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首页> 外文期刊>Zeitschrift fur Angewandte Mathematik und Mechanik >CRACK PROPAGATION PROCESSES IN THERMOMECHANICALLY LOADED BIMATERIALS - ANALYSIS AND EXPERIMENT [Review] [German]
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CRACK PROPAGATION PROCESSES IN THERMOMECHANICALLY LOADED BIMATERIALS - ANALYSIS AND EXPERIMENT [Review] [German]

机译:热机械加载的生物中的裂纹扩展过程-分析和实验[评论] [德语]

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摘要

In this paper a review is given about the fracture mechanical investigation of the thermal crack initiation and propagation in one of the segments or in the material interface of two- and three-dimensional self-stressed bimaterial structures. The resulting boundary value problems of the stationary thermoelasticity for uncracked and cracked 2-D and 3-D two-phase compounds are solved by means of Muskhelishvili's method of complex potentials as well as of the finite element method. In the case of 2-D bimaterial specimens orthogonal sets of principal stress trajectories could be obtained in the corresponding cross sections, characterizing the self-stress fields in the associated two-phase compounds. Further, by applying an appropriate crack growth criterion based on the numerical calculation of the total energy release rate of a quasistatic mixed-mode crack extension the further development of thermal crack paths starting at the intersection line of the material interface with the external stress-free surface of 2-D and 3-D bi materials could be predicted. In case of the disk-like two-phase compounds the theoretically predicted crack paths show a very good agreement with results gained by associated cooling experiments. Several specimen geometries consisting of different material combinations and subjected to uniform as well as non-uniform temperature distributions have been investigated by applying the relevant methods of fracture mechanics. Thereby it could be stated that thermal cracks propagating in one segment of a bimaterial only obey the rule G(II) = 0, whereas for interface cracks a mixed-mode propagation is always existent where the Gn values play an important role. Moreover, by applying the proposed crack growth criterion the possible crack kinking direction theta* of an interface crack tip out of the interface could be predicted under the consideration, of the finite thickness of an interlayer (interphase). Furthermore. the influences of three-dimensional effects on the thermal crack propagation in axialsymmetrical bimaterial structures have been studied by means of this crack growth criterion as well as by using the finite element method. The numerical results show some remarkable differences between. 2-D and 3-D bimaterials concerning the ther mal crack paths as well as the associated fracture mechanical parameters. [References: 145]
机译:在本文中,对二维自应力双材料结构的一个片段或材料界面中的热裂纹萌生和扩展的断裂力学研究进行了综述。通过Muskhelishvili复势方法以及有限元方法解决了未裂化和裂化的2-D和3-D两相化合物的稳态热弹性的边值问题。在二维双材料试样的情况下,可以在相应的横截面中获得正交的主应力轨迹集,从而表征了相关两相化合物中的自应力场。此外,通过基于准静态混合模式裂纹扩展的总能量释放速率的数值计算应用适当的裂纹扩展准则,热裂纹路径的进一步发展始于材料界面与无外部应力的交点处可以预测2-D和3-D bi材料的表面。在盘状两相化合物的情况下,理论上预测的裂纹路径与相关冷却实验获得的结果非常吻合。通过采用相关的断裂力学方法,已经研究了几种由不同材料组合组成,经受均匀和不均匀温度分布的试样几何形状。因此可以说,在双材料的一个区段中传播的热裂纹仅遵循规则G(II)= 0,而对于界面裂纹,在Gn值起重要作用的情况下始终存在混合模式传播。此外,通过应用所提出的裂纹扩展准则,可以在考虑到中间层的有限厚度(相间)的情况下,预测出界面裂纹尖端的可能的界面弯曲尖端方向θ*。此外。利用这种裂纹扩展准则以及有限元方法研究了三维效应对轴向对称双材料结构中热裂纹扩展的影响。数值结果表明两者之间存在一些显着差异。关于热裂纹路径以及相关断裂力学参数的2-D和3-D双材料。 [参考:145]

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