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首页> 外文期刊>Polymers for advanced technologies >Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application
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Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application

机译：用于电子包装的颗粒状填充环氧树脂复合材料的热和机械性能

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摘要

Epoxy composites containing particulate fillers-fused silica, glass powder, and mineral silica were investigated to be used as substrate materials in electronic packaging application. The content of fillers were varied between 0 and 40 vol%. The effects of the fillers on the thermal properties- thermal stability, thermal expansion and dynamic mechanical properties of the epoxy composites were studied, and it was found that fused silica, glass powder, and mineral silica increase the thermal stability and dynamic thermal mechanical properties and reduce the coefficient of thermal expansion (CTE). The lowest CTE value was observed at a fused silica content of 40 vol% for the epoxy composites, which was traced to the effect of its nature of low intrinsic CTE value of the fillers. The mechanical properties of the epoxy composites were determined in both flexural and single-edge notch (SEN-T) fracture toughness properties. Highest flexural strength, stiffness, and toughness values were observed at fillers content of 40 vol% for all the filled epoxy composites. Scanning electron microscopy (SEM) micrograph showed poor filler-matrix interaction in glass powder filled epoxy composites at 40 vol%.
机译：研究了包含颗粒状填料熔融二氧化硅，玻璃粉和矿物二氧化硅的环氧树脂复合材料，可将其用作电子包装应用中的基材。填料的含量在0至40体积％之间变化。研究了填料对环氧复合材料的热性能，热稳定性，热膨胀和动态力学性能的影响，发现熔融二氧化硅，玻璃粉和矿物二氧化硅提高了热稳定性和动态热力学性能，并且降低热膨胀系数（CTE）。对于环氧复合材料，当熔融二氧化硅含量为40％（体积）时，观察到最低的CTE值，这归因于其低固有CTE值性质的影响。环氧复合材料的机械性能是通过弯曲和单边缘缺口（SEN-T）断裂韧性特性来确定的。对于所有填充的环氧复合材料，当填料含量为40％（体积）时，观察到最高的弯曲强度，刚度和韧性值。扫描电子显微镜（SEM）显微照片显示，在玻璃粉填充的环氧复合材料中，当体积比为40％时，填料与基质之间的相互作用较差。

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