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首页> 外文期刊>High performance polymers >2,3,3,4-Oxydiphthalic dianhydride-based phenylethynyl-terminated imide oligomers for low-temperature resin transfer molding applications
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2,3,3,4-Oxydiphthalic dianhydride-based phenylethynyl-terminated imide oligomers for low-temperature resin transfer molding applications

机译：2,3,3,4-氧邻苯二甲酸二酐基苯基乙炔基封端的酰亚胺低聚物，用于低温树脂传递模塑应用

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摘要

A series of imide resins were prepared using 2,3,3,4-oxydiphthalic dianhydride, 4-phenylethynylphthalic anhydride, and aromatic diamines (1, 3-bis(3-aminophenoxy), 3,4-oxyaniline, 2,2-bis (trifluoromethyl) benzidine, and m-phenylenediamine) as starting materials. These imide oligomers were characterized by means of Fourier transform infrared spectroscopy, differential scanning calorimetry, intrinsic viscosity measurements, and rheological measurements. Some of these oligomers exhibited low (<1 Pas at 250 degrees C) and stable (>2 h at 250 degrees C) melt viscosity, which was highly desirable for resin transfer molding process. Thermosetting polyimides (PIs) were then produced from these oligomers via thermal cross-linking reaction of phenylethynyl group. The properties of the thermosets were studied using tensile and flexural testing, dynamic mechanical thermal analysis, and thermogravimetric analysis. The cured PIs exhibited a good combination of thermal and mechanical properties, with a tensile strength of 31-76 MPa, flexural strength of 38-142 MPa, glass transition temperatures of 233-358 degrees C, and 5% weight loss temperatures of 540-545 degrees C under nitrogen atmosphere.
机译：使用2,3,3,4-氧基二邻苯二甲酸二酐，4-苯基乙炔基邻苯二甲酸酐和芳族二胺（1，3-双（3-氨基苯氧基），3,4-氧基苯胺，2,2-双）制备一系列酰亚胺树脂（三氟甲基）联苯胺和间苯二胺）作为起始原料。这些酰亚胺低聚物通过傅立叶变换红外光谱，差示扫描量热法，特性粘度测量和流变学测量来表征。这些低聚物中的一些表现出较低的熔融粘度（在250℃时<1 Pa s）和稳定的熔融粘度（在250℃时> 2 h），这对于树脂传递模塑工艺是非常需要的。然后通过苯基乙炔基的热交联反应，由这些低聚物制备热固性聚酰亚胺（PI）。使用拉伸和弯曲测试，动态机械热分析和热重分析研究了热固性塑料的特性。固化的PI表现出热性能和机械性能的良好组合，拉伸强度为31-76 MPa，弯曲强度为38-142 MPa，玻璃化转变温度为233-358℃，5％失重温度为540-在氮气氛下为545℃。

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