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首页> 外文期刊>Journal of Applied Polymer Science >Simulations on structure performance of 3C thin-wall injection-molded parts
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Simulations on structure performance of 3C thin-wall injection-molded parts

机译：3C薄壁注塑件结构性能仿真

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Manufacturing of 3C (Computer, Communication, and Consumer Electronics) products toward weight reduction, thin-wall, and minified-size is an inescapable trend for the future 3C industries. However, the induced damage information from drop impact, including exterior housing fracture, liquid crystal display (LCD) cracking, solder-joint breaking, or interior component failure, is still derived experimentally and involves very complicated parametric analyses, such as a dynamic impact process, drop orientation, contact behavior, and large deformation during the impact instance. In the present study, numerical simulations for the drop test and bending strength were applied to a thin-wall computer dictionary (Model CD-66) housing to understand the key factors that affect the part drop test performance. The appropriate modeling that would affect simulation accuracy as well as the associated nodal degree of freedom and computer time were also investigated. A housing of CD-66 was redesigned to be 1 mm thick and structurally verified with two different plastics: polycarbonate (PC) and acrylonitrile butadiene styrene (ABS). The simplification of the PC board and LCD backlight circuit in finite element modeling (FEM) only causes about a 10% difference, while saving many modeling costs. The numerical simulations also indicate that both its bending strength and drop-impact strength were decreased only about 5%, whereas the product quality still met its strength requirement if only the top housing plate thickness was reduced while the remaining sidewall thickness was kept unchanged. (C) 2002 Wiley Periodicals, Inc. [References: 11]
机译：朝着减轻重量，薄壁和缩小尺寸的方向发展3C（计算机，通信和消费电子）产品是未来3C行业不可回避的趋势。但是，跌落冲击引起的损坏信息，包括外壳破裂，液晶显示器（LCD）破裂，焊点断裂或内部组件故障，仍然是通过实验得出的，并且涉及非常复杂的参数分析，例如动态冲击过程，跌落方向，接触行为以及在碰撞实例中的大变形。在本研究中，将跌落试验和弯曲强度的数值模拟应用于薄壁计算机词典（CD-66型）外壳，以了解影响零件跌落试验性能的关键因素。还研究了会影响仿真精度以及相关的节点自由度和计算机时间的适当建模。将CD-66的外壳重新设计为1毫米厚，并使用两种不同的塑料在结构上进行了验证：聚碳酸酯（PC）和丙烯腈丁二烯苯乙烯（ABS）。有限元建模（FEM）中PC板和LCD背光灯电路的简化仅造成约10％的差异，同时节省了许多建模成本。数值模拟还表明，其弯曲强度和跌落冲击强度都仅降低了约5％，而如果仅减小顶部外壳板的厚度而保持其余侧壁的厚度不变，则产品质量仍满足其强度要求。 （C）2002 Wiley Periodicals，Inc. [参考：11]

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