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Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy

召开年：2014
召开地：State College, PA(US)
出版时间：-

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1.Effect of Ni-coated graphene on the performance of SAC305 solder

机译：镀镍石墨烯对SAC305焊料性能的影响
- 作者：Chen, Guang; Wu, Fengshun; Xia, Weisheng; Liu, Hui; Liu, Changqing
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Graphene;
- Materials;
- Mechanical factors;
- Microstructure;
- Nickel;
- Resistance;
- Ni-coated graphene;
- electrical resistivity;
- mechanical properties;
- melting point;
- wettability;
2.O

机译：Ø
- 作者：Zhuang, Lulu; Jiang, Kun; Zhang, Guoping; Tang, Jiaoning; Sun, Rong; Lee, S.W.Ricky
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Insulation;
- Liquids;
- Plasmas;
- Polymers;
- Silicon;
- Surface treatment;
- Through-silicon vias;
- O;
- plasma treatment;
- adhesion;
- insulation;
- polymer liquid;
- through silicon via;
3.The coupling effect of size effect and Krikendall voids on the fracture features of Ni/Sn3.0Ag0.5Cu/Cu joint

机译：尺寸效应和Krikendall空隙对Ni / Sn3.0Ag0.5Cu / Cu接头断裂特征的耦合作用
- 作者：Xunping, Li; Bin, Zhou; Shaohua, Yang; Yunfei, En
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Aging;
- Couplings;
- Joints;
- Nickel;
- Reliability;
- Soldering;
- Tin;
- Kirkendall voids;
- coupling effect;
- fracture feature;
- size effect;
4.Increasing bonding strength of chips and substrates assembly by argon plasma

机译：氩等离子体提高芯片和基板组装的结合强度
- 作者：Chuang, Cheng-Li; Aoh, Jong-Ning; Yang, Bo-Zhi
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Assembly;
- Bonding;
- Copper;
- Electrodes;
- Gold;
- Plasmas;
- Substrates;
- argon plasma activation;
- copper electrode;
- gold bump;
- thermal compression bonding;
5.Isotropically conductive adhesives filled with copper nanoparticles and micron-sized flakes

机译：填充有铜纳米颗粒和微米级薄片的各向同性导电胶
- 作者：Chen, Wenjun; Deng, Dunying; Xiao, Fei
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Conductive adhesives;
- Conductivity;
- Copper;
- Loading;
- Materials;
- Nanoparticles;
- copper nanoparticles;
- isotropically conductive adhesives;
- micron-sized copper flakes;
6.The study of novel metal/composite thermal interface materials for chip testing

机译：用于芯片测试的新型金属/复合热界面材料的研究
- 作者：Shen, Wang; Xionghui, Cai; Guang, Chen; Fengshun, Wu; Weishen, Xia; Wenbo, Zhu; Ruhua, Liu; Yi, Zhang
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
7.Research on factors influencing the board level product quality

机译：影响板级产品质量的因素研究
- 作者：Yuming, Wang; Zhenyu, Zhao; Chen, Chuan; Guisheng, Zou; Jian, Cai; Qian, Wang; Liang, Wu; Chun, Dong; Han, Bai
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Bonding;
- Joints;
- Nitrogen;
- Oxidation;
- Soldering;
- bonding pad design;
- nitrogen;
- oxidation;
- product quality;
- soldering hot melting;
8.Study on the bridge effect of graphene oxide on thermal conductivity of Al

机译：氧化石墨烯对铝热导率的桥接效应研究
- 作者：Yao, Yimin; Zeng, Xiaoliang; Sun, Rong; Xu, Jianbin
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
9.Stress control of plasma enhanced chemical vapor deposited SiO

机译：等离子增强化学气相沉积SiO的应力控制
- 作者：Ning, Wenguo; Zhao, Qiang; Zheng, Kai; Chen, Dong; Guo, Hongyan; Zhang, Li; Hu, Zhengxun; Tan, K.H.; Lai, C.M.
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Compressive stress;
- Copper;
- Reliability;
- Silicon;
- Substrates;
- Through-silicon vias;
- SiO;
- Stress;
- TSV;
- peeling;
10.Calculation of effective thermal conductivity of silicone matrix embedded with particulate phosphors in white led packages by 2D/3D unit cell method

