机译:All-wet encapsulation and electroless superfilling process for the fabrication of self-assembled-monolayer encapsulated copper interconnects with enhanced electromigration reliability
机译:AlCoCrFeNi_(1.9)(Mo, Nb, Hf, C) high entropy alloy strengthened by a novel long-period stacking ordered (LPSO) structure and (Nb, M)C (M = Mo, Hf, Cr)