• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of Applied Polymer Science >A novel low-melting-point alloy-loaded polymer composite. I. Effect of processing temperature on the electrical properties and morphology
【24h】

A novel low-melting-point alloy-loaded polymer composite. I. Effect of processing temperature on the electrical properties and morphology

机译：一种新型的低熔点合金负载聚合物复合材料。一，加工温度对电性能和形貌的影响

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Sn-Pb alloy-loaded polystyrene (PS) composites were processed by powder mixing and hat pressing. For the composites hot-pressed at the temperatures below the melting point of the alloy, the resistivity dropped sharply if the alloy volume fraction reached 20 vol %. When the composites were processed at temperatures above the melting point, such phenomenon disappeared According to the SEM and energy dispersive analysis X-ray (EDAX) analyses, the size and dispersion of Sn-Pb alloy particles in composites changed when the hot-pressing temperature reached the melting point of the alloy, which resulted in the different forms of resistivity-filler volume fraction curves. (C) 2000 John Wiley & Sons, Inc. [References: 16]
机译：Sn-Pb合金负载的聚苯乙烯（PS）复合材料通过粉末混合和帽子压制进行处理。对于在低于合金熔点的温度下热压的复合物，如果合金体积分数达到20体积％，则电阻率急剧下降。当复合材料在高于熔点的温度下加工时，这种现象消失了。根据SEM和能量色散分析X射线（EDAX）分析，当热压温度升高时，复合物中Sn-Pb合金颗粒的尺寸和分散性发生了变化。达到合金的熔点，导致电阻率-填料体积分数曲线的形式不同。 （C）2000 John Wiley＆Sons，Inc. [参考：16]

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号