机译：用2D / 3D晶胞方法计算嵌入白色LED封装中的颗粒荧光粉的有机硅基质的有效导热系数
- 作者：Hu, Run; Yuan, Chao; Luo, Xiaobing; Cheng, Ting; Liu, Sheng
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Conductivity;
- Heating;
- Light emitting diodes;
- Phosphors;
- Solid modeling;
- Thermal conductivity;
- Three-dimensional displays;
- Effective thermal conductivity;
- Percolation;
- Phosphor particle;
- Unit cell;
11.Preparation of MnO

机译：MnO的制备
- 作者：Liu Chunliang;Gui Dayong;Liu Jianhong
- 会议名称：《》 | 2014年
- Discharges (electric);
- Electrodes;
- Graphene;
- Materials;
- Supercapacitors;
- Surface impedance;
- Surface morphology;
- MnO;
- graphene;
- graphene oxide;
- nanocomposite;
- supercapacitor;
12.Palladium coated Cu wire: A robust material for die to die Cu WB interconnect

机译：镀钯铜线：用于管芯到管芯的铜WB互连的坚固材料
- 作者：Descartin Allen M.;XiaoLong Zhang;Jun Li
- 会议名称：《》 | 2014年
- Bonding;
- Copper;
- Materials;
- Oxidation;
- Reliability;
- Surface treatment;
- Wires;
- Bond-stitch-on-ball (BSOB);
- Pd coated Cu wire;
- bump cutting motion;
- interbond connection;
13.Study of gold wire bonding on 0.1 μm soft gold film substrate

机译：0.1μm软金膜基底上金线键合的研究
- 作者：Zhang, Ruonan; Guo, Rui; Li, Ming; Qian, Kaiyou; Chiu, Hope
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Bonding;
- Films;
- Gold;
- Nickel;
- Reliability;
- Substrates;
- Wires;
- 0.1 μ;
- m soft gold;
- bondability;
- process window;
- reliability;
- wire bonding;
14.High bandwidth application on 2.5D IC silicon interposer

机译：在2.5D IC硅中介层上的高带宽应用
- 作者：Wang, Chen-Chao; Cheng, Hung-Hsiang; Chung, Ming-Feng; Pan, Po-Chih; Ho, Cheng-Yu; Chiu, Chi-Tsung; Hung, Chih-Pin
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Analytical models;
- Couplings;
- Noise;
- Silicon;
- Substrates;
- Through-silicon vias;
- 2.5D-IC;
- Through silicon via (TSV);
- WideIO;
- power integrity (PI);
- signal ntegrity (SI);
15.Interaction effect between electromigration and microstructure evolution in BGA structure Cu/Sn-58Bi/Cu solder interconnects

机译：BGA结构Cu / Sn-58Bi / Cu焊料互连中电迁移与微观结构演变之间的相互作用效应
- 作者：Qin, Hong-Bo; Yue, Wu; Ke, Chang-Bo; Zhou, Min-Bo; Zhang, Xin-Ping; Li, Bin
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
16.Electrical characterization and analysis on the via-solder ball structure

机译：焊锡球结构的电气特性分析
- 作者：He, Yi; Li, Jun; Liu, Fengman; Wu, Peng; Cao, Liqiang
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
17.Effect of magnetism of specimen on energy spectrum analysis

机译：标本磁性对能谱分析的影响
- 作者：Yao, Yan; Bao, Shengxiang; Yuwei, Zheng
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
18.Effect of interfacial reaction on tin whisker formation of Sn/Ni films deposited on copper lead-frame

机译：界面反应对铜引线框架上沉积的Sn / Ni膜晶须形成的影响
- 作者：Liu, Ting; Ding, Dongyan; Hu, Yu; Gong, Yihua
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Coatings;
- Films;
- Lead;
- Nickel;
- Surface morphology;
- Surface treatment;
- Tin;
- Ni barrier;
- Sn whisker growth;
- interfacial reaction;
- intermetallic compound (IMC);
- reflow;
- reliability;
19.Experimental and finite elemental investigations on residual stress of TSV

