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MODIFICATION OF POLYARALKYL-PHENOLIC RESIN AND ITS COPOLYMER WITH BISMALEIMIDE

机译:聚对苯二甲酰亚胺对聚丙烯酸酯树脂及其共聚物的改性

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摘要

Polyaralkyl-phenolic resin, whose commercial name is Xylok, is in the class of high-performance resins, but its slow reactivity and brittleness limit its application in modern industry. Many efforts have been made to modify Xylok, but have not satisfactorily resolved these problems. In this paper, the authors employ allylization to improve properties of Xylok. The allyl Xylok can be thermally polymerized by itself or with bismaleimide (BMI) as a good comonomer. The reactivity of the allyl Xylok/BMI resin system was investigated by gel characteristics and differential scanning calorimetry (DSC). The thermal stability of the cured copolymer was evaluated by dynamic thermogravimetric analysis (TGA). No weight loss was observed when the copolymer was heated to 490-500 degrees C in a nitrogen atmosphere. The hot/wet resistance properties of the cured allyl Xylok/BMI resin were investigated by aging it in boiling water. After aging for 100 h, water absorption and heat deflection temperature (HDT) were 2.3% and 280 degrees C, respectively. The properties of the glass fiber reinforced compression molding materials (GCM) based on the copolymer of the allyl Xylok/BMI matrix resin system are also discussed. (C) 1996 John Wiley & Sons, Inc. [References: 6]
机译:商业名称为Xylok的聚芳烷基酚醛树脂属于高性能树脂,但其慢的反应性和脆性限制了其在现代工业中的应用。已经进行了许多修改Xylok的工作,但是还不能令人满意地解决这些问题。在本文中,作者采用烯丙基化来改善Xylok的性能。烯丙基Xylok可以本身或与双马来酰亚胺(BMI)作为良好的共聚单体进行热聚合。通过凝胶特性和差示扫描量热法(DSC)研究了烯丙基Xylok / BMI树脂体系的反应性。固化的共聚物的热稳定性通过动态热重分析(TGA)进行评估。当在氮气氛下将共聚物加热至490-500℃时,未观察到重量损失。通过在沸水中老化,研究固化的烯丙基Xylok / BMI树脂的耐热/耐湿性能。老化100小时后,吸水率和热变形温度(HDT)分别为2.3%和280摄氏度。还讨论了基于烯丙基Xylok / BMI基体树脂体系的共聚物的玻璃纤维增​​强压缩模塑材料(GCM)的性能。 (C)1996 John Wiley&Sons,Inc. [参考:6]

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