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首页> 外文期刊>Journal of Applied Electrochemistry >Kinetics of molecular oxygen electroduction on platinum modified by tin underpotential deposition
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Kinetics of molecular oxygen electroduction on platinum modified by tin underpotential deposition

机译:锡不足位沉积修饰的铂上分子氧电化学反应动力学

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摘要

The kinetics of molecular oxygen electroreduction were studied on platinum surfaces modified by tin underpotential deposition. The surface process was analysed by cyclic voltammetry in aqueous 10~(-4) M tin(II)/1 M sulfuric acid in the 0.05 to 0.70 V vs RHE range. Platinum sites involving (1 1 0) planes are mainly related to tin underpotential deposition as observed in the hydrogen sorption region. Kinetic runs for oxygen reduction were performed with the rotating ring-disc electrode technique on tin-modified platinum surfaces. It was concluded that molecular oxygen reduction on tin-modified platinum takes place through bulk hydrogen peroxide and water formation. This interpretation was confirmed by calculating the reaction order with respect to oxygen. Electrochemical rate constants for oxygen reduction pathways were calculated as a function of deposition potential based on Damjanovic's reaction scheme.
机译:研究了通过锡欠电位沉积改性的铂表面上分子氧电还原的动力学。通过循环伏安法在相对于RHE范围为0.05至0.70 V的10〜(-4)M锡(II)/ 1 M硫酸水溶液中分析表面过程。如在氢吸附区域中观察到的,涉及(1 1 0)平面的铂位主要与锡的欠电位沉积有关。用旋转圆盘电极技术在锡改性的铂表面上进行了氧还原的动力学实验。结论是锡修饰的铂上的分子氧还原是通过大量的过氧化氢和水的形成而发生的。这种解释是通过计算相对于氧气的反应顺序来证实的。氧还原途径的电化学速率常数根据Damjanovic的反应方案计算为沉积电位的函数。

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