机译：TSV残余应力的实验和有限元研究
- 作者：Su, Fei; Lan, Tianbao; Zhu, Yunhui; Chen, Jing
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Filling;
- Finite element analysis;
- Residual stresses;
- Silicon;
- Through-silicon vias;
- Finite element method;
- Photo-elasticity;
- Stress;
- Through Silicon Via (TSV);
20.Finite element analysis of graphene resonator tuned by pressure difference

机译：压力差对石墨烯谐振器的有限元分析
- 作者：Gong, Xionghui; Jiang, Shengwei; Wang, Xuefang; Liu, Sheng; Wang, Shuo
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Graphene;
- Mechanical factors;
- Nanoelectromechanical systems;
- Optical resonators;
- Resonant frequency;
- Sensitivity;
- Simulation;
- FEA;
- initial tension;
- pressure difference;
- resonance frequency;
- resonator;
- tunable range;
21.Electrical performance analysis and structure optimization for QFP-48 sockets

机译：QFP-48插座的电气性能分析和结构优化
- 作者：Ling, Sun; Xuemin, Wang; Haiyan, Sun; Shenglong, Wang; Lingling, Yang
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Insertion loss;
- Integrated circuit modeling;
- Permittivity;
- Pins;
- Sockets;
- Solid modeling;
- Quad Flat Package;
- electromagnetic simulation;
- signal integrity;
- socket modeling;
22.Study on fracture mechanism of the aged Sn2.5Ag0.7Cu0.1RE/Cu soldering joint with external energy

机译：Sn2.5Ag0.7Cu0.1RE / Cu焊点老化后外能破坏机理的研究
- 作者：Guo, Xingdong; Zhang, Keke
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Acoustics;
- Aging;
- Electric fields;
- Joints;
- Metals;
- Soldering;
- Vibrations;
- Sn2.5Ag0.7Cu0. 1RE solder;
- aging;
- electric field;
- fracture mechanism;
- ultrasonic vibration;
23.Physics-of-failure-based prognostics and health management for electronic products

机译：电子产品基于故障物理的预测和健康管理
- 作者：Yang, Decai
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Failure analysis;
- Fatigue;
- Logic gates;
- Materials;
- Prognostics and health management;
- Reliability;
- Stress;
- FMMEA;
- PHM;
- damage analysis;
- physics of failure;
- reliability prediction;
24.The reversible transformation between Cu

机译：Cu之间的可逆转变
- 作者：Liu, Zhi-Quan; Tian, Fei-Fei
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Aging;
- Chemicals;
- Compounds;
- Substrates;
- Tin;
- Transforms;
- In-48Sn solder;
- Interfacial reaction;
- Intermetallic compound;
- Phase transformation;
25.Influences of material and structural factors on the stress conditions in Cu/low-k chips during Cu wire bonding

机译：铜线焊接过程中材料和结构因素对Cu / low-k芯片应力条件的影响
- 作者：Bai, Xiaoyi; Chang, Baohua; Du, Dong
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Bonding;
- Finite element analysis;
- Materials;
- Passivation;
- Stress;
- Wires;
- Cu/low-k;
- Finite element method (FEM);
- Stress conditions;
- Wire Bonding;
26.A waveguide phase shifter with good flatness and broad bandwidth

机译：具有良好平坦度和宽带宽的波导移相器
- 作者：Yang, Tingting; Liu, Shitou; Wang, Xin
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
27.Design of a novel L-band high selectivity miniaturized planar filter

机译：新型L波段高选择性小型化平面滤波器的设计
- 作者：Luo, Xian-Hu; Gao, Ya; Yang, Kai; Zhang, Tian-Liang; Ren, Xiang-yang
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- cross-coupled;
- high selectivity;
- miniaturization;
- quasi-elliptic;
- stepped impedance resonators (SIR);
28.Technique of multi-temperature Stepped Welding in Microwave Modules

机译：微波模块中的多温度阶梯焊接技术
- 作者：Luo, Hongyuan; Cai, Chengde; Li, Hailun
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Cavity resonators;
- Heating;
- Microwave circuits;
- Radio frequency;
- Soldering;
- Welding;
- solder paste;
- soldering curve;
- temperature gradient;
29.Localization of critical frequency for simulation of high-speed interconnects

