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首页> 外文期刊>Journal of Applied Polymer Science >Synthesis, Characterization, Thermal and Flame-Retardant Properties of Silicon-Based Epoxy Resins
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Synthesis, Characterization, Thermal and Flame-Retardant Properties of Silicon-Based Epoxy Resins

机译：硅基环氧树脂的合成，表征，热学和阻燃性能

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摘要

A new silicon-containing oxirane triglycidyl phenyl silane oxide (TGPSO) and its corresponding silicon-containing epoxy resins are synthesized and characterized. The activation energiesof TGPSO curing reaction with various curing agents, including 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylsulfone, and dicyanodiaminde, are found to be 180, 196.5, and 154 kJ/mol. The curing reaction of TGPSO with diamines is determined to be a first-order reaction through means of Arrhenius plots. The introduction of the silicon-containing group results in higher curing reactivity. This silicon-containing resin possesses higher char yield as well higher limiting oxygen index (LOI = 35) than the commercial epoxy resins, confirming the suefulness of these silicon-containing epoxy resins as flame retardants. Char yields and LOI measure-ments demonstrate that incorporating silicon into epoxy resins is able to improve their flame retardancy.
机译：合成并表征了一种新型的含硅环氧乙烷三缩水甘油基苯基硅烷氧化物（TGPSO）及其相应的含硅环氧树脂。发现TGPSO与包括4,4-二氨基二苯甲烷，4,4-二氨基二苯砜和双氰胺的各种固化剂的固化反应的活化能为180、196.5和154kJ / mol。通过Arrhenius图确定TGPSO与二胺的固化反应是一级反应。含硅基团的引入导致更高的固化反应性。与商业环氧树脂相比，这种含硅树脂具有更高的炭收率和更高的极限氧指数（LOI = 35），证实了这些含硅环氧树脂作为阻燃剂的适用性。炭收率和LOI测量表明，将硅掺入环氧树脂能够提高其阻燃性。

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