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首页> 外文期刊>Journal of Applied Polymer Science >UV curable pressure-sensitive adhesives for fabricating semiconductors. I. Development of easily peelable dicing tapes
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UV curable pressure-sensitive adhesives for fabricating semiconductors. I. Development of easily peelable dicing tapes

机译：用于制造半导体的UV固化压敏胶。一，易剥离切割带的研制

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In order to develop easily peelable dicing tapes from diced wafers, UV curing of various pressure-sensitive adhesives (PSAs) was studied. After UV irradiation, the adhesive strength of a PSA composition including a diacrylourethane oligomer (UDA) decreased drastically compared with other compositions. Because of network formation via UV irradiation, this composition had a greater volume contraction that might yield microvoids at the interface between the adhesive and the wafer, resulting in the loose adhesion. Its storage modulus increased up to about 1000 times that before UV curing, which was due to the crosslinking of the UDA component. It was suggested that the increased crosslinking density and the high internal coagulant energy of the UDA backbone structure caused a remarkable decrease of the adhesive strength. Furthermore, it was ascertained that the UV-irradiated UDA adhesives left few residual deposits on the wafer released from the tape. (C) 2003 Wiley Periodicals, Inc. [References: 7]
机译：为了从切成薄片的晶片开发容易剥离的切割带，研究了各种压敏胶粘剂（PSA）的UV固化。紫外线照射后，与其他组合物相比，包含二丙烯酸氨基甲酸酯低聚物（UDA）的PSA组合物的粘合强度急剧降低。由于通过紫外线照射形成网络，因此该组合物具有更大的体积收缩率，这可能在粘合剂和晶圆之间的界面处产生微孔，从而导致松散的粘合。由于UDA组分的交联，其储能模量增加了至UV固化前的约1000倍。有人提出，增加的交联密度和UDA主链结构的高内部凝结能导致粘合强度显着下降。此外，可以确定的是，紫外线辐照的UDA粘合剂在从胶带剥离的晶片上几乎没有残留的沉积物。 （C）2003 Wiley Periodicals，Inc. [参考：7]

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