机译：临界频率的本地化，以仿真高速互连
- 作者：Ding, Wen; Liu, Feng; Liu, Sheng; Wang, Gaofeng
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
30.A simulation of Intelligent Power Module under power cycling condition

机译：功率循环条件下智能电源模块的仿真
- 作者：Wang, Yong; Zhao, Wen; Li, Ming; Chen, Ming; Gao, Liming
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Ceramics;
- Conductivity;
- Strain;
- Stress;
- Substrates;
- Thermal conductivity;
- FEA;
- IPM;
- Power cycling;
31.The study of different transmission lines in high speed optical module

机译：高速光模块中不同传输线的研究
- 作者：He, Huimin; Li, Baoxia; Sun, Yu
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Conductors;
- Coplanar waveguides;
- Dielectric losses;
- Microstrip;
- Optical waveguides;
- Propagation losses;
- S parameter;
- coplanar waveguide;
- microstrip line;
- permittivity;
- transmission line;
32.Simulation analysis of jet dispenser based on piezoelectric actuators

机译：基于压电致动器的喷射分配器的仿真分析
- 作者：Wen, Yajie; Deng, Guiling; Zhou, Can
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Analytical models;
- Fluids;
- Force;
- Measurement by laser beam;
- Needles;
- Piezoelectric actuators;
- Strain;
- displacements;
- frequency;
- jetting dispenser;
- piezoelectric acutator;
33.Design and fabrication of integrated waveguide filter based on high-resistivity silicon

机译：基于高电阻率硅的集成波导滤波器的设计与制造
- 作者：Du, Lin; Pu, Shi
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Band-pass filters;
- Conductivity;
- Electromagnetic waveguides;
- Microwave filters;
- Resonator filters;
- Silicon;
- Substrates;
- MEMS etching;
- high resistivity silicon;
- relative bandwidth;
- siw filter;
34.Improvement of manufacturing process for multilayer substrate integrated waveguide cavity

机译：多层基板集成波导腔制造工艺的改进
- 作者：Xu, Ziqiang; Zhang, Gen; Cao, Guangliang; Cheng, Gesheng
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
35.Application of color temperature tunable LEDs in smart lighting system

机译：色温可调LED在智能照明系统中的应用
- 作者：Ziren, Xiu; Hao, Li
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Color;
- Image color analysis;
- Light emitting diodes;
- Lighting;
- Pulse width modulation;
- Temperature control;
- Temperature distribution;
- JenNet-IP;
- LED;
- Smart Lighting;
- tunable color temperature;
36.Investigation of lumen degradation mechanisms of mid-power LED by HAST

机译：基于HAST的中功率LED流明衰减机理研究
- 作者：Huang, Jianlin; Koh, Sau; Li, Xiupeng; Zhang, Guoqi
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Aging;
- Degradation;
- Humidity;
- Life estimation;
- Light emitting diodes;
- Phosphors;
- Stress;
- HAST;
- accelerated;
- humidity;
- lumen decay;
- lumen degradation;
- moisture;
- white light LED;
37.A PIN diode controlled variable attenuator on rectangular waveguide in millimeter wave band

机译：毫米波矩形波导管上的PIN二极管控制的可变衰减器
- 作者：Chen, Liu; Chen, Cheng; Wang, Xin
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Attenuation;
- Attenuators;
- Equivalent circuits;
- Insertion loss;
- PIN photodiodes;
- Rectangular waveguides;
- Resistors;
- PIN diode;
- attenuator;
- rectangular waveguide;
38.A Q-Band very broad band on-chip antenna for Q-LINKPAN applications

机译：适用于Q-LINKPAN应用的Q波段超宽带片上天线
- 作者：Gao, Peng; Wang, Ning; Chen, Zhi Ning
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Antenna measurements;
- Antenna radiation patterns;
- CMOS integrated circuits;
- Millimeter wave communication;
- Standards;
- System-on-chip;
- 45GHz;
- Q-LINKPAN;
- on-chip antenna;
- triangle shape;
39.Compact bandpass filter using novel stepped impedance resonators

机译：使用新型步进阻抗谐振器的紧凑型带通滤波器
- 作者：Wang, Dan; Wei, Xubo
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Band-pass filters;
- Couplings;
- Filtering theory;
- Impedance;
- Microstrip filters;
- Passband;
- Resonator filters;
- SIR;
- bandpass filter;
- compact;
40.Study of Ground-Signal-Ground TSV in terms of transmission performance

