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首页> 外文期刊>The journal of adhesive dentistry >Polymerization kinetics of dual-curing adhesive systems when used solely or in conjunction with chemically-cured resin cement.
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Polymerization kinetics of dual-curing adhesive systems when used solely or in conjunction with chemically-cured resin cement.

机译：单独使用或与化学固化树脂胶结剂一起使用时，双固化胶粘剂系统的聚合动力学。

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摘要

To investigate the chemical polymerization kinetics of commercial dual-curing adhesive systems when used solely or in conjunction with chemically-curing resin cement.Four adhesive systems comprising simplified-step adhesives and activators (Prime&Bond NT with Self Cure Activator, Excite DSC, AQ Bond Plus, All-Bond SE) were used. The pH values of the adhesives and adhesive/activator blends were measured. Differential scanning calorimetry (DSC) was used to investigate the extent of the chemical polymerization of the adhesives when used alone or directly intermixed with a chemically-cured resin cement (C&B Cement) for 60 min (n = 5). The data derived from the DSC analysis were statistically compared using one-way ANOVA and the Games-Howell post-hoc test (α = 0.05).All the adhesives were highly acidic; when they were blended with the respective activators, their pH values increased. Neither the adhesive/activator blends nor the adhesive alone/cement mixtures showed any detectable heat generation. The Prime&Bond NT/activator showed delayed heat generation only when intermixed with the catalyst/base paste. The other three adhesive systems produced similar exotherms when intermixed with the catalyst paste alone or with the catalyst/base paste (p > 0.05), but at significantly different maximum rates of polymerization (p < 0.05). Significantly shorter induction periods resulted when AQ Bond Plus and All- Bond SE were intermixed with the catalyst/base paste rather than with the catalyst paste alone (p = 0.004).The chemical polymerization occurring at the adhesive system/resin cement interface appears highly dependent on the adhesive system used and may be considerably delayed.
机译：单独使用或与化学固化树脂胶粘剂一起使用时，研究商业双固化胶粘剂系统的化学聚合动力学。四种胶粘剂系统，包括简化步骤的胶粘剂和活化剂（Prime＆Bond NT和Self Cure Activator，Excite DSC，AQ Bond Plus ，使用All-Bond SE）。测量粘合剂和粘合剂/活化剂混合物的pH值。差示扫描量热法（DSC）用于研究粘合剂单独使用或与化学固化树脂水泥（C＆B Cement）直接混合60分钟（n = 5）时的化学聚合程度。使用单向方差分析和Games-Howell事后测试（α= 0.05）对DSC分析得出的数据进行统计比较。当它们与各自的活化剂混合时，它们的pH值增加。粘合剂/活化剂混合物或单独的粘合剂/水泥混合物均未显示任何可检测到的发热。 Prime＆Bond NT /活化剂仅在与催化剂/基础糊剂混合时才会显示出延迟的热量生成。当单独与催化剂糊料或与催化剂/基础糊料混合时，其他三种粘合剂体系会产生相似的放热（p> 0.05），但最大聚合速率存在显着差异（p <0.05）。当将AQ Bond Plus和All-Bond SE与催化剂/基础糊料混合而不是单独与催化剂糊料混合时，诱导期明显缩短（p = 0.004）。在粘合剂体系/树脂水泥界面处发生的化学聚合反应高度依赖在所使用的胶粘剂体系上使用，可能会大大延迟。

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