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首页> 外文期刊>Surface Engineering and Applied Electrochemistry >INFLUENCE OF SURFACE THERMOEVOLUTION ON THE CHROMIUM PLATING RATE IN PULSED ELECTRODEPOSITION FROM THE STANDARD ELECTROLYTE
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INFLUENCE OF SURFACE THERMOEVOLUTION ON THE CHROMIUM PLATING RATE IN PULSED ELECTRODEPOSITION FROM THE STANDARD ELECTROLYTE

机译：标准电解质在脉冲电沉积中表面热演化对镀铬速率的影响

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We have studied experimentally the dependence of the chromium current efficiency (eta) on the various parameters of the pulsed current (the pulse duration tau_p, the pulse duty cycle q, the average current density i_(avg)) in working with the rectangular unipolar pulses (i_(avg) = 0.1-2.0 A/cm~2, tau_P = 0.1 -20 sec, q= 2-8) In the conditions of electrodeposition from the standard chromium electrolyte at T_0 = 50 deg C and monitoring the changes of the surface temperature. It is shown that in the studied range of the pulse durations and the current densities the increase of the surface temperature with increase of eta is a factor that influences the degree of the increase of 17 in the pulsed conditions and the dependence of the current efficiency on the current density. It is established that for the same average current density the surface temperature depends on the duration of the pulse (pause). We have detected a dimensional chrome plating rate effect (the dependence of the chromium current efficiency on the dimensions of the electrode surface) -which is a consequence of the surface heat evolution.
机译：我们已经通过实验研究了在矩形单极脉冲下铬电流效率（eta）对脉冲电流各种参数（脉冲持续时间tau_p，脉冲占空比q，平均电流密度i_（avg））的依赖性。 （i_（avg）= 0.1-2.0 A / cm〜2，tau_P = 0.1 -20 sec，q = 2-8）在标准铬电解质在T_0 = 50℃下电沉积并监测电极的变化的条件下表面温度。结果表明，在所研究的脉冲持续时间和电流密度范围内，表面温度随eta的增加而增加，是影响脉冲条件下17的增加程度以及电流效率对e的依赖性的一个因素。当前的密度。已经确定，对于相同的平均电流密度，表面温度取决于脉冲的持续时间（暂停）。我们已经检测到尺寸镀铬速率效应（铬电流效率对电极表面尺寸的依赖性），这是表面放热的结果。

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