Fabrication of multiwalled carbon nanotubes-reinforced Sn nanocomposites for lead-free solder by an electrodeposition process

E.K. Choi; K.Y. Lee; T.S. Oh

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Fabrication of multiwalled carbon nanotubes-reinforced Sn nanocomposites for lead-free solder by an electrodeposition process

机译：通过电沉积工艺制备用于无铅焊料的多壁碳纳米管增强的Sn纳米复合材料

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Electrodeposition behavior of a Sn–carbon nanotube (CNT) composite was investigated with variations of an electrodeposition time and a current density. Electrodeposition of the Sn–CNT composite could be suggested as repeating processes of Sn layer formation, CNT adsorption, and entrapment of CNTs into the Sn matrix. With increasing the CNT concentration in an electrodeposition solution to 10 g/l, the shear energy of the Sn–CNT composite bumps increased more than 50%, indicating that the mechanical reliability of the solder joints can be substantially improved by using a composite solder reinforced with CNTs.

机译：用电沉积时间和电流密度的变化研究了Sn-碳纳米管（CNT）复合材料的电沉积行为。 Sn-CNT复合材料的电沉积可以作为重复的Sn层形成，CNT吸附以及CNT截留到Sn基体中的过程提出。随着电沉积溶液中CNT浓度增加到10 g / l，Sn-CNT复合凸点的剪切能增加了50％以上，这表明通过使用复合焊料增强材料可以显着提高焊点的机械可靠性。与碳纳米管。

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《The journal of physics and chemistry of solids》 |2008年第6期|共4页
作者
E.K. Choi; K.Y. Lee; T.S. Oh;
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正文语种 eng
中图分类固体物理学;
关键词
A. Alloys; B. Chemical synthesis; C. Electron microscopy;

机译：A.合金;B。化学合成;C。电子显微镜;

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1. Fabrication of multiwalled carbon nanotubes-reinforced Sn nanocomposites for lead-free solder by an electrodeposition process [J] . E.K. Choi, K.Y. Lee, T.S. Oh The journal of physics and chemistry of solids . 2008,第5a6期

机译：通过电沉积工艺制备用于无铅焊料的多壁碳纳米管增强的Sn纳米复合材料
2. Effect of reinforced multiwall carbon nanotubes on the damping characteristics of Sn-Ag-Cu lead-free solder [J] . Chang Shih-Hang, Wu Shyi-Kaan, Kuo Chin Materials Letters . 2020,第Octa1期

机译：增强多壁碳纳米管对Sn-Ag-Cu无铅焊料阻尼特性的影响
3. Nanocomposite Based on Modified Multiwalled Carbon Nanotubes: Fabrication by an Oriented Spinning Process and Electrical Conductivity [J] . A. A. Babaev, P. P. Khokhlachev, Yu. A. Nikolaev, Inorganic materials . 2012,第10期

机译：基于修饰的多壁碳纳米管的纳米复合材料：定向纺丝工艺和电导率的制造。
4. THE INFLUENCE OF THE PWB FABRICATION ELECTRODEPOSITION PROCESS ON COPPER EROSION DURING WAVE SOLDERING SECOND REPORT, 4 LEAD-FREE ALLOYS [C] . Chrys Shea, Jim Kenny, Jean Rasmussen, SMTA international conference . 2008

机译：4种无铅合金波峰焊第二次报告中PWB制备工艺对铜腐蚀的影响
5. Mechanisms of Deformation of Lead-Free Sn-Ag-Cu Solder Joints in Cycling [D] . Alghoul, Thaer M. 2019

机译：无铅锡-银-铜焊点在循环中的变形机理
6. Optimal Hot-Dipped Tinning Process Routine for the Fabrication of Solderable Sn Coatings on Circuit Lead Frames [O] . Ting Yin, Nan Xiang, Guangxin Wang, 2020

机译：在电路引线框架上制造可焊锡涂层的最佳热浸镀锡工艺程序
7. Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation [O] . Mohd Yusof, Sakinah, Hadi, Abdul, Jai, Junaidah 2013

机译：电沉积开发的纳米结构无铅锡合金Sn-Ag-Cu的表面形态研究：电流密度研究的影响

Fabrication of multiwalled carbon nanotubes-reinforced Sn nanocomposites for lead-free solder by an electrodeposition process

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