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首页> 外文期刊>Polymer engineering and science >Resin Transfer Molding (RTM) Process of a High Performance Epoxy Resin. I:Kinetic tudies of Cure Reaction
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Resin Transfer Molding (RTM) Process of a High Performance Epoxy Resin. I:Kinetic tudies of Cure Reaction

机译:高性能环氧树脂的树脂传递成型(RTM)工艺。 I:固化反应动力学

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摘要

The cure kinetics of a high performance PR500 epoxy resin in the temperature range of 160-197deg C for the resin transfer molding (RTM) process have been investigated. The thermal analysis of the curing kinetics of PR500 resin was carried out by differential scanning calorimetry (DSC), with the ultimate heat of reaction measured in the dynamic mode and teh rate of cure reaction and the degree of cure being determined under isothermal conditions. A modified Kamal's kinetic mdoel was adapted to describe the autocatalytic and diffusion-controlled curing behavior of the resin. A reasonable agreement between teh experimental data and the kinetic model has been obtained over the whole processing temperature range, including the mold filling and the final curing stages of the RTM process.
机译:已经研究了高性能PR500环氧树脂在160-197摄氏度的温度范围内用于树脂传递模塑(RTM)工艺的固化动力学。通过差示扫描量热法(DSC)对PR500树脂的固化动力学进行热分析,以动态模式测量反应的最终热量,并确定固化反应的速率,并在等温条件下确定固化程度。修改后的Kamal动力学模型适用于描述树脂的自催化和扩散控制的固化行为。在整个加工温度范围内,包括模具填充和RTM工艺的最终固化阶段,已获得了实验数据与动力学模型之间的合理协议。

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