机译：基于传输性能的地面信号地面TSV研究
- 作者：Qinghai, Li; Min, Miao; Zhensong, Li; Qinghai, Li; Min, Miao
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
41.Fine pitch BGA device solder bridging mechanism investigation through solder shape modeling

机译：通过焊锡形状建模研究细间距BGA器件的焊锡桥接机理
- 作者：Li, Xiaoqing; Wang, Yuchuan; Zhou, Jianwei; Chang, Tae Sub
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Analytical models;
- Copper;
- Geometry;
- Joints;
- Mathematical model;
- Printed circuits;
- Soldering;
- NSMD;
- Solder bridge;
- Surface Evolver;
- fine pitch technology;
- modeling;
- reflow soldering;
- solder shape;
- stringer;
42.Electroless Ni-P-ZrO

机译：化学镀Ni-P-ZrO
- 作者：Hu, Xiao; Chan, Y.C.
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Aging;
- Joints;
- Mechanical factors;
- Metallization;
- Nanoparticles;
- Soldering;
- Electroless plating;
- intermetalic compound;
- lead-free;
- microstructure;
- solder joint;
43.Two-step thermoelectric modeling for junction temperature prediction of LED lamps

机译：两步热电建模用于LED灯的结温预测
- 作者：Tian, Kunmiao; Cai, Miao; Zhang, Ping; Chen, Xianping; Yang, Daoguo
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Electronic packaging thermal management;
- Heating;
- Junctions;
- LED lamps;
- Temperature;
- Temperature measurement;
- CFD;
- LED lamp;
- junction temperature;
- thermoelectric;
44.Study on temperature field of fluid jet-dispenser based on two piezoelectric stacks

机译：基于两个压电堆的流体分配器温度场研究
- 作者：Gu, Zhichao; Deng, Guiling; Zhou, Can
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Films;
- Heat transfer;
- Heating;
- Temperature measurement;
- Viscosity;
- heating device;
- jetting dispenser;
- temperature filed;
- viscosity;
45.A highly linear short-wave ultra-wideband balanced amplifier

机译：高度线性的短波超宽带平衡放大器
- 作者：Yu, Gaogan; Shi, Yu; Zheng, Huayi
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Couplers;
- Gain;
- Impedance matching;
- Linearity;
- Noise;
- Radio frequency;
- Transistors;
- balanced amplifier;
- balun;
- feedback;
- high linearity;
- low noise;
- short wave;
46.Micro structure and magnetic properties of CoSn-doped M-type barium ferrite with low temperature sintering for LTCC application

机译：LTCC应用低温烧结CoSn掺杂M型钡铁氧体的微观结构和磁性
- 作者：Yu, Wang; Huaiwu, Zhang; Yue, Wang; Kai, Yang; Liu, Yingli
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Decision support systems;
- HFSS simulation;
- LTCC;
- M-type Baruim ferrite;
- saturation magnetization;
47.A high-efficiency Class-F power amplifier using double CRLH-TL for LTE application

机译：使用双CRLH-TL的高效F类功率放大器，用于LTE应用
- 作者：Xiong, Xian-ping; Luo, Yong-Lun; Zhang, Yun; Ma, Xiao-Lei; Wu, Pu-chao; Chen, Long
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
48.Molecular modeling of the conductivity of carbon nanotubes under different temperature and humidity

机译：不同温度和湿度下碳纳米管电导率的分子模型
- 作者：Yang, Ning; Chen, Xianping; Cai, Miao; Yang, Daoguo; Zhang, Guoqi
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Carbon nanotubes;
- Chemicals;
- Conductivity;
- Humidity;
- Photonic band gap;
- Temperature;
- Temperature sensors;
- CNTs;
- Materials Studio;
- sensor;
- thermoelectric performance;
49.Investigation on reliability and failure analysis of plastic encapsulated microelectronics

