Minfu Lu;Sheng Liu
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
96.Packaging Characteristics of Preplated Plalladium Leadframe

机译：预镀钯引线框架的包装特性
- 作者：Mitsuo Mori;Toshio Tani;Masaaki Kurihara;Takeno Uno
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
97.Fracture of Filled Epoxy Molding Compound Compact Tension Specimens

机译：填充环氧树脂模塑复合材料致密拉伸试样的断裂
- 作者：Vernal H. Kenner;Kenneth K.C. Lau;Suresh K. Chengalva
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
98.Effects of Temperature and Moisture Upon the Mechanical Behavior of an Epoxy Molding Compound

机译：温度和湿度对环氧模塑料力学性能的影响
- 作者：Brian D. Harper;Li Lu;Vernal H. Kenner
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
99.Residual Sintering Stress Measurement Method for Glass-Ceramic Substrates

机译：玻璃陶瓷基体的残余烧结应力测量方法
- 作者：Hiroaki Doi;Akio Yasukawa
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年
100.Deformation Mechanisms in Sn-Based Solder Materials

机译：锡基焊锡材料的变形机理
- 作者：K. Linga Murty;Hong Yang;Philip Deane;Paul Magill
- 会议名称：《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》 | 1997年