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首页> 外文期刊>Polymers for advanced technologies >Curing kinetics, thermal, mechanical, and dielectric properties based on o-cresol formaldehyde epoxy resin with polyhedral oligomeric (N-aminoethyl-γ-amino propyl)silsesquioxane
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Curing kinetics, thermal, mechanical, and dielectric properties based on o-cresol formaldehyde epoxy resin with polyhedral oligomeric (N-aminoethyl-γ-amino propyl)silsesquioxane

机译：基于邻甲酚甲醛环氧树脂和多面体低聚（N-氨基乙基-γ-氨基丙基）倍半硅氧烷的固化动力学，热，机械和介电性能

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摘要

The curing reaction and kinetics of o-cresol formaldehyde epoxy resin (o-CFER) with polyhedral oligomeric silsesquioxane of N-aminoethyl-γ-amino propyl group (AEAP-POSS) were investigated by differential scanning calorimetry (DSC). The thermal, mechanical, and dielectric properties of o-CFER/AEAP-POSS nanocomposites were investigated with thermo-gravimetric analysis (TGA), torsional braid analysis (TBA), tensile tester, impact tester, and electric analyzer, respectively. The results show that the activation energy (E) of curing reaction is 58.08 kJ/mol, and the curing reaction well followed the Sestak-Berggren (S-B) autocatalytic model. The glass transition temperature (T_g) increases with the increase in AEAP-POSS content, and reaches the maximum, 107℃, when the molar ratio (N_s) of amino group to epoxy group is 0.5. The nanocomposites containing a higher percentage of AEAP-POSS exhibited a higher thermo-stability. The AEAP-POSS can effectively increase the mechanical properties of epoxy resin, and the tensile and impact strengths are 2.84MPa and 143.25 kJm~(-2), respectively, when N_s is 0.5. The dielectric constant (ε), dielectric loss factor (tanδ), volume resistivity (ρ_v), and surface resistivity (ρ_s) are 4.98, 3.11×10~(-4), 3.17×10~(12)Ωcm~3, and 1.41×10~(12)Ωcm~2, respectively, similarly at N_s 0.5.
机译：通过差示扫描量热法（DSC）研究了邻甲酚甲醛环氧树脂（o-CFER）与N-氨基乙基-γ-氨基丙基多面体低聚倍半硅氧烷（AEAP-POSS）的固化反应和动力学。分别使用热重分析（TGA），扭转编织分析（TBA），拉伸测试仪，冲击测试仪和电分析仪研究了o-CFER / AEAP-POSS纳米复合材料的热，机械和介电性能。结果表明，固化反应的活化能（E）为58.08 kJ / mol，固化反应很好地遵循了Sestak-Berggren（S-B）自催化模型。随着AEAP-POSS含量的增加，玻璃化转变温度（T_g）增加，当氨基与环氧基的摩尔比（N_s）为0.5时，玻璃化转变温度（T_g）达到最大值107℃。包含更高百分比的AEAP-POSS的纳米复合材料表现出更高的热稳定性。当N_s为0.5时，AEAP-POSS可有效提高环氧树脂的力学性能，抗拉强度和冲击强度分别为2.84MPa和143.25 kJm〜（-2）。介电常数（ε），介电损耗因子（tanδ），体积电阻率（ρ_v）和表面电阻率（ρ_s）为4.98、3.11×10〜（-4），3.17×10〜（12）Ωcm〜3和类似地在N_s 0.5时分别为1.41×10〜（12）Ωcm〜2。

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