机译：塑料封装微电子学的可靠性和失效分析研究
- 作者：Wu, Huiwei; He, Shengzong; Liu, Liyuan; Kuang, Xianjun; Lei, Dengyun; Li, Haijun
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Compounds;
- Corrosion;
- Failure analysis;
- Moisture;
- Plastics;
- Reliability;
- Stress;
- corrosion;
- failure analysis;
- plastic encapsulated microcircuits (PEMs);
- popcorning;
- reliability;
50.A compact printed filtering antenna with flat gain using annular slot and UIR

机译：使用环形槽和UIR的具有平坦增益的紧凑型印刷滤波天线
- 作者：Ding, Bo; Wei, Xubo; Wang, Chao; Zhang, Mingxia; He, Zetao; Shi, Yu
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Antenna measurements;
- Band-pass filters;
- Couplings;
- Passband;
- Slot antennas;
- UIR;
- annular slot;
- cross polarization;
- filtering antenna;
51.Characterization of after-reflow misalignment on Head-in-Pillow defect in BGA assembly

机译：BGA组件中枕头缺陷的回流后未对准的特征
- 作者：Chen, Chuan; Cai, Jian; Wang, Qian; Wang, Yuming; Zou, Guisheng; Zhao, Zhengyu; Park, Chang Yong
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
52.Abnormal grain growth in Cu

机译：铜晶粒异常生长
- 作者：Yang, Ming; Li, Mingyu; Wu, Jianxin; Xu, Jinhua
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Aging;
- Grain boundaries;
- Joints;
- Morphology;
- Scanning electron microscopy;
- Soldering;
- Tin;
- IMC;
- abnormal growth;
- diffusion;
- lead-free solders;
53.Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects

机译：电迁移对Cu / Sn-9Zn / Cu焊料互连抗拉强度的影响
- 作者：Huang, Mingliang; Zhang, Fei; Yang, Fan; Zhao, Ning
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Aging;
- Anodes;
- Cathodes;
- Electromigration;
- Electronics packaging;
- Soldering;
- Zinc;
- Cu/Sn-9Zn/Cu interconnect;
- electromigration;
- fracture;
- intermetallic compound;
- tensile strength;
54.A novel absorption band-pass filter with compact structure and wide relative bandwidth

机译：结构紧凑，相对带宽宽的新型吸收带通滤波器
- 作者：Qin, Wei-wei; Shu, An-gang
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
55.Compact UWB signal interference filter using interdigital coupled lines

机译：使用叉指耦合线的紧凑型UWB信号干扰滤波器
- 作者：Zhang, Y; Luo, Y L; Xin, Z Y
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
56.Bonding 1200 V, 150 A IGBT chips (13.5 mm × 13.5 mm) with DBC substrate by pressureless sintering nanosilver paste for power electronic packaging

机译：通过无压烧结纳米银浆将1200 V，150 A IGBT芯片（13.5 mm×13.5 mm）与DBC基板粘合，用于功率电子封装
- 作者：Fu, Shancan; Mei, Yunhui; Li, Xin; Lu, Guo-Quan
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Bonding;
- Insulated gate bipolar transistors;
- Joints;
- Silver;
- Substrates;
- X-ray imaging;
- large-area chips;
- nanosilver paste;
- pressureless;
- shear strength;
- voids ratio;
57.Effect of annealing after copper plating on the pumping behavior of through silicon vias

机译：镀铜后退火对硅通孔泵浦行为的影响
- 作者：Ji, Liang; Jing, Xiangmeng; Xue, Kai; Xu, Cheng; He, Hongwen; Zhang, Wenqi
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Annealing;
- Copper;
- Silicon;
- Stress;
- Substrates;
- Through-silicon vias;
- annealing;
- chemical mechanical polishing (CMP);
- interposer;
- pumping;
- simulation;
- though silicon via (tsv);
58.The process development and reliability study of low cost Area Array QFN packaging technology

机译：低成本面阵QFN封装技术的工艺开发和可靠性研究
- 作者：Wang, Hu; Li, Taotao; Ma, Xiaobo; Wang, Xiaolong; Chen, Shiguang; Xie, Jianyou; Yu, Daquan
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Arrays;
- Bonding;
- Electronic packaging thermal management;
- Packaging;
- Reliability;
- Temperature;
- Wires;
- QFN;
- area array;
- reliability;
- thermal performance;
- warpage;
59.Magnetic deposition of Ni/Au coated polymer core particles for flip-chip interconnection

