Electrochemistry of the SUCOPLATE electroplating bath for the deposition of a Cu-Zn-Sn alloy Part I: Commercial bath

L. Picincu; D. Pletcher; A. Smith

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Electrochemistry of the SUCOPLATE electroplating bath for the deposition of a Cu-Zn-Sn alloy Part I: Commercial bath

机译：用于沉积Cu-Zn-Sn合金的SUCOPLATE电镀液的电化学第一部分：商用液

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The deposition of a Cu-Zn-Sn alloy from a commercial alkaline cyanide electroplating bath operated at 333 K has been investigated using voltammetric techniques and electron microscopy. It is shown that a highly reflecting alloy deposit with a composition in the range 47-51% copper, 8-12% zinc and 38-43% tin can be produced under a range of conditions. In addition, it is concluded that the rate of alloy deposition is partially limited by mass transport and partially by the kinetics of reactions in homogeneous solution.

机译：已经使用伏安技术和电子显微镜研究了从在333 K下运行的商业碱性氰化物电镀浴中沉积Cu-Zn-Sn合金的方法。结果表明，在一定条件下可以生产组成在47-51％的铜，8-12％的锌和38-43％的锡范围内的高反射率合金镀层。此外，可以得出结论，合金的沉积速率部分受传质限制，部分受均相溶液中反应的动力学限制。

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《Journal of Applied Electrochemistry》 |2001年第4期|共8页
作者
L. Picincu; D. Pletcher; A. Smith;
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正文语种 eng
中图分类电化学工业;物理化学（理论化学）、化学物理学;
关键词
alloy deposition; bath components; Ci-Zn-Sn; electroplating;

机译：合金沉积;镀液成分;Ci-Zn-Sn;电镀;

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1. Electrochemistry of the SUCOPLATE electroplating bath for the deposition of a Cu-Zn-Sn alloy Part I: Commercial bath [J] . L. Picincu, D. Pletcher, A. Smith Journal of Applied Electrochemistry . 2001,第4期

机译：用于沉积Cu-Zn-Sn合金的SUCOPLATE电镀液的电化学第一部分：商用液
2. Establishing relationships between bath chemistry, electrodeposition and microstructure of Co-W alloy coatings produced from a gluconate bath [J] . D. P. Weston, S. J. Harris, P. H. Shipway, Electrochimica Acta . 2010,第20期

机译：建立镀液中的Co-W合金镀液的镀液化学性质，电沉积和微观结构之间的关系
3. Electrodeposition and characterization of zinc–nickel–iron alloy from sulfate bath: influence of plating bath temperature [J] . M. M. Abou-Krisha, F. H. Assaf, S. A. El-Naby Journal of Solid State Electrochemistry . 2009,第6期

机译：硫酸盐浴中锌镍铁合金的电沉积和表征：镀浴温度的影响
4. Nickel deposition on Pre-Electroless Plated Ni-P-B Coating on Quartz Optical Fiber in a Lanthanide oxide-Added Watt Electroplating Bath [C] . Boquan Jiang, Jiangnan Zeng, Yude Liu, International Conference on Manufacturing Science and Engineering . 2011

机译：在镧系元素氧化物氧化铝电镀浴中石英光纤上预电镀镀Ni-P-B涂层的镍沉积
5. Microscopic and spectroscopic investigation of: I. Copper-additive systems in electroplating bath. II. Supported phospholipid bilayer systems. [D] . Feng, Zengqi Vivian. 2005

机译：显微镜和光谱学研究：I.电镀液中的铜添加剂系统。二。支持的磷脂双层系统。
6. Electroplating and magnetostructural characterization of multisegmented Co54Ni46/Co85Ni15 nanowires from single electrochemical bath in anodic alumina templates [O] . Victor M Prida, Javier García, Lucia Iglesias, 2013

机译：阳极氧化铝模板中来自单个电化学浴的多段Co54Ni46 / Co85Ni15纳米线的电镀和磁结构表征
7. Study on Electroplating of Palladium-Nickel Alloy from Ethylenediamine Bath. I. Study by Potentiostatic Electroplating. [O] . Morio MATSUNAGA, Toshihisa HARA, Ablet ABLIMIT, 1992

机译：乙二胺浴钯 - 镍合金电镀研究。 I.电位电镀电镀研究。
8. Application of electrodialysis to extend the lifetime of commercial electroplating baths [R] . Purdy, G. , Zawodzinski, C. , Smith, B. , 1993

机译：应用电渗析延长商用电镀浴的使用寿命

Electrochemistry of the SUCOPLATE electroplating bath for the deposition of a Cu-Zn-Sn alloy Part I: Commercial bath

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