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首页> 外文期刊>Polymers for advanced technologies >Effects of alicyclic moiety incorporation on the properties of polyimide/silica hybrid films
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Effects of alicyclic moiety incorporation on the properties of polyimide/silica hybrid films

机译：脂环族基团掺入对聚酰亚胺/二氧化硅杂化膜性能的影响

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摘要

Polyimide (PI)/silica hybrid films were prepared from tetraethyl orthosilicate (TEOS) using a sol-gel process as well as pyromellitic dianhydride and 4,4-oxydianiline. 1,4-Cyclohexanedicarboxylic acid (1,4-CHDA) was added as a coupling agent. The PI/silica hybrid films were characterized by Fourier transform infrared spectroscopy, field emission scanning electron microscopy, differential scanning calorimetry and wide-angle X-ray diffraction. The thermal, tensile and dielectric properties of the hybrid films were measured. The results showed that the tensile and dielectric properties of the hybrid films improved with increasing silica concentration and 1,4-CHDA content in the PI matrix. Covalent ester bonds were formed between SiOH groups of silica and carboxyl groups of 1,4-CHDA. As a result, the silica particle size was reduced and dispersed homogeneously in the PI matrix, leading to increased tensile strength and tensile modulus of the typical hybrid film with 1,4-CHDA (PI-2), when compared with the PI/silica hybrid film without 1,4-CHDA at the same silica contents. The presence of an alicyclic moiety containing silica in PI reduced the dielectric constant considerably to 2.83, which was lower than that of pristine PI. Copyright (c) 2016 John Wiley & Sons, Ltd.
机译：聚酰亚胺（PI）/二氧化硅杂化薄膜是使用溶胶-凝胶工艺由原硅酸四乙酯（TEOS）以及均苯四酸二酐和4,4-氧二苯胺制备的。加入1，4-环己烷二甲酸（1，4-CHDA）作为偶联剂。通过傅立叶变换红外光谱，场发射扫描电子显微镜，差示扫描量热法和广角X射线衍射对PI /二氧化硅杂化膜进行了表征。测量了杂化膜的热，拉伸和介电性能。结果表明，杂化膜的拉伸性能和介电性能随二氧化硅浓度和PI基体中1,4-CHDA含量的增加而提高。在二氧化硅的SiOH基和1,4-CHDA的羧基之间形成了共价酯键。结果，与PI /二氧化硅相比，二氧化硅的粒径减小并均匀地分散在PI基质中，从而导致典型的具有1,4-CHDA（PI-2）的杂化膜的拉伸强度和拉伸模量提高相同二氧化硅含量的无1,4-CHDA杂化膜。 PI中含有二氧化硅的脂环族部分的存在将介电常数显着降低至2.83，这低于原始PI的介电常数。版权所有（c）2016 John Wiley＆Sons，Ltd.

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