机译：镍/金涂层聚合物核颗粒的磁性沉积，用于倒装芯片互连
- 作者：Tao, Junlei; Whalley, David; Liu, Changqing
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Gold;
- Magnetic fields;
- Magnetic resonance imaging;
- Nickel;
- Perpendicular magnetic anisotropy;
- Solvents;
- ACA;
- Flip chip;
- Magnetic deposition;
- Ni/Au coated particles;
60.Sulfur-containing compound in epoxy molding compound

机译：环氧模塑料中的含硫化合物
- 作者：Cheng, Xingming; Liu, Hongjie; Tan, Wei; Qiu, Chi; Li, Lanxia; Han, Jianglong
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
61.High dielectric performance of polymer composites based on BaTiO

机译：BaTiO基聚合物复合材料的高介电性能
- 作者：Fang, Fang; Luo, Suibin; Yu, Shuhui; Sun, Rong
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Dielectric losses;
- Loading;
- Nanoparticles;
- Permittivity;
- Polymers;
- BT-Ag hybrid particles;
- dielectric properties;
- polymer-based composites;
62.Research on tensile property and creep resistance of electroplating nickel reinforced by A1

机译：A1增强电镀镍的拉伸性能和抗蠕变性
- 作者：Hang, Chunjin; Tian, Yanhong; Wang, Chunqing; Wang, Hong
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Al;
- O;
- nanoparticles;
- creep resistance;
- electroplating nickel;
- tensile property;
63.Development and characterization of graphene-enhanced thermal conductive adhesives

机译：石墨烯增强导热胶的研制与表征
- 作者：Casa, Marcello; Huang, Shirong; Ciambelli, Paolo; Wang, Nan; Ye, Lilei; Liu, Johan
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Coatings;
- Conductivity;
- Electronic packaging thermal management;
- Graphene;
- Materials;
- Silver;
- Thermal conductivity;
- additive;
- chemical;
- dopamine coating;
- graphene-based TCA;
- silver coating;
- thermal conductivity;
64.Low cost fabrication of TSV-based silicon interposer using wet chemical etching and its application in 3D packaging

机译：湿法化学刻蚀制造基于TSV的硅中介层的低成本方法及其在3D封装中的应用
- 作者：Ye, Jiaotuo; Chen, Xiao; Zhu, Chunsheng; Luo, Le; Xu, Gaowei
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Erbium;
- Magnetic resonance imaging;
- 3D packaging;
- silicon interposer;
- wet etching;
65.A flexible module design with LED chips based on the PET-copper foils

机译：采用基于PET-铜箔的LED芯片的灵活模块设计
- 作者：Chen, Yun Chao; Cai, Miao; Jia, Hong Liang; Yang, D.G.
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Copper;
- Films;
- Heating;
- Lamination;
- Light emitting diodes;
- Positron emission tomography;
- FAM;
- Finite element analysis;
- Hot lamination;
- Metal electroplating;
- Molding process;
66.Light extraction analysis of high-power LED based on flip chip technology

机译：基于倒装芯片技术的大功率LED的光提取分析
- 作者：Liyun, He; Lezhi, Ye
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Aluminum;
- Electronics packaging;
- Flip-chip devices;
- Light emitting diodes;
- Packaging;
- Periodic structures;
- Substrates;
- LED;
- TracePro;
- central light strength;
- luminous flux;
- reflective-cup;
67.Harmonic vibration analysis and S-N curve estimate of PBGA mixed solder joints

机译：PBGA混合焊点的谐波振动分析和S-N曲线估计
- 作者：Tao, Lu; Bin, Zhou; Kailin, Pan; Yunfei, En; Yubin, Gong
- 会议名称：《Joint IEEE International Symposium on the Applications of Ferroelectrics;International Workshop on Acoustic Transduction Materials and Devices;Workshop on Piezoresponse Force Microscopy》 | 2014年
- Fatigue;
- Harmonic analysis;
- Reliability;
- Soldering;
- Strain;
- Stress;
- Vibrations;
- S-N curve;
- board strain;
- harmonic vibration;
- mixed solder joints;
- plastic ball grid array (PBGA);