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On Oxidation and Adhesion of Copper-Filled PE

机译:铜填充聚乙烯的氧化与黏附

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摘要

The IR-spectroscopy and MVCIR technique were used to study the role of technological factors (filler content, film thickness) in oxidation of polyethylene coatings filled with copper powder. It was learned that copper powder introduced into polyeth- ylene reduces the ultimate level of oxidation of both the outer surface layer and deep-seated layers of the polymer; also, the layer thickness of the specimens oxidized at diffusion conditions was observed to be decreased. Besides, the oxidation gradient determined through the specimen thickness was decreased on increasing the filler content. For example, with copper concentration over 3 vol %, the ultimate level of oxidation within the polymer layer that undergoes diffusive oxidation remains un- , changed. The filler exerts its influence on bonding of the coatings, first of all through !ii variations in the oxidation level of the polymer layer bordering on the substrate. For example, at the filler concentration above 3 vol %, the achievable level of adhesional strength does not depend on the coat thickness (the coat thickness being smaller than that of the diffusively oxidized layer). In thicker coatings, oxidative transformations do '.- not, in fact, take place in the zone of adhesional contact, and the adhesion strength ~ remains unchanged during thermal treatment.
机译:红外光谱和MVCIR技术用于研究工艺因素(填料含量,膜厚)在填充铜粉的聚乙烯涂层氧化中的作用。据了解,引入聚乙烯的铜粉可降低聚合物外表面层和深层聚合物的最终氧化水平。另外,观察到在扩散条件下氧化的样品的层厚度减小。此外,随着样品含量的增加,通过试样厚度确定的氧化梯度会降低。例如,当铜浓度超过3体积%时,经历扩散氧化的聚合物层内的最终氧化水平保持不变。填料首先通过与基底邻接的聚合物层的氧化水平的变化来对涂层的粘结施加影响。例如,当填充剂浓度高于3体积%时,可达到的粘合强度水平不取决于涂层厚度(涂层厚度小于扩散氧化层的涂层厚度)。实际上,在较厚的涂层中,氧化转化不会发生-在粘合接触区域中不会发生,并且粘合强度在热处理过程中保持不变。

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