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首页> 外文期刊>Journal of Applied Polymer Science >Effect of Copper on the Curing and Structure of a DICY-Containing Epoxy Composite System
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Effect of Copper on the Curing and Structure of a DICY-Containing Epoxy Composite System

机译：铜对含DICY的环氧树脂复合体系固化和结构的影响

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摘要

The curing and structure of an epoxy system containing dicyandiamide (DICY)as hardener were studied as a function of temperature and the presence or absence of copper with the use of differential scanning calorimetry (DSC)and Fourier transform infrared spectroscopy in photoacoustic mode (FTIR-PAS).Spectroscopic analysis of specimens taken from the DSC helped to clarify the reaction mechanism in terms of the different schemes that have been proposed.The initial stages, corresponding to the first peak in the DSC exotherm, involve the usual epoxide-amine reactions closely followed by a reaction between DICY nitrile groups and hydroxyl groups to form structures containing iminoether and urea groups. The ese reactions are slightly retarded in the presence of copper.At higher temperatures,corresponding to the second peak in the exotherm,these structures are transformed into others believed to contain urethane ester groups. This reaction,which may be considered toconstitute a form of degradation,is significantly accelerated in the presence of copper.The effect is particularly large around 180deg C, a temperature commonly used to cure such systems,so the results have important practical implications,for example,in the lamination of circuit boards.
机译：使用差示扫描量热法（DSC）和傅里叶变换红外光谱以光声模式（FTIR-）研究了含双氰胺（DICY）作为固化剂的环氧体系的固化和结构与温度以及铜的存在与否的关系。从DSC提取的样品的光谱分析有助于根据已提出的不同方案阐明反应机理。初始阶段（对应于DSC放热中的第一个峰）涉及通常的环氧化物-胺反应然后DICY腈基与羟基反应形成含有亚氨基醚和脲基的结构。在铜的存在下，这些反应略有延迟。在较高的温度下，对应于放热中的第二个峰，这些结构被转化为其他被认为含有氨基甲酸酯基团的结构。在铜的存在下，该反应可能被认为是降解的一种形式，其反应明显加快。在通常用于固化此类系统的温度180°C左右，此影响特别大，因此该结果具有重要的实际意义，例如在电路板的层压中。

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